DPZ2MX16NN3 Search Results

Contextual Info: 32 Megabit FLASH EEPROM DPZ2MX16Nn3 DESCRIPTION: The DPZ2MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded

Contextual Info: „ ^ f[/ J}L I DENSE-PAC S* rty V 1v M I C R O S Y S T E M S 32 MEGABIT FLASH EEPROM \\ DPZ2MX16Nn3 PRELIMINARY D ESC RIPT IO N : The DPZ2MX16Nn3 “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: 32 Megabit FLASH EEPROM D E N S E - P A C MICROSYSTEMS DPZ2MX16Nn3 D ESC RIPTIO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded

DPZ1MX16n

Abstract: 30A117 DPZ1M
Contextual Info: DENSE-PAC 32 M EGABIT FLASH EEPROM MICROSYSTEMS DPZ2M X16Nn3 PRELIMINARY D E S C R IP T IO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded

DP5Z

Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS

Contextual Info: 32 Megabit FLASH EEPROM D PZ2M X16N n3 M I G R O S Y S T Ji M S DESCRIPTION: The D P Z 2 M X l6 N n 3 "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, " J " leaded or gullwing leaded