30A117 Search Results

Contextual Info: 16 Megabit FLASH EEPROM DPZ1MX16Nn3 D E S C R IP T IO N : The DPZ1MX16Nn3 "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, "J" leaded or gull wing leaded

Contextual Info: 32 Megabit FLASH EEPROM DPZ2MX16Nn3 DESCRIPTION: The DPZ2MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded

DPZ1MX16n

Abstract: 30A117 DPZ1M
Contextual Info: DENSE-PAC 32 M EGABIT FLASH EEPROM MICROSYSTEMS DPZ2M X16Nn3 PRELIMINARY D E S C R IP T IO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded

Contextual Info: DENSE-PAC MICROSYSTEMS 16 Megabit FLASH EEPROM DPZ1MX16Nn3 DESCRIPTION: T h e D P Z lM X 1 6 N n 3 " S T A C K " m o d u le s are a re vo lu tio n ary n e w m em ory subsystem u sin g D en se-P ac M icro syste m s' ce ra m ic Stackable L e a d le ss C h ip

Contextual Info: „ ^ f[/ J}L I DENSE-PAC S* rty V 1v M I C R O S Y S T E M S 32 MEGABIT FLASH EEPROM \\ DPZ2MX16Nn3 PRELIMINARY D ESC RIPT IO N : The DPZ2MX16Nn3 “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: 32 Megabit FLASH EEPROM D E N S E - P A C MICROSYSTEMS DPZ2MX16Nn3 D ESC RIPTIO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded

Contextual Info: 64 Megabit FLASH EEPROM M I G R O S Y S Ï JI M S D PZ4M W 16N n3 D E S C R IP T IO N : The DPZ4MW16Nn3 "STA C K" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded

Contextual Info: D E N S E - P A M J C R O S C Y S T E M 8 S M e s a b it f l a s h D P Z 1 M M 8 N Y / N I3 / N H 3 / N J 3 / D P Z 1 M X 8 N A 3 D E SC R IP T IO N : The DPZ1MM8NY/NI3/NH3/NJ3/DPZ1MX8NA3 "SLCC" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems'

Contextual Info: 64 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ4MW16Nn3 D ESCRIPTIO N : The D PZ4M W 16N n3 "STACK" modules are a revolutionary new memory subsystem using Dense-Pac M icrosystems' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded o r gullwing leaded

Contextual Info: 16 Megabit FLASH EEPROM DPZ1MX16Nn3 DESCRIPTION: The DPZ1MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded

Contextual Info: 32 Megabit FLASH EEPROM D PZ2M X16N n3 M I G R O S Y S T Ji M S DESCRIPTION: The D P Z 2 M X l6 N n 3 "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable LeadlessChip Carriers SLCC . Available in straight leaded, " J " leaded or gullwing leaded

DPZ1M

Contextual Info: 8 Megabit FLASH EEPROM D E N S E -P A C DPZ1MM8 NY/N 13/N H3/NJ 3/DPZ1MX8 NA3 MICROSYSTEMS D E S C R IP T IO N : The DPZ1M M 8N Y/N I3/N H 3/NJ3/DPZ1M X8N A3 " S L C C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC . Available unleaded,

Contextual Info: 8 Megabit FLASH EEPROM DPZ1MM8NY/NI3/NH3/NJ3/DPZ1MX8NA3 DESCRIPTION: The DPZ1MM8NY/NI3/NH3/NJ3/DPZ1MX8NA3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded,

1N914

Contextual Info: 64 Megabit FLASH EEPROM DPZ4MW16Nn3 DESCRIPTION: The DPZ4MW16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded