BGA40 Search Results

nec 2565

Abstract: 2565 nec JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7045-1 1521-PIN BGA40 BGA-404 4015 899-pin
Contextual Info: TRAY CONTAINER UNIT : mm 3x7=21 NEC 40.15 135°C MAX 7 A' 25.65 42.30 84.6 BGA40×40A 135.9 PPE A 40.15 42.30 30.60 253.8 315.0 322.6 SECTION A – A' (3.91) (6.35) 7.62 40.15 Applied Package Quantity (pcs) 899-pin Plastic BGA (40×40) (FLIP CHIP TYPE)

pitch 0.4mm BGA

Abstract: SF-BGA400A-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA400A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]

FR4 substrate with 0.762mm thickness

Abstract: BGA400F SF-BGA400F-B-11
Contextual Info: D Package Code: BGA400F C 0.635mm See BGA pattern code to the right for actual pattern layout Y 0.762mm 0.025" dia. pad X 24.13mm Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)

SF-BGA400B-B-11

Abstract: BGA-400 BGA400
Contextual Info: D Package Code: BGA400B 25.4mm C 24.13mm [0.950"] Ø 0.40mm [Ø 0.0156"] tooling hole x2 optional See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 1.27mm typ. [0.050"] X Top View (reference only) 0.64mm [0.025"] typ. 2 0.36mm [0.014"] dia.

SF-BGA408A-B-11

Contextual Info: D Package Code: BGA408A C 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad 31.75mm X Top View reference only 1.27mm [0.050"] 0.635mm 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)

IBM powerpc 405gp

Abstract: 405GP LA-BGA-405GP-S-B-01 TLA700
Contextual Info: Top View LA-BGA405GP-S-B-01 Drawing 1.5114" [38.391mm] 0.2163" [5.494mm] 3.3858" [86.000mm] Side View 1 0.6997" [17.772mm] Fully Plugged 2 1 2 3 3 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.

SF-BGA400E-B-11

Abstract: BGA-400
Contextual Info: D Package Code: BGA400E C 28.52mm [1.123"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 28.52mm [1.123"] X Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 1.5mm [0.059"] Ø 0.64mm pad [Ø 0.025"]

SF-BGA400D-B-11

Contextual Info: D Package Code: BGA400D C 30.48mm [1.200"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 30.48mm [1.200"] X 1.27mm typ. [0.050"] Top View reference only 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

BGA400

Contextual Info: Package outline BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x

BGA400

Abstract: MO-034 sot901 BGA-400
Contextual Info: Package outline Philips Semiconductors BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y Y W e V U T R P N M L e2 K J 1/2 e H G

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

mt 1389 de

Abstract: MLC 8050 Transistor mlc 8050 IC01 -P10 Replace philips tea 1090 8*8 led dot MATRIX Driver i2c tea 1601 t MDT 1692 LT 542 seven segment display data sheet mt 1389
Contextual Info: REJ09B0360-0100 32 SH7764 Group Hardware Manual Renesas 32-Bit RISC Microcomputer SuperHTM RISC Engine Family SH-4A Series SH77641 SH77640 Rev.1.00 Revision Date: Nov. 22, 2007 R5S77641 R5S77640 Rev. 1.00 Nov. 22, 2007 Page ii of lvi Notes regarding these materials

GEMINAX-L2

Abstract: adsl2
Contextual Info: Product Brief Lantiq GEMINAX™ XXS V3 Ultra-small, low-power, high-density ADSL2+ chipset for broadband linecard applications Applications • Multi-standard ADSL2+ DSLAM, DLC, MSAN linecards for Central Office and MDU applications Features • Supported Standards

Manchester CODING DECODING FPGA

Abstract: iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

BA100 diode

Abstract: BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode
Contextual Info: KADxx0300B - Txxx MCP MEMORY Document Title Multi-Chip Package MEMORY 128M Bit Two Dual Bank 64M Bit NOR Flash Memory / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark August 9, 2002 Preliminary 0.0 Initial Draft 0.1 Revised (UtRAM)

SMR 40000c

Abstract: MMC760 la 4763 AT91CAP7 AT91CAP9 AT24LC toshiba NAND Flash memory controller ecc 6264B k 2996 4b1 toshiba
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz

atmel part marking c16

Abstract: AC97 ARM926EJ-S AT91CAP9S250A AT91CAP9S500A ISO7816 Manchester CODING DECODING FPGA
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz

BA107

Abstract: ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941
Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

TB 1226 BN

Abstract: TB GUA 5365 MATERIAL TB GUA 5365 MATERIAL NEOPRENE E-23018 tb 1229 bn sj 2258 emp 5523 ASTM A123 galvanized iron thermal conductivity UL514
Contextual Info: 412031.A01 FIT 3/12 3/20/03 3:02 PM Page 1 A Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A2 Tables and Specifications . . . . . . . . . . . . . . . . . . . . . . A3 Rigid Metal Conduit/Intermediate Metal Conduit Fittings . . . . . . . . . . . . . . . . . . . A4-A38

schematic diagram of laptop motherboard

Abstract: Motherboard Intel fw82443bx siemens s35 lcd K38 SOT-23 fw82443bx USER GUIDE FW82443BX MOTHERBOARD FW82371EB pci set laptop Lithium-ion battery diagram schematic marking W26 sot23 AM2 Siemens
Contextual Info: Intel 440BX Scalable Performance Board Development Kit Manual April 2001 Order Number: 273318-006 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual

FW82371EB pci set

Abstract: LTC1117 panasonic resistors marking code for EXB38V220JV laptop a60 power on sequence circuit diagram ferrite k37 k38 k40 MURATA BLM41P750S LTC1117CST schematic diagram of laptop motherboard EXB38V220JV fdc37b787
Contextual Info: Pentium III Processor – Low-Power Module at 500 MHz Development Kit Manual August 2001 Order Number: 273303-005 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual