9X9 0.75 Search Results

13.5MHZ RFID Reader

Abstract: LT5575 LT5570 QFN 9X9 LT5579 Wideband Mixer upconverting and downconverting lw100815ku lt5538 QFN32 5X5 GND AA 14-Bit 160MSPS SAR ADC
Contextual Info: VOL 3 Wireless & RF Solutions High Performance Analog ICs Linear Technology offers some of the highest performance RF and signal chain solutions for wireless and cellular infrastructure. These products support worldwide standards LTE, WiMAX, GSM, W-CDMA, TD-SCDMA, CDMA, CDMA2000, etc. Other wireless systems

LTC66021

Abstract: LT5579 LT5570 LTC2245 QFN-48 6x6 LT6200-5 LTC22171 LT5537 LTC2602 2818D
Contextual Info: VOL 3 ワイヤレス＆RFソリューション 高性能アナログIC リニアテクノロジーはワイヤレスおよびセルラー・インフラストラクチャ向けに、最高性能 の RF およびシグナルチェーン・ソリューションを提供しています。これらの製品は、LTE、

RG850

Abstract: SMP2000 EM 1455 A SMP400G-BA SMP400G-BB SMP400G-BC photodiodes
Contextual Info: SMP SERIES SEME LAB Anode Passivation coating HIGH SENSITIVITY SINGLE ELEMENT SILICON PHOTODIODES Oxide layer FEATURES: N+ type Intrinsic Layer Description The SMP devices are a range of single element Silicon P.I.N. photodiodes. The device structure has be designed

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)

Contextual Info: Plastic Packages for Integrated Circuits Thin, Fine Pitch, Plastic Ball Grid Array Package TFBGA V81.5x5 D A1 CORNER B A 81 BALL THIN, FINE PITCH, PLASTIC BALL GRID ARRAY PACKAGE (TFBGA) SYMBOL MIN NOMINAL MAX NOTES A 0.75 0.91 1.07 - A1 0.15 0.21 0.27 -

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

Contextual Info: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

CABGA 6x6

Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
Contextual Info: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is

Contextual Info: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Technical Product Brief

Abstract: 88E1112 Technical Product Brief 88E1112 88E1112 sfp marvell ethernet switch sgmii alaska x register Marvell PHY 88E1112 SFP Marvell 88e1112 sgmii switch
Contextual Info: Alaska 88E1112 Technical Product Brief Integrated 10/100/1000 Gigabit Ethernet Transceiver Doc. No. MV-S105997-00, Rev. -May 9, 2011 Document Classification: Proprietary Information Marvell. Moving Forward Faster Alaska® 88E1112 Technical Product Brief

Contextual Info: IC274 Series IC274-1S1 202 • l i I I . .r .-. — C haracteristics ^ — Socket Series No. of Leads [— Insulation Resistance: Withstanding Voltage: 1,000MQminimum at 500 VDC 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial)

X2316

Abstract: ic27424
Contextual Info: Test Contactors IC274 Series IC274- 151 202 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads Design No. NOTE: Pogo Pin or Surface Mount available. Characteristics 1,000M½minimum at 500 VDC

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

3105B

Abstract: 19-159-015 S2 Switch Normally close
Contextual Info: EAO – Your Expert Partner for Human Machine Interfaces EAO Product Information Series 19 Switches and Indicators 19 Contents 19 Description . 3 Product Assembly . 4

PLLP-12

Abstract: NIS5102QP1HT1G NIS51
Contextual Info: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.

Contextual Info: NIS5102 High Side SMART HotPlugt IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a

NIS5102

Abstract: NIS5102QP1HT1 NIS5102QP1HT1G NIS5102QP2HT1 NIS5102QP2HT1G PLLP-12 formula 9x9 0.75
Contextual Info: NIS5102 High Side SMART HotPlugt IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a

Contextual Info: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.

PLLP-12

Contextual Info: NIS5102 High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a

delay timer circuit diagram

Abstract: 305 power mosfet smart ups 750 circuit adjustable current limiter mosfet current mirror PLLP-12 NIS5102 NIS5102QP1HT1 NIS5102QP1HT1G NIS5102QP2HT1
Contextual Info: NIS5102 High Side SMART HotPlugt IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a

Contextual Info: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.

NIS5102

Abstract: NIS5102QP1HT1 NIS5102QP1HT1G NIS5102QP2HT1 NIS5102QP2HT1G
Contextual Info: NIS5102 High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a

Contextual Info: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.