IC274 Search Results

Contextual Info: IC274 Series IC274-1S1 202 • l i I I . .r .-. — C haracteristics ^ — Socket Series No. of Leads [— Insulation Resistance: Withstanding Voltage: 1,000MQminimum at 500 VDC 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial)

X2316

Abstract: ic27424
Contextual Info: Test Contactors IC274 Series IC274- 151 202 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads Design No. NOTE: Pogo Pin or Surface Mount available. Characteristics 1,000M½minimum at 500 VDC

pogo pins

Abstract: IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901
Contextual Info: IC274 Series Test Contactor SMT Pogo Pins (LGA, BGA, CSP - 0.50 to 1.50mm Pitch) Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max.

56 pin BGA IC Socket

Abstract: bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310
Contextual Info: IC274 Series Test Contactor SMT - Spring Probe Contact Style Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +100°C

IC274-625133

Abstract: 625133 IC274-11901 IC274-529118 2212X
Contextual Info: IC274 Series Handler Type Ball Grid Array / Chip Scale Package (BGA/FBGA/CSP) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 500V DC 500V AC for 1 minute

64256 sram dip

Abstract: varistor MOV1 matsushita 64256 varistor MOV1 IEU-1311 VARISTOR SCK 016 transistor BL P35 varistor SCK 255 matsua stepping motors bl p66 transistor
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

NEC VR4300

Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
Contextual Info: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6

IC-2722

Abstract: 78310 UPD78237 IC-2374 IC-2984 64256 IC-2748 uPD78214GC IC-2475 circuit diagram of split air conditioner
Contextual Info: USER'S MANUAL 78K/II SERIES 8-BIT SINGLE-CHIP MICROCOMPUTER INSTRUCTIONS µPD78214 SUB-SERIES µPD78218A SUB-SERIES µPD78224 SUB-SERIES µPD78234 SUB-SERIES µPD78244 SUB-SERIES 1990 Document No. U10228EJ6V0UM00 6th edition (Previous No. IEU-1311) Date Published December 1995 P

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3

transistor BL P64

Abstract: PD75402A varistor MOV1 varistor MOV1 matsushita uPD78213 uPD78214 uPD78217A uPD78217ACW uPD78217AGC-AB8 PD78218A
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD78217A,78218A 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION The µ PD78217A and 78218A are members of the 78K/II series of microcontrollers featuring a high-speed highperformance CPU. The µPD78217A and 78218A are based on the µPD78213 and 78214, and feature increased memory

IEM-1236

Abstract: IC-3095 78310A NEC application note 78218 TRANSISTOR BC 187 IC-2722 0a39 nec pram uPD78234 uPD78214
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid