744002 Search Results

stabilizer

Contextual Info: MATERIAL DECLARATION SHEET Model # 70AD 2 pin Product Line Male Modular Contact Date March 24, 2009 RoHS Compliant YES No. 1 Construction element Material group Copper alloy 0.008 plating 0.0002 Stabilizer Copper alloy 2 Contacts 3 Lid 4 Material weight [g]

To39 transistor header

Abstract: 731 triac 715 triac
Contextual Info: Package Details - TO-39 Mechanical Drawing DIMENSIONS INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX A DIA 0.335 0.370 8.51 9.40 B (DIA) 0.315 0.335 8.00 8.51 C 0.040 1.02 D 0.240 0.260 6.10 6.60 E 0.500 12.70 F (DIA) 0.016 0.021 0.41 0.53 G (DIA) 0.200 5.08

pwr4525

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR4525 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY ENCAPSULANT

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR2615 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY Headquarters Riverside CA

Contextual Info: MATERIAL DATA SHEET Material PMH1206 Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

3050b

Abstract: TISP7350H3SL-S Bourns Sip IT 8572
Contextual Info: MATERIAL DECLARATION SHEET 3-SIP Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP7350H3SL-S

acrylic resin

Abstract: SDR1006 MATERIAL DECLARATION inductor C21H26O3 UV-C110
Contextual Info: MATERIAL DECLARATION SHEET Material Number Model SDR1006 Product Line Power Inductor Compliance Date 01-October-2004 RoHS Compliant No. 1 Construction Element subpart CORE Yes MSL Homogeneous Material F4D 1 Material weight [g] 0.833 2 WIRE 2-SFBW 0.289 3

Contextual Info: MATERIAL DECLARATION SHEET Material # Model 4416T-L Product Line Networks Date 02-January-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.000026 0.000013 0.000037

Contextual Info: Model: FVXO-PC53 SERIES LVPECL 5 x 3.2mm 3.3V VCXO Freq: 0.75 MHz to 1.35GHz Rev. 12/12/2007 Features XTREMELY Low Jitter Low Cost XPRESS Delivery Frequency Resolution to six decimal places Absolute Pull Range APR of ±50ppm -20 to +70°C or -40 to +85°C operating temperatures

26.6M

Abstract: CT-26-6M copper chromium CA 5668
Contextual Info: MATERIAL DECLARATION SHEET Material Number CT-26-6M Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart External Housing Brake Bushing Gearwheel Housing Headquarters Riverside CA MSL Homogeneous Material

DAD 5

Abstract: TO 92 leadframe 3050b TISP4240M3LMFR-S TISP4350H3LM-S
Contextual Info: MATERIAL DECLARATION SHEET Package Type DO-92 Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP4350H3LM-S or TISP4240M3LMFR-S.

Contextual Info: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163

MATERIAL DECLARATION inductor

Abstract: PM1008 material declaration MATERIAL DECLARATION SHEET inductor
Contextual Info: MATERIAL DECLARATION SHEET Material Number PM1008 Series Product Line Chip Inductor Compliance Date 01-January-2006 RoHS Compliant Yes MSL 2a No. Construction Element subpart Homogeneous Material Material Weight [g] Homogeneous Material Substance 1 Core

Contextual Info: MATERIAL DECLARATION SHEET Material # 70AA 2 PIN Product Line Male Modular Contact Date March 27, 2009 RoHS Compliant YES No. 1 2 Construction element Body Pins Material group CAS if applicable Average mass [%] Tribromopolystyrene 74.00 7.00 19.00 0.053 0.022

CRT0603 marking

Contextual Info: MATERIAL DECLARATION SHEET Material Number Model CRT0603 Product Line Chip Resistors Compliance Date 18-June-2009 RoHS Compliant Yes MSL 1 Construction Element subpart Homogeneou s Material Material weight [g] Homogeneous Material\ Substances Ceramic Substrate

Contextual Info: MATERIAL DECLARATION SHEET Material Number SRU3014 Series Product Line Shielded Power Inductor Compliance Date 01-November-2006 RoHS Compliant No. 1 2 3 Construction Element subpart Core Yes MSL Homogeneous Material Ferrite Ni-Zn Series Solder Bar Solder

0209

Abstract: polyether 10600
Contextual Info: MATERIAL DECLARATION SHEET Material # 7914 S Product Line Key Switch Side Actuated Date 6/23/05 RoHS Compliant Yes (January 1, 2005) Material weight [g] No. Construction element Material group 1 Dome Stainless Steel 0.0027 0.0007 0.0003 2 3 Housing Adaptor

169284-22-4

Abstract: 12-hydroxystearate material declaration sheet
Contextual Info: MATERIAL DECLARATION SHEET Material Number 3382 Product Line Rotary Position Sensor Compliance Date Since inception RoHS Compliant Yes No. 1 Construction Element subpart Cover MSL Homogeneous Material Nylon Material weight [g] 0.089 Homogeneous Material/

encoder 9985

Abstract: 9985 encoder 112945-52-5 adhesive fr 309 92278 9985, encoder
Contextual Info: MATERIAL DECLARATION SHEET Material Number EMS22 – Dual Ball Bearing Product Line Magnetic Encoder Compliance Date Since inception RoHS Compliant Yes No. 1 Construction Element subpart C-Clip MSL Homogeneous Material Stainless Steel N/A Material weight

CT-23-6A

Contextual Info: MATERIAL DECLARATION SHEET Material Number CT-23-6A Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 Construction Element subpart External Housing MSL Homogeneous Material Polycarbonate N/A Material weight [g] 1.2 Steel 0.2 Finish

WIRE WOUND CHIP INDUCTOR

Abstract: MATERIAL DECLARATION inductor 88MN
Contextual Info: MATERIAL DECLARATION SHEET Material PM0402C SERIES Product Line Wire Wound Chip Inductor Date 12-September-2006 No. Construction element Material group Material Weight [g] Materials 1 Ceramic Core Ceramic 0.000695 2 Copper Wire Copper 0.00005 3 Epoxy UV epoxy

Contextual Info: MATERIAL DECLARATION SHEET Material # Product Line Date RoHS Compliant CRH1206-LF Series Chip Resistors 04/12/2005 Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.0085880 2 Top Conductor Silver if applicable

titanium oxide

Contextual Info: MATERIAL DATA SHEET Material CM160808 Series Product Line Date Laser-Cut Chip Inductors 17-December-2004 No. Construction element Material group 1 Ceramic Core Alumina 2 Conductor Coating resign Copper Epoxy Material weight mg 2.39 (ref.) 1.26 (ref.) 0.32

fiberglass resin

Abstract: 9300-19-4 7440224 1309-64-4
Contextual Info: MATERIAL DECLARATION SHEET Model ECW Product Line Encoders Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A No. Construction Element subpart Homogeneous Material Material weight [g] 1 Dielectric Ink Ink 0.003 Laminate 2 PCB Substrate Copper Plating