7440224 Search Results

Contextual Info: MATERIAL DECLARATION SHEET Material # 4609M-LF Series Product Line Networks Date 05/17/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.1663 0.0019 0.0414 0.0138 0.0221

To39 transistor header

Abstract: 731 triac 715 triac
Contextual Info: Package Details - TO-39 Mechanical Drawing DIMENSIONS INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX A DIA 0.335 0.370 8.51 9.40 B (DIA) 0.315 0.335 8.00 8.51 C 0.040 1.02 D 0.240 0.260 6.10 6.60 E 0.500 12.70 F (DIA) 0.016 0.021 0.41 0.53 G (DIA) 0.200 5.08

Contextual Info: MATERIAL DATA SHEET Material PMH1206 Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

3050b

Abstract: TISP7350H3SL-S Bourns Sip IT 8572
Contextual Info: MATERIAL DECLARATION SHEET 3-SIP Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP7350H3SL-S

06852

Contextual Info: MATERIAL DECLARATION SHEET Material # 4609H-LF Series Product Line Networks Date 05/18/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.2328 0.0027 0.0580 0.0193 0.0310

SRR3011

Abstract: enamelled copper wire
Contextual Info: MATERIAL DATA SHEET Material SRR3011 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Terminal Material group Ferrite Ni-Zn Series Bar Solder Sn100% Silver Paste Material Weight g 0.058 Average mass (%) Sum (%)

4780

Abstract: CDSC706-T05C silver ag wire Bond
Contextual Info: MATERIAL DECLARATION SHEET Material # CDSC706 Series Product Line ESD Protection Date 1/1/2007 RoHS Compliant Yes COMPONENT DETAILS No. Construction element Material group Material weight [g] 1 Lead Frame Lead Frame 0.002570 2 Wafer Silicon 0.001434 3 Gold Bond wire

acrylic resin

Abstract: SDR1006 MATERIAL DECLARATION inductor C21H26O3 UV-C110
Contextual Info: MATERIAL DECLARATION SHEET Material Number Model SDR1006 Product Line Power Inductor Compliance Date 01-October-2004 RoHS Compliant No. 1 Construction Element subpart CORE Yes MSL Homogeneous Material F4D 1 Material weight [g] 0.833 2 WIRE 2-SFBW 0.289 3

Contextual Info: MATERIAL DECLARATION SHEET Material # Model 4416T-L Product Line Networks Date 02-January-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.000026 0.000013 0.000037

Contextual Info: Model: FVXO-PC53 SERIES LVPECL 5 x 3.2mm 3.3V VCXO Freq: 0.75 MHz to 1.35GHz Rev. 12/12/2007 Features XTREMELY Low Jitter Low Cost XPRESS Delivery Frequency Resolution to six decimal places Absolute Pull Range APR of ±50ppm -20 to +70°C or -40 to +85°C operating temperatures

DAD 5

Abstract: TO 92 leadframe 3050b TISP4240M3LMFR-S TISP4350H3LM-S
Contextual Info: MATERIAL DECLARATION SHEET Package Type DO-92 Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP4350H3LM-S or TISP4240M3LMFR-S.

Contextual Info: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163

Contextual Info: MATERIAL DATA SHEET Material PMA1206L Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

CRT0603 marking

Contextual Info: MATERIAL DECLARATION SHEET Material Number Model CRT0603 Product Line Chip Resistors Compliance Date 18-June-2009 RoHS Compliant Yes MSL 1 Construction Element subpart Homogeneou s Material Material weight [g] Homogeneous Material\ Substances Ceramic Substrate

diode marking 226

Abstract: marking 7c fiber glass
Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RD Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.674 Materials CAS if applicable Average mass [%] Barium

Contextual Info: MATERIAL DECLARATION SHEET Material # 4610M-LF Series Product Line Networks Date 05/17/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.1848 0.0022 0.0460 0.0153 0.0246

2587

Contextual Info: MATERIAL DECLARATION SHEET Material # 4610H-LF Series Product Line Networks Date 05/18/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.2587 0.0030 0.0644 0.0214 0.0344

0209

Abstract: polyether 10600
Contextual Info: MATERIAL DECLARATION SHEET Material # 7914 S Product Line Key Switch Side Actuated Date 6/23/05 RoHS Compliant Yes (January 1, 2005) Material weight [g] No. Construction element Material group 1 Dome Stainless Steel 0.0027 0.0007 0.0003 2 3 Housing Adaptor

4416P-LF

Abstract: 4416plf 4416pl
Contextual Info: MATERIAL DECLARATION SHEET Material # 4416P-LF Series Product Line Networks Date 05/13/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.00048 0.00027 0.00002

Contextual Info: MATERIAL DECLARATION SHEET Material Number SRR6028 Series Product Line SHIELDED SMD POWER INDUCTOR Compliance Date 01-July-2007 RoHS Compliant Yes No. 1 Construction Element subpart CORE MSL Homogeneous Material 1 Material weight [mg] FERRITE CORE 414.1

encoder 9985

Abstract: 9985 encoder 112945-52-5 adhesive fr 309 92278 9985, encoder
Contextual Info: MATERIAL DECLARATION SHEET Material Number EMS22 – Dual Ball Bearing Product Line Magnetic Encoder Compliance Date Since inception RoHS Compliant Yes No. 1 Construction Element subpart C-Clip MSL Homogeneous Material Stainless Steel N/A Material weight

diode marking 226

Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RQ Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide

1031

Contextual Info: MATERIAL DECLARATION SHEET Model # 2039-xx-SMLF Product Line GDT Date 04/01/2008 RoHS Compliant Yes No. Construction element Material group Material weight [g] Materials CAS if applicable Average mass [%] Sum [%] 1 Electrodes SM Copper Alloy 0.1525 Copper

Contextual Info: MATERIAL DECLARATION SHEET Material # Product Line Date RoHS Compliant CRH1206-LF Series Chip Resistors 04/12/2005 Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.0085880 2 Top Conductor Silver if applicable