68012 Search Results

Contextual Info: RF Coaxial Connectors Between Series Adaptors SMB / SMC to 50 ȉ BNC BNC Plug to SMC Jack Part Number 050-074-6800220 BNC Jack to SMC Bulkhead Jack Part Number 050-075-6801220 Mounting Plan Y Page 109 . Panel Thickness 3,18 (.125) max. BNC Plug to SMB Jack

Contextual Info: RF Coaxial Connectors Between Series Adaptors SMB / SMC to 50 ȉ BNC BNC Plug to SMC Plug Part Number 050-073-6800220 BNC Jack to SMC Bulkhead Plug Part Number 050-077-6801220 Mounting Plan Y Page 109 . Panel Thickness 3,18 (.125) max. BNC Plug to SMB Plug

Contextual Info: RF Coaxial Connectors Between Series Adaptors SMB / SMC to 50 ȉ BNC BNC Plug to SMC Plug Part Number 050-073-6800220 BNC Jack to SMC Bulkhead Plug Part Number 050-077-6801220 Mounting Plan Y Page 109 . Panel Thickness 3,18 (.125) max. BNC Plug to SMB Plug

SCC68910

Abstract: g2j1 pa1011 "memory access controller" and signetics and 68000 24 SIGNETICS
Contextual Info: Signetics SCC68905 I Basic Memory Access Controller BMAC Microprocessor Products DESCRIPTION The Signetics SCC68905 Basic Memory Access Controller (BMAC) is designed for the S68000 family (68000, 68010 and 68012) of microprocessors. It has a 24bit logical address and a 24-bit physical

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

siemens sab 82532

Abstract: 82258 SA 82532 SAB 80286 csc 2323 sab80286 STT 3 SIEMENS 80286 microprocessor pin out diagram ESCC2 siemens sab 82525
Contextual Info: SIEM ENS Enhanced Serial Communication Controller ESCC2 SAB 82532 Preliminary Data 1.1 CMOS 1C General Features S erial Interface • Two independent full duplex serial channels - On chip clock generation or external clock source - On chip DPLL for clock recovery of each

Contextual Info: Uni-Labels • For panels, pipes & conduits sm Description: A unique and versatile marking system for large cables, cabinet doors or virtually any surface using a PVC channel and individual letters and figures. Can be assem bled on-site and easily altered if

Contextual Info: AVG Semiconductors DDF Technical Data Quad 2-Input NOR Buffer with Open Collector Outputs This device contains four independent gates, each of which performs the logic NOR function. The open-collector outputs require external pull-up resistors for proper logical operation.

if transformer 455khz

Abstract: KA22427 KA22427B FM radio ic 16 pin KSC1674-0 455KHZ 47KQ IF FILTER 455KHZ MARKING 91t am radio rf
Contextual Info: Audl80 AM/FM 1-CHIP RADIO ,KA22427B is a monolithic integrated circuit designed for the portable AM/FM radio or AM/FM clock radios. FUNCTIONS • • • • AM RF & MIX am agc AM/FM DET Regulator • • • • AM Local OSC AM/FM IF AMP Audio Power AMP FM AFC Control

45BJ

Abstract: 456J Model 450J 454J 450J precision full wave peak Frequency Generator 10kHz Model 450 V 454
Contextual Info: ANALOG ► D EV IC ES Low Cost, High Performance, 10/20kHz Voltage to Frequency Converters FEA TU RES Low Cost Low Noinlinearity: ±50ppm max; Model 450K High Stability: ±25ppm/°C max; Model 450K Versatility: Voltage or Current Inputs; Model 454J/K 10V or 20V F:ull Scale Inputs

MARKING CODE SMD JW

Abstract: TXC CXO A51AC isdn modem 2S34 chmn m1p7 SAB-R3000
Contextual Info: SIEMENS AKTIEN6ESELLSCHAF 47E D • ô53St.0S QQBbbSa Ô m S l E ú SAB 82532 1 INTRODUCTION The Enhanced Serial Communication Controller ESCC2 SAB 82532 is a data communication device with two symmetrical serial channels. It has been designed to implement high-speed com­

siemens sab 82532

Abstract: SAF 3019 80286 microprocessor pin out diagram ESCC2 pc dio-48 P 4095 MOTOROLA 68012 SAB-R3000
Contextual Info: SIEMENS ICs for Communications Enhanced Serial Communication Controller ESCC2 SAB 82532 SAF 82532 Version 3.2 User’s Manual 07.96 SAB 82532 SAF 82532 Revision History: Current Version: 07.96 Previous Version: User’s Manual 07.93 Page in previous Version

Contextual Info: DIP Type SBC Coils [RoHS [RoHS Compliant] Compliant] ●SBC1Series（SBC1-□□□-○○○） Model 1R0-312 1R5-292 2R2-272 3R3-232 4R7-202 6R8-182 100-172 150-162 220-132 330-102 470-711 680-651 101-571 151-431 221-391 331-341 471-301 681-251 102-211 152-181

59012 h 331

Contextual Info: r to 61 41 65 45 = = = = 1% 1% 5% 5% Tol. Tol. Tol. Tol. on a miniReel in a miniBag on a miniReel in a miniBag Size Code 2 3 5 6 = = = = 0402 0603 0805 1206 Dimensions L x W : 7 = 1210 8 = 2010 9 = 2512 C ase Resistor value Code in £1 — { Use code from product chart)

ROSIN

Abstract: 26SWG fume smoke RASH solder coshh assessment coshh
Contextual Info: ROSIN FLUX-CORED SOLDER WIRE Health and Safety Data Sheet 1. Identification of Substance/Preparation and of the Supplier Description : CEL tin/lead solder wire containing rosin based flux 16, 18, 20, 22, 24 and 26swg. Part No./Code : Single Core Flux Supplier

BI resistor network

Abstract: 5K10 T14L10 DSA003808
Contextual Info: T14L10 Vishay Techno Thick Film Resistor Networks, Dual-In-Line, 10 Bit APPLICATIONS 10 Bit, R/2R Ladder networks for D/A and A/D converter with bi-polar or CMOS switches. ELECTRICAL SPECIFICATIONS Ladder network accuracy: ± 1 LSB from 0 °C to + 70 °C Ladder network resistance tolerance: ± 2 %

BDT61F

Abstract: 61AF BDT61BF BDT60AF BDT60BF BDT60CF BDT60F
Contextual Info: BDT61F; 61AF BDT61BF; 61CF SILICON DARLINGTON POWER TRANSISTORS NPN silicon power transistors in a monolithic Darlington circuit and housed in a SOT186 envelope w ith an electrically insulated mounting base. They are recommended fo r applications such as audio output stages and general purpose amplifiers.

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: T14L Vishay Techno Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 10 bit, R/2R ladder networks for D/A and A/D converter with bi-polar or CMOS switches • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction • Thick film resistive elements

Diode smd s6 63A

Abstract: smd schottky diode s4 63a
Contextual Info: PS052 PowerCal 2 Calibration Platform Features • Hardware platform for configuration, calibration and test of Microchip battery management products • Operates under control of Windows based PowerMate™ software PS7XX and PowerTool™ 500 software (PS5XX) through an

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

SVC237

Contextual Info: 注文コード No. N 6 8 0 1 SVC237 No. N 6 8 0 1 21001 新 SVC237 特長 シリコン拡散接合形 FM 受信機電子同調用可変容量ダイオード ・低電圧である（6.5V 系） 。 ・大入力特性のすぐれたツインタイプの FM 電子同調用可変容量ダイオードである。

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,