64 PIN CERAMIC QUAD FLATPACK Search Results

68-PIN

Contextual Info: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-43 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-44 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-45 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-46

68-PIN

Contextual Info: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-40 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-41 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-42 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-43

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 1 49 PIN 1

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.A 64 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 5, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 49 1 PIN 1 INDEX AREA 48 0.567 (14.40)

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Contextual Info: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack

5962-9951902QYA

Abstract: CY37128P100-125AXC U208 5962-9952301QZC CERAMIC LEADLESS CHIP CARRIER CY37032P44-125JXC CY37512P256-100BGI CY37192 CY37256 CY37384
Contextual Info: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes

CY37032P44-154AXI

Abstract: CY37128P160-125AC 5962-9951902QYA CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192
Contextual Info: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes

i87C51

Abstract: i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614
Contextual Info: Flash MCU Order Code Guide Atmel Intel Philips AMD Microchip Zilog Matra Dallas Siemens AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 8751 87C51 PIC16C73 PIC16C74 Z84C01, Z84C50, Z08614 Z80C30, Z85C30, Z86C15 Z85230, Z850230, Z86C30

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

64 pin CERAMIC QUAD FLATPACK

Abstract: CERAMIC QUAD FLATPACK CQFP CY7C960 CY7C961 CY7C964 VIC068A VIC64 64-pin CERAMIC QUAD FLATPACK
Contextual Info: fax id: 5604 64 CY7C964 Bus Interface Logic Circuit Features • Comparators, counters, latches, and drivers minimize logic requirements for a variety of multiplexed and non-multiplexed buses • Directly drives VMEbus address and data signals • 8-bit comparator for slave address decoding

Cypress VMEbus Interface Handbook

Abstract: Cypress Applications Handbook 64 pin CERAMIC QUAD FLATPACK 64-pin CERAMIC QUAD FLATPACK CY7C964-ASC G68 Package CY7C960 CY7C961 CY7C964 VIC068A
Contextual Info: 64 CY7C964 Bus Interface Logic Circuit Features • Comparators, counters, latches, and drivers minimize logic requirements for a variety of multiplexed and non-multiplexed buses • Directly drives VMEbus address and data signals • 8-bit comparator for slave address decoding

CY37064P44-154YMB

Abstract: CY37512P208-100UMB CY37256P160-125UMB CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37032VP44-100AI
Contextual Info: Family Ultra37000 CPLD Family[1] 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Contextual Info: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the

5962-9951902QYA

Abstract: CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384
Contextual Info: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes

CY37032VP44-100AI

Abstract: 5962-9952502QZC 400BA
Contextual Info: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes

CY37064

Abstract: ULTRA37000 CY37032 CY37032V CY37064V CY37128 CY37128V CY37192 CY37256 CY37384
Contextual Info: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes

KD 2107

Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C

tlo82

Abstract: TLO82 datasheet lm147 lm117 3.3V JM38510/10901BGA TLO82 application lm723 LM338 model SPICE LM723 pin details lm842
Contextual Info: Worldwide Sales Offices Linear/Mixed-Signal Designer’s Guide Winter 2002 FRANCE ITALY PRC SWEDEN National Semicondutores da América do Sul Ltda. World Trade Center Av. das Nações Unidas, 12.551 22nd Floor - cj. 2207 04578-903 Brooklyn São Paulo, SP Brasil

MT 5388 BGA

Abstract: Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511
Contextual Info: IDT Product Selector Guide Accelerated Thinking SM Table of Contents Integrated Processors Flow-Control Management Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Contextual Info: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C

SMJ320C31

Contextual Info: SMJ320C31, SMJ320LC31, SMQ320LC31 DIGITAL SIGNAL PROCESSORS SGUS026F – APRIL 1998 – REVISED OCTOBER 2001 D D D D D D D D D D D D Processed to MIL-PRF-38535 QML Operating Temperature Ranges: – Military (M) –55°C to 125°C – Special (S) –55°C to 105°C

Contextual Info: 7^2^237 / = 7 ^ 7# O□ 4 4 bSLf HIS •SGTH S G S - 1H O M S O N Ü O ffiO ilE Ë W M O Ê i IM S G 33 2 COLOR VIDEO CONTROLLER PRODUCT OVERVIEW FEATURES APPLICATIONS Video rates up to 110MHz 1 ,2 ,4 and 8 bit pseudo color pixels 15 or 16 bit true color with gamma correction