633 3F Search Results

PVP9390A

Abstract: PAL60 operation of basic limiter circuit 9589X v-chip
Contextual Info: ADVANCE INFORMATION MICRONAS Edition May 3, 2004 6251-633-1AI PVP 9390A Picture-in-Picture IC Version A11 MICRONAS PVP 9390A ADVANCE INFORMATION Contents Page Section Title 4 4 6 1. 1.1. 1.2. General Description Features Block Diagram 7 7 7 7 7 8 9 9 10 10

Picture-in-Picture IC

Abstract: frv0 PAL60 bgy 53 9390a
Contextual Info: PRELIMINARY DATA SHEET MICRONAS Edition June 2, 2005 6251-633-1PD PVP 9390A Picture-in-Picture IC MICRONAS PVP 9390A PRELIMINARY DATA SHEET Contents Page Section Title 4 4 6 1. 1.1. 1.2. General Description Features Block Diagram 7 7 7 7 7 8 9 9 10 10 11 11

ES833

Abstract: 812 triode Ediswan 833 triode
Contextual Info: ES833 RADIATION COOLED TRIODE PENERAI. The ES.633 Is a high mu trlod e p a rticu la rly su ita b le fo r use as an R .F . Poiier A m plifier, 0 6 c llla t o r o r Class B modulator. The anode and grid connections are brought out a t the top and are taken through metal to glftss se a ls to heavy current

LT3973-3.3

Abstract: L6283-1.3 TT8112-3.3 lm394ois-3.3 LMS1117-3.3 CJP1117T-3.3 TH2067.3 LM1585AIT-3.3 LM3674MF-3.3 LP2950DT-3.3
Contextual Info: 43567189ABCDEF33 BA2B2AAB3 1 1 1234567892A36B5CA46D89EA1 FD1  1 12342556423789ABC56 1 6 6 2D59EF651 7 FEC42574A52427 7 5#35!!77 7 1 333 3BAA!"3 39#36$ 3 3.3"/# , 3FD%#!3

SENSOR MARKING CODEBOOK

Contextual Info: STM32F756xx ARM -based Cortex®-M7 32b MCU+FPU, 428DMIPS, up to 1MB Flash/320+16+ 4KB RAM, crypto, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD Data brief Features • • • • • • • • • • • &"'! Core: ARM® 32-bit Cortex®-M7 CPU with FPU,

STM32F429N

Abstract: STM32F429Ni
Contextual Info: STM32F427xx STM32F429xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex®-M4 CPU with FPU,

Contextual Info: STM32F437xx STM32F439xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera&LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex®-M4 CPU with FPU,

Contextual Info: STM32F437xx STM32F439xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera&LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M4 CPU with FPU,

Contextual Info: STM32F437xx STM32F439xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera&LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M4 CPU with FPU,

Contextual Info: STM32F437xx STM32F439xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera&LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M4 CPU with FPU,

Contextual Info: STM32F427xx STM32F429xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M4 CPU with FPU,

Contextual Info: STM32F427xx STM32F429xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M4 CPU with FPU,

STM32F405

Abstract: STM32F407 STM32F407VG STM32F4 PM0081 STM32f4xx user manual DCMI timing specification UFBGA176 stm32F4 cortex-m4 WLCSP90
Contextual Info: STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ ■ ■ ● ■ ■ ■ ■ ■ FBGA Core: ARM 32-bit Cortex -M4 CPU with FPU,

Contextual Info: STM32F437xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces & camera Datasheet − production data • Up to 17 timers: up to twelve 16-bit and two 32bit timers up to 168 MHz, each with up to 4

m 1305

Abstract: PA84 PA84A PA84S UV INK SPECIFICATION
Contextual Info: 108&3
01&3"5*0/"-
".1-*'*&34 PA84 • PA84A • PA84S 551888"1&9.*$305&$)$0.



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 M I C R O T E C H N O L O G Y FEATURES • HIGH SLEW RATE — 200V/µs • FAST SETTLING TIME — .1% in 1µs PA84S) • FULLY PROTECTED INPUT — Up to ±150v

STM32F2

Abstract: STM32 STM32F215 STM32F217 stm32f217xx stm32f21 STM32F215RG stm32f20 PM0059 STM32F217VE
Contextual Info: STM32F215xx STM32F217xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Features • ■ ■ ■ ■ ■ ■ ■ ■ FBGA Core: ARM 32-bit Cortex -M3 CPU with Adaptive real-time accelerator ART

LCBT67S

Abstract: marking 3U 3T 3C diode N91E-AADA-35-1 IESNA RP 27 LRTB GFTG marking 3U 3T 3C diode 3E 3G LCBT67C LED 5050 WHITE CODE C CQ7P.EC-KSKU-5O8Q IEC62471
Contextual Info: Light Emitting Diodes LED ge 88 - 92 11 12 Light Emitting Diodes General Information Safety Instructions The use of new chip technologies means that OSRAM LEDs are delivering higher and higher levels of optical performance. Thus, even eye safety issues might increasingly need to be considered.

Contextual Info: 9999999999 123456789ABC 9 Rack mounted TFT/LCD Monitor 1234 12343567839ABCDEF6C33C6FC93 3567839ABCDEF6C33C6FC93 513334 5133346ACC CB6FA33 CAFC9B3!A A673C3CAD"3 A673C3CAD"3 #AAB3CD$3123C%39&3B A3

STM32F051

Abstract: STM32F051R STM32F0 STM32F051K STM32F051R8 stm32f05 rs485 stm32 STM32F051K8 STM32F051x UFQFPN32
Contextual Info: STM32F051x4 STM32F051x6 STM32F051x8 Low- and medium-density advanced ARM -based 32-bit MCU with 16 to 64 Kbytes Flash, timers, ADC, DAC and comm. interfaces Features • Operating conditions: – Voltage range: 2.0 V to 3.6 V ■ ARM 32-bit Cortex -M0 CPU 48 MHz max

3M Touch Systems

Contextual Info: CY7C1268XV18, CY7C1270XV18 36-Mbit DDR II+ Xtreme SRAM 2-Word Burst Architecture 2.5 Cycle Read Latency 36-Mbit DDR II+ Xtreme SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) Features Configurations • 36-Mbit density (2 M x 18, 1 M × 36) With Read Cycle Latency of 2.5 cycles:

Contextual Info: CY7C1268XV18, CY7C1270XV18 36-Mbit DDR II+ Xtreme SRAM Two-Word Burst Architecture 2.5 Cycle Read Latency 36-Mbit DDR II+ Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) Features Configurations • 36-Mbit density (2 M x 18, 1 M × 36)

UFQFPN32

Abstract: STM32F050 STM32F0 TIM17 rs485 stm32 STM32F050C6 uFQFN stm32 encoder STM32F050K4 STM32 IWDG
Contextual Info: STM32F050x4 STM32F050x6 Low- and medium-density advanced ARM -based 32-bit MCU with up to 32 Kbytes Flash, timers, ADC and comm. interfaces Data brief Features • Operating conditions: – Voltage range: 2.0 V to 3.6 V ■ ARM 32-bit Cortex -M0 CPU 48 MHz max

Contextual Info: 6 APPROVED: DATE: _ TITLE: .474 [12.04] .126 [3.20] 1 0.036 [0 .9 2 ] i o c / -o - Vf \ .098 [2.50] ' — I— .107 [2.71] \ PCB LAYOUT SPECIFICATIONS: COMPONENT SIDE Material: Insulator: PBT, Glass filled, rated UL 9 4 V -0 Insulator color: Black Contacts: Phosphor Bronze

Contextual Info: CY7C2263XV18/CY7C2265XV18 36-Mbit QDR II+ Xtreme SRAM Four-Word Burst Architecture 2.5 Cycle Read Latency with ODT 36-Mbit QDR® II+ Xtreme SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency) with ODT Features Configurations Separate independent read and write data ports