45TI Search Results

aeg t1580

Abstract: T1580 KA287
Contextual Info: 0029426 A E G CORP fll | D02C] 45ti 0QDba22 fi T 1580 N Typenreihe/Type range T1580N 3000 Elektrische Eigenschaften Electrical properties Höchszulässige Werte U d r m i U flR u Periodische Vorwärts und Rückwärts-Spitzensperrspannung Effektiver Durchlaßstrom

aeg t270n

Abstract: ST 084C aeg t270 T270 T270N
Contextual Info: 0 0 2 9 4 2 6 A E G 'CORP fil DE | QD2c]45ti 00DblS3 4 T 270 N Typenreihe/Type ränge T270 N 2000 Elektrische Eigenschaften Electrical properties Höchstzulässige Werte U drm, U rrm Periodische Vorwärts- und Rückwärts-Spitzensperrspannung Effektiver Durchlaßstrom

Contextual Info: FTS512K8L LOW POWER 512K x 8 CMOS STATIC RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —32-Pin 600 mil Plastic and Ceramic DIP —32-Pin 445 mil SOP —32-Pin TSOP II

45TI

Abstract: SIQ124R
Contextual Info: SMT Power Inductor SIQ124R Type Features • High current 11A, 1.5uH , SMD type. ■ ■ ■ ■ Magnetically shielded, suitable for high density mounting. High energy storage and low DCR. Provided with embossed carrier tape packing. Idel for power source circuits, DC-DC converters, DC-AC inverters

Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK

HCB1075

Abstract: HCB1065
Contextual Info: SMT Power Inductor Features • Low profile, SMD type. ■ High current. ■ Magnetically shielded. ■ High energy storage and low DCR. ■ Provided with embossed carrier tape packing. ■ Idel for power source circuits, DC-DC converters, DC-AC inverters

Contextual Info: ESM T Preliminary F59D2G81A Operation Temperature Condition -40 C~85 C Flash 2 Gbit (256M x 8) 1.8V NAND Flash Memory FEATURES Voltage Supply: 1.8V (1.7V ~ 1.95V) Organization - Memory Cell Array: (256M + 8M) x 8bit - Data Register: (2K + 64) x 8bit Automatic Program and Erase

SILM830

Contextual Info: SMT Power Inductor SILM8XX Type Features • Low profile, SMD type. ■ ■ ■ ■ Magnetically shielded, suitable for high density mounting. High energy storage and low DCR. Provided with embossed carrier tape packing. Idel for power source circuits, DC-DC converters, DC-AC inverters

45TI

Contextual Info: SMT Power Inductor SIQ74X Type Features • ■ ■ ■ ■ High current 10A, 1.4uH , SMD type. Magnetically shielded, suitable for high density mounting. High energy storage and low DCR. Provided with embossed carrier tape packing. Idel for power source circuits, DC-DC converters, DC-AC inverters

Contextual Info: WS57C49C HIGH SPEED 8Kx 8 CMOS PROM/RPROM KEY FEATURES • Pin Compatible with Bipolar PROMs • Immune to Latch-UP • Ultra-Fast Access Time — *ACC = 2 5 n s — — Up to 200 mA t CS = 1 2 n s • Low Power Consumption • Fast Programming • ESD Protection Exceeds 2000 V

Contextual Info: P4C1048L LOW POWER 512K x 8 CMOS STATIC RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —32-Pin 600 mil Plastic and Ceramic DIP —32-Pin 445 mil SOP —32-Pin TSOP II

Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK —28-Pin LCC 350 mil x 550 mil

SK373A

Contextual Info: SMT Power Inductor SIQ73X Type Features • ■ ■ ■ ■ High current 9.0A, 0.45uH , SMD type. Magnetically shielded, suitable for high density mounting. High energy storage and low DCR. Provided with embossed carrier tape packing. Idel for power source circuits, DC-DC converters, DC-AC inverters

Contextual Info: FT61256 L HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK

vvq1000

Abstract: AXT100-FC26-3 AXT100-FC26-1 VVQ1000-50A-C6 VVQ1000-50A-C4 electrical wiring vvq1000 51a c6 45T1 45TI VVQ1000-51A-C4
Contextual Info: 2-144 V A LV E S SERIES SY & SX Valves S TA C K I N G T Y P E M A N I F O L D – B A S E M O U N T E D T Y P E DIN R A I L M O U N T E D . P R E - W I R E D T Y P E S E R I E S SY A N D SX N u m b e r o f s t a t i o n s c a n b e i n c re a s e d o n D I N r a i l

57C191C

Abstract: A921A 57c291 57c191
Contextual Info: WS57C191 C/291 C HIGH SPEED 2 K x 8 CMOS PROM/RPROM KEY FEATURES • Pin Compatible with Am27S191/291 and N82S191 Bipolar PROMs • Ultra-Fast Access Time “ ACC = 25 ns — t c s = 12 ns • Immune to Latch-UP • Low Power Consumption — Up to 200 m A

MATRA MHS 80c51

Abstract: MHS 80C31 MATRA MHS 80c31 80C51-12 80C31 TEMIC 80c51t 80C51-36 80C51-30 ANM031
Contextual Info: Tem ic 80C31/80C51 MATRA MHS CMOS 0 to 42 MHz Single-Chip 8 Bit Microcontroller Description MHS’s 80C31 and 80C51 are high performance SCMOS versions of the 8031/8051 NMOS single chip 8 bit |J.C. The fully static design of the MHS 80C31/80C51 allows to reduce system power consumption by bringing the

P4C1048L

Abstract: 45cw P600
Contextual Info: P4C1048L LOW POWER 512K x 8 CMOS STATIC RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —32-Pin 600 mil Plastic and Ceramic DIP —32-Pin 445 mil SOP —32-Pin TSOP II

Contextual Info: ESM T Preliminary F59D4G81A Operation Temperature Condition -40 C~85 C Flash 4 Gbit (512M x 8) 1.8V NAND Flash Memory FEATURES         Voltage Supply: 1.8V (1.7V ~ 1.95V) Organization - Memory Cell Array: (512M + 8M) x 8bit - Data Register: (2K + 64) x 8bit

Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK —28-Pin SOP —28-Pin LCC 350 mil x 550 mil

Contextual Info: SMT Power Inductor SISH811 Type Features • Hight current 3.5A, 10uH , SMD type. ■ Unshielded. ■ Self-leads, suitable for high density mounting. ■ High energy storage and low DCR. ■ Provided with embossed carrier tape packing. ■ Idel for power source circuits, DC-DC converters, DC-AC inverters

13005

Abstract: HMP1340 13005 A HMP1345 13005 applications
Contextual Info: SMT Power Inductor Features • Low profile, SMD type. ■ ■ ■ ■ ■ High current. Magnetically shielded. High energy storage and low DCR. Provided with embossed carrier tape packing. Idel for power source circuits, DC-DC converters, DC-AC inverters

AT27C010 15DC

Abstract: AT270010L-70DM
Contextual Info: AT27C010/L Features • • • e e e e e e e Fast Read Access Time - 45 ns Low Power CMOS Operation 100 ^A max. Standby 25 mA max. A ctive at 5 MHz AT27C010L 40 mA max. A ctive at 5 MHz (AT27C01Q) W ide Selection o f JEDEC Standard Peckages 32-Lead OO&mil PEHP andC erdip

1519B

Abstract: P4C1256 P4C1256L
Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK