28 PIN 0.3 Search Results

CERAMIC FLATPACK 20pin

Contextual Info: MECHANICAL DRAWINGS Ceramic DIP Ordering Code: C C1 24-pin, 0.3" wide C2 20-pin, 0.3" wide C3 22-pin, 0.3" wide C4 24-pin, 0.6" wide C5 28-pin, 0.3" wide C6 28-pin, 0.6" wide C7 16-pin, 0.3" wide C8 18-pin, 0.3" wide C9 32-pin, 0.6" wide C10 28-pin, 0.4" wide

Enplas socket ots-28

Contextual Info: PA-SXA-28SS Data Sheet 28 pin SSOP socket/28 pin DIP 0.3” of 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Ubicom SX28AC/SS in a 28 pin SSOP package can be programmed on programmers capable of programming the 28 pin DIP version of the part.

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

ZA104

Abstract: zu107 p028
Contextual Info: SONY CXK58257CTM/CYM/CM/CP -70LLX 32768-word x 8-bit High Speed CMOS Static RAM Description CXK58257CTM CXK58257CYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) CXK58257CM CXK58257CP 28 pin SOP (Plastic) 28 pin DIP (Plastic) The CXK58257CTM/CYM/CM/CP is 262,144 bits

Size #23 Copper Alloy Crimp Contacts

Abstract: chromel 809-065C
Contextual Info: Series 79 Contacts and Tools Size #23 Copper Alloy Crimp Contacts Size #23 Copper Alloy Crimp Contacts B #23 Pin Contact Contact Type Wire Size Material ØA Pin Pin Pin #22 – #28 #26 – #30 #22 – #28 BeCu BeCu Alumel Pin #22 – #28 Chromel Socket #22 – #28

Contextual Info: IMP23L128 IMP23L256 IMP23L512 VERY LOW POWER 23000 Series ROMS IMP23L100 IMP23L101 IMP23L208 LOW POWER/HIGH PERFORMANCE CMOS ROMS Features Six JEDEC Standard Versions: IMP23L128 IMP23L256 IMP23L512 IMP23L100 IMP23L101 IMP23L208 28 28 28 28 32 32 Pin Pin Pin

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C-C03 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64 (.375±.025) +0.33 9.83 –0.30 +.013

Contextual Info: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ

Contextual Info: M O SEL VITELIC PRELIM INARY V62C318256 2 .7 VOL T 3 2 K X 8 STA TIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin TSOP (Reverse) - 28-pin 600 mil PDIP - 28-pin 300 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 45, 55, 70 ns ■ Ultra low DC operating current of 3mA (max.)

c03 diode

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-C03 Lead pitch 50mil Lead shape Straight Sealing method Cerdip 28-pin ceramic SOP FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64 (.375±.025) +0.33 9.83 –0.30 +.013 .387 –.012 INDEX AREA 27.94(1.100)

28-pin

Abstract: FPT-28P-M17
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M17 Lead pitch 50mil Nominal dimensions 450mil Lead shape Gullwing Sealing method Plastic mold 28-pin plastic SOP FPT-28P-M17 28-pin plastic SOP (FPT-28P-M17) +0.25 17.75 –0.20 +.010 .699 –.008 28

Contextual Info: PA28SO1-15B-3 6 Data Sheet 28 pin SO socket/28 pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, 28 pin SO packages with a body width of 8.6mm - 9.1mm and lead pitch 1.27mm can be programmed on DIP programmers.

Contextual Info: FLAT PACKAGE 28 PIN CERAMIC FPT-28C-A08 28-pin ceramic FPT Lead pitch 12.857° Sealing method Metal seal FPT-28C-A08 28-pin ceramic FPT (FPT-28C-A08) 1.85±0.40 (.073±.016) 0.97(.038)TYP. 2.69±0.30 (.106±.012) 0.70±0.06 (.0276±.0024) 0.30±0.06 (.012±.0024)

28 pin ceramic dip

Abstract: DIP28C-C02
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38

SOD2815B-2

Contextual Info: PA-SOD-2815B-28/2 Data Sheet 28 pin SO socket/28 pin SO receptacle Supported Device/Footprints Adapter Construction Using this adapter, 28 pin SO packages with a body width of 8.0mm - 8.5mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

MAX7300

Abstract: MAX7301 MAX7301AAI MAX7301AAX MAX7301AGL MAX7301ANI display 70 pin configuration 1136L 25p28
Contextual Info: 19-2438; Rev 2; 2/03 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP

MAX7301

Abstract: MAX7301AAX 28-Port MAX6957 MAX7300 MAX7301AAI MAX7301AGL MAX7301ANI Port Expander 32 bit max7301 8 bit control
Contextual Info: 19-2438; Rev 3; 10/03 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP

Port Expander 32 bit

Abstract: MAX7301 P23-20 MAX7300 MAX7301AAI MAX7301AAX MAX7301AGL MAX7301ANI 1136L P5P30
Contextual Info: 19-2438; Rev 1; 10/02 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP

P23-20

Contextual Info: 19-2438; Rev 3; 7/03 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP

Contextual Info: HV18 inc. 8-Channel High Voltage Analog Switch Ordering Information_ Package Options Vpp Vnn +70V +80V VsiG 28-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 28-pin Plastic DIP 28-lead Plastic Chip Carrier

518256

Abstract: V62C518256 Mosel Vitelic sram 32k
Contextual Info: PRELIMINARY V62C518256 32K X 8 STATIC RAM MOSEL VITELIC • Packages – 28-pin TSOP Standard – 28-pin 600 mil PDIP – 28-pin 330 mil SOP (450 mil pin-to-pin) Features ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 5mA (max.) ■ Low Power Dissipation:

zilog Smart usb cable schematic

Abstract: SSR schematics
Contextual Info: Reference Design Mini-Z WLAN 28-Pin Module RD000502-1011 Overview The Mini-Z WLAN 28-Pin Module is a stand-alone 802.11 b/g TCP/IP Wireless Networking module that is produced in a 28-pin Dual Inline Pin package. The Mini-Z WLAN 28-Pin Module integrates Zilog’s powerful ZNEO microcontroller with a Roving Networks 2.4 GHz RN171 802.11 b/g WiFly LAN Module.

Contextual Info: PRELIMINARY LH5164A/AH • 8,192 x 8 bit organization • Access times: 80/100 ns MAX. PIN CONNECTIONS 28-PIN DIP 28-PIN SK-DIP 28-PIN SOP • Low-power consumption: Operating: 303 mW (MAX.) LH5164A/D/N @ 80 ns 248 mW (MAX.) LH5164A/D/N/T @ 100 ns _

V62C518256

Contextual Info: MOSEL V I T E L I C PRELIMINARY V62C518256 3 2 K X 8 STATIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin 600 mil PDIP - 28-pin 330 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 5mA (max.) ■ Low Power Dissipation: