28 400 MIL PACKAGE Search Results

soj 36

Abstract: V28 Package SOJ 24 diode in 400 Molded SOJ V34 V32 Package
Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33

Molded SOJ V34

Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33

FN 1016

Abstract: LED display for car radio mp 1016 PD1700 PD1715 SE 2040 pd1701 AIPD1706 KPB553AC flatpack 48 v
Contextual Info: This Material G3 fif 01704* pipoms* Main use Radio, tuner Radio, tuner Radio, tuner TV. CATV Package fipanoB* APD1707 //PD1708 Portable radio, radio cassette Hi-Fi tuner, TV, CATV Car radio tunder 52-pin flatpack W 28-pin DIP 400 mil 28-pin DIP (400 mil)

SOJ-400

Contextual Info: 5.7 UNIT : mm 13.2 MJ400-01A, LB-044 length : 493±2.0 thickness : 0.6 +0.3 − 0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied package Quantity (pcs) 28-pin plastic SOJ (400 mil) MAX. 25 32-pin plastic SOJ (400 mil) MAX. 22 36-pin plastic SOJ (400 mil)

Contextual Info: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ

Contextual Info: HN58C256A Series, HN58C257A Series Ordering Information Type No. Access time Package HN58C256AP-85 HN58C256AP-10 85 ns 100 ns 600 mil 28-pin plastic DIP DP-28 HN58C256AFP-85 HN58C256AFP-10 85 ns 100 ns 400 mil 28-pin plastic SOP (FP-28D) HN58C256AT-85 HN58C256AT-10

Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram

soj 36

Abstract: 51-85041-A 85031 SOJ 24 V28 Package V32 Package V36 Package 51-85082-B 300MIL
Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram

EV-1707

Abstract: SE-1700 led driver lcd boe PD1700 SE 2040 PD1715 SE-1704 EV170 pd1708 tuner tv
Contextual Info: 13-6 ¿iPDI70I* //PDJ703* f i f 01704* p ip o m s * fip a n o B * APD1707 //PD1708 Main use Radio, tuner Radio, tuner Radio, tuner TV. CATV Portable radio, radio cassette Hi-Fi tuner, TV, CATV Car radio tunder Package 52-pin flatpack 28-pin DIP 400 mil 28-pin DIP (400 mil)

28 pin ceramic dip

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A10 EIAJ code :∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-28C-A10 28-pin ceramic SL-DIP (DIP-28C-A10) 35.56±0.51

SDIP028-P-0400-1

Abstract: DIP-28P-M03 dip28pm03 910025
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20

DIP-28P-M06

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20

m14 transistor

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M16 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M16)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M08 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

TSOP028-P-0400-3

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M07 EIAJ code : TSOP028-P-0400-3 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction

28 pin ceramic dip

Abstract: 28-pin
Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A10 EIAJ code :∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-28C-A10

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M06 EIAJ code :∗SOJ028-P-0400-3 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold

28-pin

Abstract: SDIP028-P-0400-1
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M07 EIAJ code :∗SOJ028-P-0400-4 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold

F28027

Abstract: TSOP028-P-0400-1
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M05 EIAJ code : TSOP028-P-0400-1 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M05 EIAJ code :∗SOJ028-P-0400-2 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06

P18C

Abstract: P28C P16C p42c 24-Pin Plastic DIP 600A S22C P8DH-100-300A
Contextual Info: : Available, : Under development Plastic DIP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 18 20 22 24 28 30 32 36 40 42 32 40 42 48 64 300 400 2.54 600 300 400 1.778 600 750 Ceramic DIP Nominal Dimensions Lead Pitch (mm) (mil) Cerdip 300 400