256-PIN PLASTIC BGA Search Results

256-pin BGA

Abstract: 24 pin MATRIX led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)

led matrix circuits

Abstract: 256-pin Plastic BGA BGA-256P-M02
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)

256-pin BGA

Abstract: led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)

256-pin Plastic BGA

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ

BGA-256P-M02

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)

c051004

Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension. 27.00±0.20(1.063±.008)SQ

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension.

C1995

Abstract: 256-PIN 256-pin Plastic BGA
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M01 Lead pitch 50mil Pin matirx 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ Note: The actual shape of corners may differ from the dimension.

BGA-256P-M02

Abstract: C1995 256-PIN
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M02 Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension.

256-pin Plastic BGA

Abstract: BGA-256P-M21
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21

ep2c20

Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Contextual Info: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced

676 BGA package tray

Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)

f6 diode

Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
Contextual Info: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

tray datasheet bga

Abstract: TRAY DIMENSIONS tray bga
Contextual Info: 87.6 24.15 29.20 135.9 UNIT : mm 27.2 A' A 27.2 29.2 26.10 262.8 315.0 322.6 SECTION A-A' 6.42 6.35 7.62 27.12 Applied Package Quantity (pcs) 256-pin Plastic BGA MAX. 40 Tray Material Heat Proof Temp. Surface resistance T-651 Carbon PES 135°C less than 1x1012Ω/

337 BGA

Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
Contextual Info: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)

Contextual Info: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S y A1 e S φb φ x1 M S A B φ x2 M S S DIMENSIONS 27.00±0.20 D1 24.00

Contextual Info: 256 PIN PLASTIC BGA 27x27 A S B C R H K φM D Y WV U T R P N M L K J H G F E D C B A P Index mark L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 256-PIN PLASTIC BGA 27x27 A B S C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D Y WV U T R P N M L K J H G F E D C B A P Index mark J R I H K L φM S F S E G M NOTE Each ball centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.

Contextual Info: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S S y A1 e S φb φ x1 M S A B φ x2 M S DIMENSIONS 27.00±0.20 D1 24.00

Contextual Info: 256 PIN PLASTIC BGA 27x27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1

of BGA Staggered pins

Abstract: of BGA Staggered Pins package C10943X
Contextual Info: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up