24081 Search Results

24081 Result Highlights (5)

Part	Manufacturer	Description	Download
54122-408161800LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch	PDF
54122-408161250LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch	PDF
54122-408141270LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch	PDF
10130787-240812CLF	Amphenol Communications Solutions	HPCE STD VT Receptacle 32P12S	PDF
54112-408141500LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.	PDF

24081 Datasheets (12)

Part	Manufacturer	Description	Datasheet Type	PDF	PDF Size
2408-1032-AL	RAF Electronic Hardware	HEX STANDOFFPLAIN ALUMINUM5/8 HE	Original	PDF	131.67MB
2408-1032-B	RAF Electronic Hardware	HEX STANDOFFPLAIN BRASS5/8 HEX X	Original	PDF	131.67MB
2408-1032-B-12	RAF Electronic Hardware	HEX STANDOFFCLEAR ZINC5/8 HEX X	Original	PDF	131.67MB
2408-1032-N	RAF Electronic Hardware	HEX STANDOFFNO FINISH - NYLON5/8	Original	PDF	131.67MB
2408-1032-S	RAF Electronic Hardware	HEX STANDOFFPLAIN STEEL5/8 HEX X	Original	PDF	131.67MB
2408-1032-S-12	RAF Electronic Hardware	HEX STANDOFFCLEAR ZINC5/8 HEX X	Original	PDF	131.67MB
2408-1032-SS	RAF Electronic Hardware	HEX STANDOFFPLAIN STAINLESS STEE	Original	PDF	131.67MB
2408-1224-AL	RAF Electronic Hardware	HEX STANDOFFPLAIN ALUMINUM5/8 HE	Original	PDF	131.67MB
2408-1224-B	RAF Electronic Hardware	HEX STANDOFFPLAIN BRASS5/8 HEX X	Original	PDF	131.67MB
2408-1224-N	RAF Electronic Hardware	HEX STANDOFFNO FINISH - NYLON5/8	Original	PDF	131.67MB
2408-1224-S	RAF Electronic Hardware	HEX STANDOFFPLAIN STEEL5/8 HEX X	Original	PDF	131.67MB
2408-1224-SS	RAF Electronic Hardware	HEX STANDOFFPLAIN STAINLESS STEE	Original	PDF	131.67MB

24081 Price and Stock

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Amphenol Communications Solutions 10137924-0811LF CONN PWR3.0 R/A SMT
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey ()	10137924-0811LF	Cut Tape	5,009		1	1 $1.69 10 $1.43 100 $1.22 1000 $1.22 10000 $1.22	Buy Now
	10137924-0811LF	Digi-Reel	5,009		1	1 $1.69 10 $1.43 100 $1.22 1000 $1.22 10000 $1.22	Buy Now
	10137924-0811LF	Reel	5,000		200	1 - 10 - 100 - 1000 $1.04 10000 $0.88	Buy Now
Newark	10137924-0811LF	Bulk	5,697		200	1 $1.05 10 $1.05 100 $1.05 1000 $1.05 10000 $1.05	Buy Now
Texas Instruments BQ24081DRCR IC BATT CHG LI-ION 1CELL 10VSON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey ()	BQ24081DRCR	Cut Tape	4,301		1	1 $1.40 10 $1.02 100 $0.82 1000 $0.71 10000 $0.71	Buy Now
	BQ24081DRCR	Digi-Reel	4,301		1	1 $1.40 10 $1.02 100 $0.82 1000 $0.71 10000 $0.71	Buy Now
	BQ24081DRCR	Reel	3,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.66	Buy Now
Mouser Electronics	BQ24081DRCR		3,764			1 $1.38 10 $1.00 100 $0.81 1000 $0.70 10000 $0.64	Buy Now
Bristol Electronics	BQ24081DRCR		10		3	1 - 10 $1.80 100 $1.80 1000 $1.80 10000 $1.80	Buy Now
Rochester Electronics	BQ24081DRCR		7,142		1	1 - 10 - 100 $0.81 1000 $0.68 10000 $0.60	Buy Now
Ameya Holding Limited	BQ24081DRCR		376,366			1 - 10 - 100 - 1000 - 10000 -	Get Quote

Component Electronics, Inc	BQ24081DRCR		113			1 $1.92 10 $1.92 100 $1.44 1000 $1.25 10000 $1.25	Buy Now
Texas Instruments BQ24081DRCT IC BATT CHG LI-ION 1CELL 10VSON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey ()	BQ24081DRCT	Cut Tape	324		1	1 $1.94 10 $1.43 100 $1.16 1000 $1.16 10000 $1.16	Buy Now
	BQ24081DRCT	Digi-Reel	324		1	1 $1.94 10 $1.43 100 $1.16 1000 $1.16 10000 $1.16	Buy Now
	BQ24081DRCT	Reel	250		250	1 - 10 - 100 - 1000 $1.01 10000 $0.93	Buy Now
Mouser Electronics	BQ24081DRCT		163			1 $1.94 10 $1.43 100 $1.16 1000 $0.97 10000 $0.92	Buy Now
Rochester Electronics	BQ24081DRCT		1,500		1	1 - 10 - 100 $1.20 1000 $1.00 10000 $0.89	Buy Now
TME	BQ24081DRCT				1	1 $1.90 10 $1.40 100 $1.14 1000 $1.13 10000 $1.13	Get Quote
Ameya Holding Limited	BQ24081DRCT		48,613			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Tripp Lite PS240810 POWER STRIP 120V 8OUT VERT 10'
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	PS240810	Bulk	33		1	1 $87.76 10 $79.51 100 $72.03 1000 $72.03 10000 $72.03	Buy Now
Newark	PS240810	Bulk	10		1	1 $87.76 10 $79.51 100 $72.03 1000 $72.03 10000 $72.03	Buy Now
RS	PS240810	Bulk	1		1	1 $88.64 10 $80.66 100 $73.57 1000 $73.57 10000 $73.57	Buy Now
NAC	PS240810				1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Neutron USA	PS240810		123			1 $72.70 10 $72.70 100 $72.70 1000 $72.70 10000 $72.70	Buy Now
American Bright Optoelectronics AB-FD02408-19712-8A2-12S LED MOD AB-FH RGBW LNR ST 3000K
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	AB-FD02408-19712-8A2-12S		23		1	1 $13.10 10 $10.18 100 $8.48 1000 $7.51 10000 $7.51	Buy Now

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24081 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Athlon x4 640 Abstract: amd bios AMD-760TM 24081 AMD athlon design guide amd athlon PIN LAYOUT AMD socket s1 athlon 64 layout Athlon 64 motherboard design guide BIOS example delay source code Contextual Info: Preliminary Information AMD-761 System Controller Software/BIOS Design Guide Publication # 24081 Rev: D Issue Date: February 2002 Preliminary Information 2001, 2002 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced	Original	AMD-761TM 0x1x0x40 24bit 0000000h 24081D--February Athlon x4 640 amd bios AMD-760TM 24081 AMD athlon design guide amd athlon PIN LAYOUT AMD socket s1 athlon 64 layout Athlon 64 motherboard design guide BIOS example delay source code	PDF
merlin gerin C60n Abstract: merlin gerin C60n 24338 Merlin Gerin 24403 merlin gerin C60n - 24338 merlin gerin C60n 24067 24335 C60N Merlin C60N 24406 merlin gerin 24334 24332 Contextual Info: 6000 МЭК 898 10 кA МЭК 947.2 ГОСТ P 50345-99 C60N Автоматические выключатели Кpивые B, C и D Кол-во полюсов 1 2 3 4 Merlin Gerin Кол-во модулей Ш = 9 мм 2 4 6 8 Ном. ток A 0,5 1 2	Original		PDF
diode E1110 Abstract: lN4002 LN4003 ANA 618 20010 TDB 0123 km b3170 E1110 Diode UB8560D MAA723 moc 2030 Contextual Info: elektronik-bauelem ente I WT VD AVL 1 /8 7 Bl. 2 E r l ä u t e r u n g e n z u m I n h a l t und zu d e n A n g a b e n d e r B a u e l e m e n t e - V e r g l e i c h s l i s t e D ie B a u e l e m e n t e - V e r g l e i c h s l i s t e e n t h ä l t a l l e in d e r B i l a n z v e r a n t w o r t u n g d e s V E B K o m b i n a t	OCR Scan		PDF
inverseur Abstract: sf.f 24050 SSi mos Contextual Info: lil TO 116 CB-2 Complementary MOS — Gates and schmidt triggers SSI - sst M O S c o m p lé m e n ta ire s — O p éra te u rs e t triggers de S c h m id t D e s c rip tio n D e s c rip tio n Packageü B o îtie rs Type T ype T y p ic a l p ro p a g a tio n	OCR Scan	O-116 CB-79 inverseur sf.f 24050 SSi mos	PDF
240817 Abstract: SURFACE MOUNT TECHNOLOGY Contextual Info: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,	Original		PDF
D-31675 Abstract: 80C166 HERION C166 Contextual Info: Development Support Microcontrollers 16 Bit Topic: All Subjects These lists do not claim for completeness and may contain typing mistakes. If You need urther information call the Mailbox: +49 89 498431 Page 1 # 2 25.07.1996 Hardware C166 family Topic: All Subjects	Original	microSys166 80C166; mini166, D-66119 EUROS-166 C167CW-Evaluationboard, D-31675 80C166 C166-Compiler, 80C166-Board HERION C166	PDF
sensor 40af Abstract: liquid float level sensor VERSAPLAST wiring diagram for float switch ls700 Contextual Info: INTRODUCTION Float Type Level Switches Contents Single Point Small Size GEMS Level Switches operate on a direct, simple principle. In most models, a float encircling a stationary stem is equipped PERMANENT with powerful, permanent magnets. As MAGNET the float rises or lowers with liquid level,	Original	monitor30 DT04-3P sensor 40af liquid float level sensor VERSAPLAST wiring diagram for float switch ls700	PDF
merlin gerin NS100N Abstract: merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338 Contextual Info: Catalogue 2004 Merlin Gerin Miniature circuit-breakers and earth leakage circuit-breakers MCBs/ELCBs contents page Miniature circuit-breakers RCCB / ELCB Technical information Mini pragma din kit Merlin Gerin C60a 2 C60N 3 C60H 4 C60N UL489 - DC circuit breaker	Original	C120N C120H NC100L NC100LH NC100 UL489 SEIMC60C04 merlin gerin NS100N merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338	PDF
C60N Abstract: C60N 24396 C60N c C60n Circuit Breakers Catalogue c60n tripping curves IEC60898 C60N 24334 vigi C60N C60N 3P 24334 Contextual Info: Protect Circuit protection C60N circuit breakers B, C and D curves IEC 60898: 6000 A , IEC 60947-2: 10 kA Function b The circuit-breakers combine the following functions: v protection of circuits against short-circuit currents v protection of circuits against overload currents	Original	90078E C60N C60N 24396 C60N c C60n Circuit Breakers Catalogue c60n tripping curves IEC60898 C60N 24334 vigi C60N C60N 3P 24334	PDF
ASPC2 Abstract: PEP Modular Computers GmbH EN50170 hilscher PEP Modular Computers profibus connector siemens siemens profibus Turbo186 System On Chip P1386 Contextual Info: PMC253 Advanced PROFIBUS Controller for Fieldbus Applications Introduction ➤ 32-bit PMC module ➤ Highly integrated EC-1 ASIC with Siemens ASPC2 Profibus technology ➤ PROFIBUS DP V1 Master class 1 and 2 or Slave ➤ Standard interface with 9-pin D-Sub connector	Original	PMC253 32-bit PMC253 EN50170 D-87600 DS-02/2002 ASPC2 PEP Modular Computers GmbH hilscher PEP Modular Computers profibus connector siemens siemens profibus Turbo186 System On Chip P1386	PDF
SKIIP 33 nec 125 t2 Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302 Contextual Info: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.	Original	734TL UWEB-MODEM-34 HCS412/WM TLV320AIC10IPFB 100MB NEON250 GA-60XM7E BLK32X40 BLK32X42 SKIIP 33 nec 125 t2 skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302	PDF
Ablebond 71-1 Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board Contextual Info: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages DC resistance R of leads or pins Capacitance (C) including lead-to-lead and loading capacitances Inductance (L) including only self-inductance values for pins traces and wires (PGA) or	Original	93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board	PDF
intel packaging Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than	Original	CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays	PDF
N82593SX Abstract: Aromat relay i386SL Intel 82593 Intel 82593 1991 N82593 intel i3 MOTHERBOARD pcb CIRCUIT diagram 82360SL TTL 82593 s593 crystal Contextual Info: in tel A P ' 3 6 7 APPLICATION NOTE 8 2 5 9 3 CSMA/CD Core LAN Controller Designing Network Ready Notebook Computers Using the 82593 Ethernet* Controller RAYMOND SIT TECHNICAL MARKETING ENGINEER ’ E th e r n e t is a r e g is te r e d tr a d e m a r k o f X e r o x Cc rp o ra tio n .	OCR Scan	386SL N82593SX Aromat relay i386SL Intel 82593 Intel 82593 1991 N82593 intel i3 MOTHERBOARD pcb CIRCUIT diagram 82360SL TTL 82593 s593 crystal	PDF

AMD Athlon II X4 Abstract: gigabyte motherboard circuit diagram Northbridge AC494 AMD K5 Contextual Info: Preliminary Information AMD-761 System Controller TM Data Sheet Publication # 24088 Rev: A-1 Issue Date: February 2001 Preliminary Information 2001 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced	Original	AMD-761 80x86 AMD-761TM 4088A-1--February AMD Athlon II X4 gigabyte motherboard circuit diagram Northbridge AC494 AMD K5	PDF
krone TELEPHONE TAG BLOCK Abstract: krone telephone tag box Krone Terminal Block Elettro GiBi ctb1201 CTB1301 krone telephone connector krone telephone cable Tag Block Krone PA66 Contextual Info: 02 Conns - terminal blocks pp53-68 24/11/05 9:58 am Page 53 2 2/3 tier 3.5/3.81mm PCB 45 degree PCB 5mm PCB 5.08mm PCB 7.5/7.62mm PCB IDC Fused Pluggable Screwless PCB Shrouded pluggable Terminal strips 59 54 58 54 57 58 54 64 59 59 65 65 02 Conns - terminal blocks pp53-68	Original	pp53-68 krone TELEPHONE TAG BLOCK krone telephone tag box Krone Terminal Block Elettro GiBi ctb1201 CTB1301 krone telephone connector krone telephone cable Tag Block Krone PA66	PDF
82360SL Abstract: CD 2399 GP Contextual Info: 0 M [F § Ä Ä ? 0 M in te i Intel386 SL MICROPROCESSOR SuperSet Highly-Integrated Static Intel386™ SL Microprocessor Complete ISA Peripheral Subsystem System-Wide Power Management Static lntel386TM SL CPU — Runs MS-DOS, W IN D O W S’ , O S /2	OCR Scan	Intel386â lntel386TM Intel386 IOCS16# MEMCS16# Ct409 Ct227 82360SL CD 2399 GP	PDF
solid solubility Abstract: chemical control process block diagram Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original		PDF
DSA20T Abstract: DSA20TB DSA20TC DSA20TE DSA20TG DSA20TJ DSA20TL Contextual Info: Ordering number :EN2408 _ D S A 2 0 T No.2408 Diffused Junction Type Silicon Diode 2.0A Power Rectifier Junction Tem perature Storage T em perature II P eak Reverse Voltage V rm Average Rectified C urrent Io Surge Forward C urrent Ifsm rfsoo o a t Ta - 25°C	OCR Scan	EN2408 DSA20T DSA20TB DSA20TC DSA20TE 50Hzsine DSA20TG DSA20TJ DSA20TL DSA20T	PDF
siemens 8031 Abstract: 7667 78028 D-30876 C166 family 80C166 C166 D-31675 D-83026 SOFTWARE Contextual Info: Development Support Microcontrollers 16 Bit Topic: All Subjects These lists do not claim for completeness and may contain typing mistakes. If you need further information, please call the Mailbox: +49 89 498431 Page 1 # 2 10.04.1997 Software C166 family Topic: All Subjects	Original	D-31675 80C166, D-70499 80C51x D-30876 siemens 8031 7667 78028 C166 family 80C166 C166 D-83026 SOFTWARE	PDF
LT1667 Abstract: LT1665 CA10 A058 dk 300 a008 82360SL LCD CMC 116 L01 2164 intel INTEL 82360 CD 2399 GP A049 crystal Contextual Info: 5bE ]> • 4ÔSbl7S D i n o S M E34 « I T L 1 up/prpHLS irrte* Intel386 CORP SL MICROPROCESSOR SuperSet INTEL 'T~-(4c\ 1 7 -3 ^ Highly-Integrated Static Intel386™ SL Microprocessor Complete ISA Peripheral Subsystem System-Wide Power Management Static lntel386TM SL CPU	OCR Scan	Intel386TMCORP Intel386TM lntel386TM Intel386 IOCS16# MEMCS16# Ctg27 LT1667 LT1665 CA10 A058 dk 300 a008 82360SL LCD CMC 116 L01 2164 intel INTEL 82360 CD 2399 GP A049 crystal	PDF
gold metal detectors Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008 Contextual Info: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of	Original	CH03WIP gold metal detectors soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008	PDF
Side Brazed Ceramic Dual-In-Line Packages Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year	Original		PDF
21040-07 Abstract: 21040-AC Scans-0025707 Contextual Info: in t e l. 21040 4M 4,194,304 x 1 BIT DYNAMfC RAM WITH FAST PAGE MODE • Performance Range Symbol Parameters tRAC Access Time from RAS CAC RC 21040-07 21040-08 70 80 Access Time from CAâ 20 25 ns Read Cycle Time 130 150 ns . ■ Fast Page Mode Operation	OCR Scan	Cycles/16mS 20-LEAP 21040-07 21040-AC Scans-0025707	PDF

24081 Search Results

24081 Result Highlights (5)

24081 Datasheets (12)

24081 Price and Stock

Amphenol Communications Solutions 10137924-0811LF

Texas Instruments BQ24081DRCR

Texas Instruments BQ24081DRCT

Tripp Lite PS240810

American Bright Optoelectronics AB-FD02408-19712-8A2-12S

24081 Datasheets Context Search

Athlon x4 640

merlin gerin C60n

diode E1110

inverseur

240817

D-31675

sensor 40af

merlin gerin NS100N

C60N

ASPC2

SKIIP 33 nec 125 t2

Ablebond 71-1

intel packaging

N82593SX

AMD Athlon II X4

krone TELEPHONE TAG BLOCK

82360SL

solid solubility

DSA20T

siemens 8031

LT1667

gold metal detectors

Side Brazed Ceramic Dual-In-Line Packages

21040-07