24-PIN PLASTIC DIP Search Results

24-Pin Plastic DIP

Abstract: DIP024-P-0600-1
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M02 EIAJ code :∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP (DIP-24P-M02) +0.20 +.008

DIP024-P-0600-1

Abstract: 24-Pin Plastic DIP
Contextual Info: DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M02 EIAJ code : ∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP (DIP-24P-M02) +.008 +0.20 30.20 –0.30 1.189 –.012 INDEX-1

24-Pin Plastic DIP

Abstract: dip 24 dimension DIP024-P-0600-1
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M02 EIAJ code :∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP

dip 24 dimension

Contextual Info: SHRINK DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 Lead pitch 70mil Row spacing 300mil Sealing method Plastic mold 24-pin plastic SH-DIP DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20 22.05 –0.30 .868 +.008 –.012

Contextual Info: SKINNY DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M03 EIAJ code : ∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-24P-M03 24-pin plastic SK-DIP (DIP-24P-M03) +0.20 29.72 –0.30 1.170 +.008 –.012

DIP-24P-M04

Contextual Info: SLIM DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M04 EIAJ code : ∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20 30.28 –0.30 +.008 1.192 –.012

2972

Abstract: DIP-24P-M03
Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M03 EIAJ code :∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M03 24-pin plastic SK-DIP (DIP-24P-M03)

SDIP024

Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 24-pin plastic SH-DIP Lead pitch 70 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20

910025

Abstract: DIP-24P-M04
Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M04 EIAJ code :∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20

cerdip

Abstract: 28 pin ceramic dip
Contextual Info: UNIT : mm 8.6 15.5 18.3 11.2 22.4 SC-600-1P Length : 495±2.0 Thickness : 0.7+0.3 −2.0 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24 pin Plastic DIP MAX. 14 24 pin Ceramic DIP (Cerdip) MAX. 15 24 pin Ceramic DIP (Seam Weld)

24-Pin Plastic DIP

Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M03 EIAJ code :∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M03

DIP10

Abstract: MD600-1A
Contextual Info: Unit : mm 8.6 15.5 18.3 11.2 MD600-1A 22.4 MD600-2A Length : 500±2.0 +0.3 Thickness : 0.7−2.0 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24-Pin Plastic DIP 14 28-Pin Plastic DIP 12 42-Pin Plastic DIP 8 42-Pin Plastic Shrinked DIP

24-Pin Plastic DIP

Abstract: transistor c 558 dip 24 dimension
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 24-pin plastic SH-DIP Lead pitch 70 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M05

24-Pin Plastic DIP

Abstract: DIP-24P-M04
Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC To Top / Package Lineup / Package Index DIP-24P-M04 EIAJ code :∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-24P-M04

nec 40-pin plastic dip

Abstract: 40 PIN CERDIP cerdip 28 pin ceramic dip nec 40 pin dip nec 40 pin plastic dip
Contextual Info: TUBE CONTAINER UNIT : mm 8.6 15.5 18.3 11.2 22.4 SC-600-1P Length : 495±2.0 Thickness : 0.7+0.3 −0.2 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24-pin Plastic DIP MAX. 14 24-pin Ceramic DIP (Cerdip) MAX. 15

Contextual Info: HV18 fàì S u p ertex inc. 8-Channel High Voltage Switch Ordering Information Package Options Vpp V nn VsiG 24-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 24-pin Plastic DIP 28-lead Plastic Chip Carrier +70V -70V 110V P-P HV1814C

cerdip

Abstract: MD400-05A MD-400
Contextual Info: UNIT : mm 7.5 13.5 12.5 7.0 17.9 MD400-05A length : 495±2.0 +0.2 thickness : 0.5−0.1 tolerance : ±0.4 material : plastic with antistatic finish Applied Package Quantity (pcs) 14-pin • Plastic DIP MAX. 24 20-pin · Plastic DIP MAX. 17 22-pin · Plastic DIP/Ceramic DIP (cerdip)

HV1614C

Abstract: HV1616C
Contextual Info: LJï S u p e r te x inc. HV16 8-Channel High Voltage Analog Switch Ordering Information Package Options > 0_ CL * V nn VsiG 24-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 24-pin Plastic DIP 28-lead Plastic Chip Carrier +70V -70V 110V P-P

Contextual Info: HV21 inc. 8-Channel High Voltage Analog Switch Ordering Information Package Options Vpp - v NN 24-pin ceram ic*1 side-brazed DIP Die in waffle pack 24-pin plastic DIP 28-lead plastic chip carrier 140 V HV2114C HV2114X HV2114P HV2114PJ 160 V HV2116C HV2116X

M62X42B

Abstract: M6242B DIP16-P-300 M65421 m58321
Contextual Info: PACKAGING PACKAGE/PIN COUNT PART NAME DIP SOP M58321 16 - M6242B 18 24 M62X42B 18 - 18/24 20/24 M6542-1/2/3 2 • 16 PIN PLASTIC DIP DIP16-P-300 (UNIT : mm) 3 •24 PIN PLASTIC DIP (DIP24-P-600) (UNIT : mm) @ nnnr-innnnnnnn o U U U o I 1—1 U L J LTT_J L J L J L J L J r

RGB to composite video

Abstract: CXA1645M
Contextual Info: SONY CXA1645P/M RGB Encoder Description 24 pin DIP Plastic The CXA1645P/M is an encoder IC that converts 24 pin SOP (Plastic) analog RGB signals to a composite video signal. This IC has various pulse generators necessary for encoding. Composite video outputs and Y/C outputs for the S

Contextual Info: SUPERTEX INC blE D 07732^5 0GG3S3S ^ 3 HV21 &k S u p e rte x in c. 8-Channel High Voltage Analog Switch Ordering Information Package Options V p p -vNN 24-pin ceramic* side-brazed DIP 140V HV2114C 160V HV2116C 24-pin plastic DIP 28-lead plastic chip carrier

dip 28

Abstract: "lead material" DIP
Contextual Info: TUBE CONTAINER UNIT : mm 8.6 15.5 18.3 11.2 MD600-1A 22.4 MD600-2A Length : 501±2.0 +0.3 Thickness : 0.7−0.2 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24-Pin Plastic DIP MAX. 14 28-Pin Plastic DIP MAX. 12

NEC 20PIN DIP

Abstract: NEC 28PIN DIP MD400 NEC 24PIN DIP SSD-A-H6525-1 cerdip MD400-05A
Contextual Info: TUBE CONTAINER UNIT : mm 7.5 13.5 12.5 7.0 17.9 MD400-05A length : 495±2.0 +0.2 thickness : 0.5−0.1 tolerance : ±0.4 material : plastic with antistatic finish Applied Package Quantity (pcs) 14-pin • Plastic DIP MAX. 24 20-pin · Plastic DIP MAX. 17