215 BGA Search Results

256 ball bga

Abstract: BCM5238 BCM5421 smii 1.4
Contextual Info: BCM5238 10/100BASE-TX OCTAL-Φ TRANSCEIVER SUMMARY OF BENEFITS FEATURES • • • • • • • • • • • • • • Target usage: Fast Ethernet switches. • Lowest per port power solution available:< 215 milliwatts per Single-chip, eight-port Fast Ethernet transceiver

Contextual Info: High-Frequency Center Probe Test Socket for Devices up to 55mm Square FEATURES • For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any device on 0.30mm pitch or larger • 4-point crown insures “scrub” on solder oxides, while pointed probe works with

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

Contextual Info: Preliminary GS816218A B/D /GS816236A(B/D)/GS816272A(C) MHz–200 MHz 1M x 18, 512K x 36, 256K x 72 300 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

HD6417709SBP167BV

Abstract: reflow soldering profile BGA SH7709S SH3-DSP HD6417706BP133V HD6417727BP160V Hitachi DSA00207
Contextual Info: HITACHI MICROCOMPUTER TECHNICAL UPDATE No. TN-SH7-380A/E DATE 22 November 2001 THEME SH3,SH3-DSP BGA Package usage notice in Reflow Soldering Spec change Supplement of Documents CLASSIFICATION Limitation on Use PRODUCTNAME HD6417706BP133V, HD6417709SBP167BV, HD6417709SBP133BV,HD6417709SBP100BV,

Contextual Info: Preliminary GS8162Z18A B/D /GS8162Z36A(B/D)/GS8162Z72A(C) 119, 165, & 209 BGA Commercial Temp Industrial Temp 18Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

Contextual Info: +9 4 1  BGA3031 DOCSIS 3.0 upstream amplifier Rev. 1 — 15 August 2013 Product data sheet 1. General description The BGA3031 is an upstream amplifier meeting the Data Over Cable Service Interface Specifications DOCSIS 3.0). It is designed for cable modem, CATV set top box and VoIP

Contextual Info: Product Specifications PART NO.: VL53B2863F-K9M/F8M/E7M REV: 1.1 General Information 1GB 128Mx72 DDR3 SDRAM ULP REGISTERED Mini-RDIMM 244-PIN Description The VL53B2863F is a 128Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of nine CMOS 128Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL clock in

DDR3-1066

Abstract: DDR3-1333 PC3-10600 A6211
Contextual Info: Product Specifications PART NO.: VL53B2863F-K9M/F8M/E7M REV: 1.1 General Information 1GB 128Mx72 DDR3 SDRAM ULP REGISTERED Mini-RDIMM 244-PIN Description The VL53B2863F is a 128Mx72 DDR3 SDRAM high density Mini-RDIMM. This memory module consists of nine CMOS 128Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered buffer/PLL clock in

Contextual Info: GS816236BD-200M 200 MHz 3.3 V and 2.5 V VDD 3.3 V and 2.5 V I/O 512K x 36 18Mb Sync Burst SRAM 165-Bump BGA Military Temp Base datasheet: GS816218/36BD Product s covered in this document: GS816236BD-200M Product specification(s) addressed by this document:

Contextual Info: GS8162Z18 B/D /GS8162Z36(B/D)/GS8162Z72(C) 119, 165, & 209 BGA Commercial Temp Industrial Temp 18Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

Contextual Info: GS816218 B/D /GS816236(B/D)/GS816272(C) 1M x 18, 512K x 36, 256K x 72 18Mb S/DCD Sync Burst SRAMs 119-, 165- & 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: +9 4 1  BGA3031 DOCSIS 3.0 plus upstream amplifier Rev. 2 — 26 February 2014 Product data sheet 1. General description The BGA3031 is an upstream amplifier meeting the Data Over Cable Service Interface Specifications DOCSIS 3.0). It is designed for cable modem, CATV set top box and VoIP

13007 h3

Abstract: passing H7 K744 gw 340 13007 h4
Contextual Info: Preliminary GS816218A B/D /GS816236A(B/D)/GS816272A(C) MHz–200 MHz 1M x 18, 512K x 36, 256K x 72 300 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

PSR4000 AUS308

Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
Contextual Info: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array

Contextual Info: Preliminary GS8162Z18/36/72B-250/225/200/166/150/133 18Mb Pipelined and Flow Through Synchronous NBT SRAM 119 and 209 BGA Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

Contextual Info: Preliminary GS816218/36/72B-250/225/200/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: Preliminary GS8162Z18/36/72B-250/225/200/166/150/133 16Mb Pipelined and Flow Through Synchronous NBT SRAM 119 and 209 BGA Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

K4B2G0846C-HCH9

Abstract: roundup DDR3 miniDIMM JEDEC K4B2G0846CHCH9 VL51B5763F VL51B5763F-F8S A6211 DDR3-1066 80 pin miniDIMM K4B2G0846C-HC
Contextual Info: Product Specifications PART NO.: VL51B5763F-F8S REV: 1.1 General Information 2GB 256Mx72 DDR3 SDRAM ULP ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5763F is a 256Mx72 DDR3 SDRAM high density Mini-UDIMM. This memory module consists of nine CMOS 256Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

Contextual Info: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

Contextual Info: Product Specifications PART NO.: VL51B5263A-K9M REV: 1.1 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module is dual rank, consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in

MT41J256M8HX

Abstract: A6211 DDR3-1333 PC3-10600 connector pcb mounted VN13
Contextual Info: Product Specifications PART NO.: VL51B5263A-K9M REV: 1.1 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module is dual rank, consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in

DQ56

Abstract: K4B1G0846E A6211 DDR3-1333 PC3-10600 DDR3 miniDIMM JEDEC NC177
Contextual Info: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

TSOP infrared

Abstract: proof hot air bga reflow hot air BGA "Humidity Indicator Card" Hitachi DSA0015 baking
Contextual Info: ASSEMBLY 7-1 Soldering Methods for Various Surface Mount Packages QFP SOP TQFP TSSOP QFJ LQFP SSOP TSOP HQFP SOJ HSOP Soldering Methods Partial Heating Methods QFI HSOI G-QFP G-QFJ QFN LDPAK S Other discrete BGA HQFI packages not FBGA (CSP) listed to the left