208 CQFP Search Results

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

RTAX1000S

Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Contextual Info: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5

Contextual Info: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </

RQFP

Abstract: EPM9560RC208-15 CQFP 208 datasheet altera epm9560rc208-15 208 pin rqfp drawing CQFP 208 EPM9560WC208-20 EPM9560RC208-20 EPM9560 EPM9560RC208-15C
Contextual Info: PRODUCT DISCONTINUANCE NOTICE SELECTED MAX 9000 ORDERING CODES Altera will be discontinuing the EPM9560 in the 208-pin ceramic quad-flat pack package CQFP and substituting compatible power quad flat pack package (RQFP) alternatives. All EPM9560 devices in the 208-pin RQFP are form, fit and functionally equivalent* to the

UT6325

Abstract: 484-CLGA CL484 CQFP 208 datasheet PBGA 484P UT-SG-CQ208 CQ208 QT-SG-PS484
Contextual Info: RadHard Eclipse Devices UT6325-W* 208-PQFP 9 N/A UT8RHEEB-208PC UT8RHE-SKT208P N/A N/A QT-SG-PQ208 9 UT6325-X* 208-CQFP 9 9 UT8RHEEB-208PC UT8RHE-SKT208C UT8RHE-SKT208P with proper land pads 9 UT-SG-CQ208 9 UT6325-P* 280-PBGA 9 N/A UT8RHEEB-288PC UT8RHE-SKT280P

CERAMIC QUAD FLATPACK CQFP

Abstract: 8361H CY7C37512P208B-UM
Contextual Info: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069

RadTol Eclipse FPGA

Abstract: SW-DIP JP35 C143 T transistor fpq-352 C143 E S S transistor D 1413 transistor UT8RHEEB-208C H11-201 SN74HC14D
Contextual Info: Standard Products UT8RHEEB-208C RadTol Eclipse FPGA UT6325 Evaluation Board Preliminary Data Sheet September 2008 www.aeroflex.com/FPGA INTRODUCTION FEATURES ‰ User configurable evaluation board for the UT6325 RadTol Eclipse FPGAs ‰ Supports the 208 ceramic quad flatpack

QL24X32B-1PF144C

Abstract: OPTOCOUPLER 817c data sheet 77-I PF144 PQ208 QL24X32B-1PQ208C
Contextual Info: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F

QL24X32B-1PQ208C

Abstract: ql24x32b PF144 PQ208 QL24X32B-1PF144C
Contextual Info: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F

ccd camera module

Abstract: QFP144-P-2020 CCD Linear Image Sensors DIODE MARKING B85 L69A TQFP100-P-1414 b86a T07 marking
Contextual Info: Package Outlines MOS LSI L O U 170 MOS Memories (M H O ) 185 CCD Area/Linear Image Sensors (C C O ) 190 CCD Camera Modules ( C C Q 193 TFT LCD Device (C C D ) 193 Bipolar IC s (B Q D ) 194 Discrete Semiconductors (DQZJ) 208 169 Package Outlines (MOS LSI)

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

XC5200

Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3042A PQ100

Abstract: WC68 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L wc84 XC3064L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC4010XL PQ160

Abstract: XC3030A CQFP 208 datasheet XC95144 PQ100 PP132 XCS20 PQ208 XC4013XL HT144 XC4028EX hq208 XCS40 BG432
Contextual Info: 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 38 223 225 228 240 256 299 304 352 411 432 475 559 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC VQFP PLASTIC LCC CERAMIC LCC PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC PQFP PLASTIC TQFP

304 MQFP

Abstract: MQ240 XC3030A
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC9572 VQ44

Abstract: XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A
Contextual Info: 44 64 68 84 100 120 132 144 156 160 164 175 24 176 191 196 208 223 225 228 240 256 299 304 352 411 432 475 559 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC VQFP PLASTIC LCC CERAMIC LCC PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC PQFP PLASTIC TQFP

XC2064

Abstract: XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090
Contextual Info: 44 10 ◆ = New since last issue of XCELL 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

MPXY8600

Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
Contextual Info: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.

Contextual Info: P r e l im in a r y C u s t o m e r P r o c u r e m e n t S p e c if ic a t io n Z90602 I n t e r n e t S e r v ic e P r o c e s s o r FEATURES Device Package Speed Z90602_ 208-Pin QFP_ 50 MHz_ • 0°C to +70°C Temperature Range ■