1MEGX16 Search Results

20 NAC 12 I T2

Abstract: Edd 44 EDI4161MEV-RP
Contextual Info: ^EDI EDI4161MEV-RP ELECTRONIC DESIGNS, INC. I • 1Megx16 EDO DRAM 1Megabitx 16 Dynamic RAM 3.3V, Extended Data Out Features EDI's ruggedized plastic 1Mx16 DRAM allows the user to capitalize on the cost advantage o f using a plastic compo­ 1 Meg x 16 bit CMOS Dynamic

Contextual Info: W D EDI4161MEV-RP \ ELECTRONIC-DESIGN INC, 1 1 M e g X K EDO D RAM 7 Megabitx 16Dynamic RAM 33V, ExtendedData Out Features EDI's mggedized plastic 1 Mx16 DRAM allows the user to capitalize on the cost advantage of using a plastic compo- 1 Meg x 16 bit CMOS Dynamic

W88AA

Abstract: scanlogic SL11R x1 x2 eprom d1 d2 d3 d4 d5 d6 LIN protocol basics using atmel uart low cost eeprom programmer circuit diagram SL11R 0xC00C
Contextual Info: SL11R SL11R USB Controller/ 16-Bit RISC Processor Data Sheet Cypress Semiconductor Corporation Document #: 38-08006 Rev. * • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 Revised December 3, 2001 SL11R Table of Contents 1.0 DEFINITIONS . 8

scanlogic SL11R

Abstract: SL11R SL11-R 99 mfu
Contextual Info: SL11R USB Controller/16-Bit RISC Proc essor Technical Reference Cypress Semiconductor 3901 North First Street San Jose, CA 95134 408-943-2600 http://www.cypress.com Cypress Semiconductor SL11R Hardware Specification Definitions . 8

scanlogic SL11R

Abstract: SL11R d1510 SRAM16-BIT "USB Transceiver" 1mega OHM RESISTOR Atmel 0342 parallel port to usb 0xC00C
Contextual Info: SL11R USB Controller/16-Bit RISC Processor Technical Reference ScanLogic Corporation 8 New England Executive Park Burlington, MA 01803 http://www.scanlogic.com ScanLogic Corporation SL11R Hardware Specification DEFINITIONS. 7

Contextual Info: ^EDI EDI4161MEV-RP ELECTRONIC DESIGNS, INC I • W e g x W EDO DRAM 1Megabitx 16Dynamic RAM 3.3V, Extended Data Out Features EDI's ruggedized plastic 1 M xl 6 DRAM allows the user to capitalize on the cost advantage of using a plastic com po­ 1 Meg x 16 bit CMOS Dynamic

Contextual Info: o tt a s 1991 —— DPZ1 MX! 6A3 □ P M o 1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE ADVANCED INFORMATION DESCRIPTION: The D PZ1M X 16A 3 "D EN SE-STA CK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: 3-D PACKAGING TECHNOLOGY The electronic industry is always trying to reduce the physical size of circuit design implementations. This is especially true today. Circuit designs have increased in complexity and sophistication beyond the ability of traditional

1230A1

Contextual Info: 16 Megabit FLASH EEPROM D E N S E - P A C M I C K OS V S T M S \í DP5Z1MM16PY/I3/H3/J3/DP5Z1MW16PA3 AD VAN CED IN FO RM ATIO N DESCRIPTION: The DP5Z1MM16PY/Í3/H3/J3/DP5Z1MW16PA3 "SLCC" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems'