18JAN Search Results

hssdc

Abstract: hssdc2
Contextual Info: 107-68442 Packaging Specification 18Jan10 Rev G REC ASSY, HSSDC II CONN. 1. PURPOSE 目的 Define the packaging specifiction and packaging method of REC ASSY, HSSDC II CONN. 订定 REC ASSY, HSSDC II CONN. 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

gl 05 al b 07

Contextual Info: 4 DRAWING THIS MADE IN THIRD DRAWI NG ANGLE IS UNPUBLISHED COPYRIGHT 19 2 3 PROJECTION RELEASED BY ANP FOR INCORPORATED. ALL LOC 19 PUBLICATION INTERNATIONAL RIGHTS G RESERVED. D I ST 8 6 REV I 5 I ONS p F ZONE DESCR I P T I O N LTR N DATE 18JAN01 REV PER 0 G 3 A - 0 0 2 9 - 0 1

Contextual Info: 8 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION LOC CM ALL RIGHTS RESERVED. BY TYCO ELECTRONIC5 CORPORATION. REVISIONS DIST 00 LTR Y 1 . A S E E D E T A IL A KW SR 18JAN04 REVISED PER EC 0G 3B - 1 0 9 4 - 0 4 APVD PARTS COMPLY TO AMP SOLDERABILITY SPECIFICATION 1 0 9 - 1 1 - 3 .

BU 4052 B

Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2005 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. JAN ,2005- REVISIONS LOC ALL RIGHTS RESERVED. J LTR DESCRIPTION RELEASED DATE DWN APVD 18JAN05 T.K LE / \ MATERIAL AND FINISH PLUG HOUSING ; THERMOPLASTIC UL94V-0 COLOR:BU\CK

PBT 20 GF Tyco

Abstract: AMP PBT - GF series 747913-2
Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. DIST R E V IS IO N S AD 00 LTR DESCRIPTION REV PER EC 0 G 3C — 8 5 2 — 0 4 53.1 0 A 03.10 [0 .1 2 2 ] DWN DATE 18JAN05 APVD MB JO

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2 00 4 2 4 RELEASED FOR PUBLICATION 14JAN ,2 0 0 4 - R E V IS IO N S ALL RIGHTS RESERVED. By - E P LTR DESCRIPTION c C1 D C2 DATE DWN APVD E C R —0 6 —0 2 1 0 3 0 22SEP06 AM FWK REVISED PER ECO-10-000444 18JAN10

Contextual Info: 4 TH IS DRAWING IS U N P U B LIS H E D . 3 2 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. COPYRIGHT DW BY TYCO ELECTRONICS CORPORATION. - R E V IS IO N S DE SC R IPTIO N LTR A' POSITION REVI SED PER DWN DATE KK HMR 18JAN10 E C O - 10 - 0 0 0 4 4 4

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - 2 - LOC ALL RIGHTS RESERVED. R E V IS IO N S CE 6 DESCRIPTION B WARRANTY LABEL JS 18JAN1' REVISE PER ECO-1 1-001205 JS D D PLUNGER & GROMMET MATERIAL: PLASTIC

GR 1816

Contextual Info: 3 4 T H IS D R A W IN G IS U N P U B L IS H E D . R ELEASED FO R ALL C O P Y R IG H T BY TYCO E L E C T R O N IC S P U B L IC A T IO N R IG H T S - 2 , - R E V IS IO N S RESERVED. C O R P O R A T IO N . D E S C R IP T IO N PER 04NOV03 JR GP KK HMR 18JAN10

traytray

Abstract: INNER CARTON LABEL
Contextual Info: 107-68135 Packaging 18Jan10 Rev D Specification M III SOCKET VERTICAL 90P DIP TYPE DIMM SOCKET 1. PURPOSE 目的 Define the packaging specifiction and packaging method of M III SOCKET VERTICAL 90P DIP TYPE (DIMM SOCKET) product. 订定 M III SOCKET VERTICAL 90P DIP TYPE (DIMM SOCKET) 产品之包装规格及包装方式。

23AT4-T2

Contextual Info: F O - 5 5 1 1 1 -A HONEYWELL P A R T NUMBER REV DOCUMENT 7 0010576 CHANGED AS BY CHECK 18JAN05 AK 23AT4-T2 FAA - PMA ^ -N C TO C CIR CUITS MADE BOTH SWITCHES (M A IN T A IN E D POSITION) NO TO C CIRCUITS MAOE (BOTH SWITCHES) (MOMENTARY POSITION) .072 WIDE X . 0 3 8 DEEP KEYWAY

Contextual Info: 2 TH I S DRAW ING IS U NP UBL I S HE D. COPYRI GHT I 999 BY TYCO E L E C T R O N I C S R E L E A S E D FOR P U B L I C A T I O N CORPORATION. ALL RIGHTS I 999 LOC AD RE S E RV E D. 10.00 TYP 2.50 TYP RAP ADDED GOLD P L A T I N G 11MAR2004 SUM RAP 18JAN2007

Contextual Info: 4 DRAWING THIS MADE IN THIRD DRAWI NG ANGLE IS UNPUBLISHED COPYRIGHT 2 3 PROJECTION RELEASED 19 BY ANP FOR PUBLICATION INCORPORATED. ALL LOC 19 INTERNATIONAL RIGHTS G RESERVED. D I ST 8 6 REV I 5 I ONS p F ZONE DESCR I P T I O N LTR 5 DATE 18JAN01 REV PER 0 G 3 A - 0 0 2 9 - 0 1

Contextual Info: n 8 7 THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION BY AMP INCORPORATED. COPYRIGHT 19 4 LOC ,19 DIST AD ALL RIGHTS RESERVED. REVISIONS 47 LTR DESCRIPTION DATE DUN APVD B REVISED PER ECN 0010-1625-95 18JAN96 JDL GPG -200. 56[7.896] 02.60 [. 1 03]

STR 456

Abstract: 1600626-X 1600616 1600616-X 1-292499-1 HDR 2x10
Contextual Info: 107-68703 Packaging Specification 18Jan10 Rev S MBXL HSG 1. PURPOSE 目的 Define the packaging specifiction and packaging method of MBXL HSG. 订定 MBXL HSG 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 PKG TYPE Part Number Description

usb plug

Abstract: "USB plug" MR500
Contextual Info: 107-68891 Packaging Specification 18Jan10 Rev B INDUSTRIAL USB PLUG KIT 1. PURPOSE 目的 Define the packaging specifiction and packaging method of INDUSTRIAL USB PLUG KIT. 订定 INDUSTRIAL USB PLUG KIT 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AF 50 R E V IS IO N S LTR H1 DESCRIPTION E C R - 07 —0061 13 REDRAWN DATE IN AUTOCAD DWN APVD HMR GP 18JAN 07 D D C .062

Si1303DL-T1-gE3

Abstract: sc70-3 PCB PAD SI1303D SOT-323 31 MOSFET sc-70 package pcb layout F MARKING 6PIN
Contextual Info: Si1303DL Vishay Siliconix P-Channel 2.5-V G-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) ID (A) 0.430 at VGS = - 4.5 V - 0.72 0.480 at VGS = - 3.6 V - 0.68 0.700 at VGS = - 2.5 V - 0.56 • Halogen-free According to IEC 61249-2-21 Definition

STP13NM60

Abstract: 13NM60 STD13NM60 STF13NM60 STU13NM60 stb13nm60 13nm60n STW1 STB13NM60N MJ430
Contextual Info: STx13NM60N N-channel 600 V, 0.28 Ω, 11 A MDmesh II Power MOSFET in D²PAK, DPAK, TO-220FP, I²PAK, TO-220, IPAK, TO-247 Features TAB Order codes VDSS @Tjmax RDS(on) max TAB 3 ID 1 3 1 STB13NM60N STD13NM60N STF13NM60N STI13NM60N STP13NM60N STU13NM60N

OPA695

Abstract: OPA2683 OPA2694 OPA658 OPA683 OPA684 OPA691 OPA694
Contextual Info: OPA694 SBOS319C − SEPTEMBER 2004 − REVISED NOVEMBER 2004 Wideband, Low-Power, Current Feedback Operational Amplifier FEATURES DESCRIPTION D D D D D D The OPA694 is an ultra-wideband, low-power, current feedback operational amplifier featuring high slew rate and

A115-A

Abstract: C101 SN74LVC1404 SN74LVC1404DCTR SN74LVC1404YZPR
Contextual Info: SN74LVC1404 OSCILLATOR DRIVER FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR www.ti.com SCES469D – AUGUST 2003 – REVISED JANUARY 2007 FEATURES • • • • • • • Available in the Texas Instruments NanoFree Package Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V

marking code CM

Abstract: marking code cl CMNT3904E CMNT3906E X10-4 cl 100 hie hre hfe
Contextual Info: CMNT3904E NPN CMNT3906E PNP ENHANCED SPECIFICATION COMPLEMENTARY FEMTOminiTM SILICON TRANSISTORS Central TM Semiconductor Corp. DESCRIPTION: The Central Semiconductor CMNT3904E/CMNT3906E Low VCE SAT NPN and PNP Transistors, respectively, are designed for applications where ultra small size and

RPIP-824-00

Abstract: CWT-1504 06090 CWT-1502 ANSI-J-STD-006 AWG 18 rpip-824 ansi-j-std-006 a solder wire
Contextual Info: SPECIFICATION CONTROL DRAWING Product Revision Product Name CWT-1501 A CWT-1502 A CWT-1503 A CWT-1504 A Product Dimensions øA L min min 1.5 0.060 1.5 (0.060) 2.3 (0.090) 2.3 (0.090) 2.8 (0.110) 2.8 (0.110) 3.8 (0.150) 3.8 (0.150) øB max 2.0 (0.080) 2.9 (0.115)

SON-10

Abstract: TPS71202 TPS71319 TPS71319DRCR TPS71319DRCT TPS71334 TPS71334DRCR TPS71334DRCT
Contextual Info: TPS71319 TPS71334 Actual Size 3 mm x 3 mm www.ti.com SBVS055A – DECEMBER 2004 – REVISED JANUARY 2005 Dual 250 mA Output, UltraLow Noise, High PSRR, Low-Dropout Linear Regulator with Integrated SVS FEATURES • • • • • • • • • • •