13000MHZ Search Results

FV1206-1

Abstract: FV1206 HFCN-8400 FV-1206-1 HFCN-1300 HFCN-1320 HFCN-1600 HFCN-1810 HFCN-1910 HFCN-2100
Contextual Info: HIGH PASS FILTERS Designer's Kit K2-HFCN+ MINI-CIRCUITS DESIGNER'S KITS THE SOLUTION ! case FV1206 case FV1206-1 Passband 950 to 13000MHz HFCN+ Features Wideband, 50Ω • LTCC Low Temperature Co-fired Ceramic • Small size L 0.12" x ( W ) 0.06" • Temperature stable

GX4001

Contextual Info: polyfet rf devices GX4001 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

GX4002

Contextual Info: polyfet rf devices GX4002 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

GX3441

Contextual Info: polyfet rf devices GX3441 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

GP1441

Contextual Info: polyfet rf devices GP1441 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

GP2001

Contextual Info: polyfet rf devices GP2001 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

Contextual Info: RF Inductors Coils Data Sheet 1 LQP02TN_02 Series 01005/0402 (inch/mm) General Film Thickness 0.1nH E-24 0.22mm Step max. Step Tight Tolerance Reflow RoHS OK c Dimensions c Packaging 0.2±0.02 Polarity Marking Code Packaging Minimum Quantity D ø180mm Paper Taping

LQP02TN

Abstract: LQP02TN*02 SERIES
Contextual Info: RF Inductors Coils Data Sheet 1 LQP02TN_02 Series 0402/01005 (mm/inch) General Film Thickness 0.1nH E-24 0.22mm Step max. Step Tight Tolerance Reflow RoHS OK c Dimensions c Packaging 0.2±0.02 Polarity Marking Code Packaging Minimum Quantity D ø180mm Paper taping

Contextual Info: RF Inductors Coils Data Sheet 1 LQP03TG_02 Series 0201/0603 (inch/mm) General Film Thickness 0.1nH E-12 0.33mm Step max. Step E-24 Tight Step Tolerance Reflow RoHS OK c Dimensions c Packaging 0.1 to 0.5nH 0.6 to 120nH Polarity Marking Colored Side Packaging

Contextual Info: RF Inductors Coils Data Sheet 1 LQP02TQ_02 Series 0402/01005 (mm/inch) General Film Thickness 0.1nH E-24 Hi 0.22mm Step max. Step Q Tight Tolerance Reflow RoHS OK c Dimensions c Packaging Code Packaging Minimum Quantity D ø180mm Paper taping 20000 B Packing in bulk

GP2441

Contextual Info: polyfet rf devices GP2441 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

LQP03TG7N5H02

Abstract: LQP03TG6
Contextual Info: RF Inductors Coils Data Sheet 1 LQP03TG_02 Series 0603/0201 (mm/inch) General Film Thickness 0.1nH E-12 0.33mm Step max. Step E-24 Tight Step Tolerance Reflow RoHS OK c Dimensions c Packaging 0.3±0.03 Polarity Marking Colored Side Code Packaging Minimum Quantity

GX2001

Contextual Info: polyfet rf devices GX2001 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

Contextual Info: CENTRAL TECHNOLOGIES Manufacturer of Passive Components Catalog Page Table of Contents . . . . . . . . . . . . . . . . . . . . .i-v RF Magnetics . . . . . . . . . . . . . . . . . . . . .1-16 Power Magnetics . . . . . . . . . . . . . . . . .17-65 Transformers . . . . . . . . . . . . . . . . . . . . .67-77

CAPACITOR TANTALUM 686D

Abstract: CTLQ1812NF military resistors catalog tv line transformer 22-35L smd zener diode color band LCD inverter 94v 0 TV flyback transformer pinout 9400MHz filter smd inductors 4.7uH 20A
Contextual Info: CENTRAL TECHNOLOGIES Manufacturer of Passive Components Catalog Page Table of Contents . . . . . . . . . . . . . . . . . . . . .i-v RF Magnetics . . . . . . . . . . . . . . . . . . . . .1-14 Power Magnetics . . . . . . . . . . . . . . . . .15-52 Transformers . . . . . . . . . . . . . . . . . . . . .53-64

GP1001

Contextual Info: polyfet rf devices GP1001 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

LQP03TG

Abstract: LQP03TG7N5H02 0.6nH
Contextual Info: RF Inductors Coils Data Sheet 1 LQP03TG_02 Series 0603/0201 (mm/inch) General Film Thickness 0.1nH E-12 0.33mm Step max. Step E-24 Tight Step Tolerance Reflow RoHS OK c Dimensions c Packaging 0.3±0.03 Polarity Marking Colored Side Code Packaging Minimum Quantity

GX2441

Contextual Info: polyfet rf devices GX2441 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

GX4441

Contextual Info: polyfet rf devices GX4441 General Description Polyfet's GAN on SiC HEMT power transistors contain no internal matching; making them suitable for both broadband and narrow band applications. The use of a thermally enhanced package enables this device to have superior heat dissipation

Contextual Info: RF Inductors Coils Data Sheet 1 LQW04AN_00 Series 03015/0804 (inch/mm) Wound Thickness General (No Shield) E-12 E-24 0.45mm Step max. Step Reflow RoHS OK c Dimensions c Packaging 0.4±0.05 0.06 -0.03 +0.09 0.8±0.05 Code Packaging Minimum Quantity D ø180mm Paper Taping

100-10L

Abstract: LQP02TQ LQP02TQ1N0C02
Contextual Info: RF Inductors Coils Data Sheet 1 LQP02TQ_02 Series 0402/01005 (mm/inch) General Film Thickness 0.1nH E-12 0.22mm Step max. Step E-24 Step Hi Q Tight Tolerance Reflow RoHS OK c Dimensions c Packaging Code Packaging Minimum Quantity D ø180mm Paper taping 20000