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    103IN Search Results

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    L-com Inc LCCA30710-3IN

    COAX CBL SMA TO CABLE 3"
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    DigiKey LCCA30710-3IN Bag 1
    • 1 $63.81
    • 10 $63.81
    • 100 $63.81
    • 1000 $63.81
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    Newark LCCA30710-3IN Bulk 1
    • 1 $52.03
    • 10 $52.03
    • 100 $52.03
    • 1000 $52.03
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    IBase Technology (USA) INA1607

    IBASE Technology Inc. Desktop Appliance for SD-WAN , Intel Amston Lake ATOM X7405C CPU,1x DDR5 non-ECC UDIMM ,6x GbE RJ45 w/ 1 Pair of Bypass, 2x Gbe SFP ports, 1x M.2 3052 B Key for LTE/5G (USB3.0+PCIe x1) with Dual SIM cards and 2x External Antennas, 1x mini PCIe slot w
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    Mouser Electronics INA1607
    • 1 $961.15
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    IBase Technology (USA) INA2205 (X7405C)

    IBASE Technology Inc. 1U Entry Level Network Security Server, Intel Amston Lake ATOM X7405C CPU,1x DDR5 non-ECC SODIMM ,6x GbE RJ45 w/ 1 Pair of Bypass, 2x Gbe SFP ports, 1x RJ45 Console port, 1x M.2 2242 M Key for Storage (SATA3) and 1x internal 2.5 SATA SSD/HDD, 2x USB3
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    Mouser Electronics INA2205 (X7405C)
    • 1 $740.88
    • 10 $689.86
    • 100 $689.86
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    IBase Technology (USA) INA7605 (NIC SKU)

    IBASE Technology Inc. 2U Performance network server,Dual Intel Xeon Sapphire Rapids-SP CPU socket w/C741 PCH,16x DDR5 ECC RDIMM ,1x RJ45 console port , 2x USB2.0,2x ports, 2x management ports(1 for IPMI,1 for MGMT port) , 1x PCIe Gen5 slot expansion ,1 M.2 B+M key slot,
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    Mouser Electronics INA7605 (NIC SKU)
    • 1 $4038.17
    • 10 $4038.17
    • 100 $4038.17
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    IBase Technology (USA) INA3605 Kit 1

    IBASE Technology Inc. NIC slot & Expansion slot: NONE (SC2INA3605-0A1100R)
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    Mouser Electronics INA3605 Kit 1
    • 1 $6.63
    • 10 $6.45
    • 100 $6.19
    • 1000 $5.05
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    103IN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    STM CL-80

    Abstract: P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 STM CL-80 P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB PDF

    duraseal

    Abstract: SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide
    Contextual Info: Performance and Reliability Characteristics of 1200 V, 100 A, 200oC Half-Bridge SiC MOSFET-JBS Diode Power Modules James D. Scofield and J. Neil Merrett Air Force Research Laboratory 1950 Fifth St WPAFB, OH 45433 937-255-5949 james.scofield@wpafb.af.mil James Richmond and


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    200oC duraseal SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide PDF

    STM CL-80

    Abstract: MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 STM CL-80 MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51 PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    PDF

    Philips SJA1000 standalone CAN

    Abstract: MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


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    P8xC591 Philips SJA1000 standalone CAN MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591 PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    PDF

    MHI-002

    Contextual Info: INTEGRATED CIRCUITS DAT P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


    Original
    P8xC591 MHI-002 PDF