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    103IN Search Results

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    L-com Inc LCCA30710-3IN

    COAX CBL SMA TO CABLE 3"
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    DigiKey LCCA30710-3IN Bag 1
    • 1 $70.27
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    RS LCCA30710-3IN Bulk 3 Weeks 1
    • 1 $60.00
    • 10 $60.00
    • 100 $52.12
    • 1000 $52.12
    • 10000 $52.12
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    Hubbell Wiring Device-Kellems SNAP2103INA

    SWITCH, SNAP, DEC,3W,15A120/277V, IV, NA
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    RS SNAP2103INA Bulk 18 Weeks 1
    • 1 $34.68
    • 10 $31.91
    • 100 $31.91
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    Sager SNAP2103INA
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    TE Connectivity 8516-103-KIT

    8516-103/-,INO4FOSMCCRL,KIT
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    TTI 8516-103-KIT Each 1
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    TE Connectivity ES2000-NO.1-C1-0-3IN

    SHRNK TUB 4:1 ADH .225X3IN 829131P021
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    Interstate Connecting Components ES2000-NO.1-C1-0-3IN 75,612
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    103IN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    STM CL-80

    Abstract: P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		P8xC591 STM CL-80 P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB PDF

    duraseal

    Abstract: SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide
    Contextual Info: Performance and Reliability Characteristics of 1200 V, 100 A, 200oC Half-Bridge SiC MOSFET-JBS Diode Power Modules James D. Scofield and J. Neil Merrett Air Force Research Laboratory 1950 Fifth St WPAFB, OH 45433 937-255-5949 james.scofield@wpafb.af.mil James Richmond and


    Original     		200oC duraseal SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide PDF

    STM CL-80

    Abstract: MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		P8xC591 STM CL-80 MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51 PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    Philips SJA1000 standalone CAN

    Abstract: MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		P8xC591 Philips SJA1000 standalone CAN MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591 PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    MHI-002

    Contextual Info: INTEGRATED CIRCUITS DAT P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		P8xC591 MHI-002 PDF