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    L-com Inc LCCA30710-3IN

    RF Cable Assemblies SMA Female 2 Hole Flange to Unterminated Lead Cabl
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics LCCA30710-3IN
    • 1 $70.27
    • 10 $65.88
    • 100 $61.66
    • 1000 $61.66
    • 10000 $61.66
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    Newark LCCA30710-3IN Bulk 1
    • 1 $69.46
    • 10 $60.91
    • 100 $55.76
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    RS LCCA30710-3IN Bulk 3 Weeks 1
    • 1 $60.00
    • 10 $52.12
    • 100 $52.12
    • 1000 $52.12
    • 10000 $52.12
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    Hubbell Wiring Device-Kellems SNAP2103INA

    |Hubbell Wiring Devices SNAP2103INA
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    Newark SNAP2103INA Bulk 1
    • 1 $43.86
    • 10 $43.86
    • 100 $36.11
    • 1000 $34.89
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    RS SNAP2103INA Bulk 18 Weeks 1
    • 1 $34.68
    • 10 $31.91
    • 100 $31.91
    • 1000 $31.91
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    3M Interconnect 7010397103

    Headers & Wire Housings .100/.295 3 PIN HDR STR
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    TTI 7010397103 Each 612 1,008
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    • 10000 $0.41
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    TE Connectivity 8516-103-KIT

    8516-103/-,INO4FOSMCCRL,KIT
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    TTI 8516-103-KIT Each 1
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    Amphenol Corporation HVSLC632062C103I

    Automotive Connectors 2 POLE STRAIGHT PLUG
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    TTI HVSLC632062C103I Kit 10
    • 1 -
    • 10 $17.07
    • 100 $16.90
    • 1000 $12.85
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    103IN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    STM CL-80

    Abstract: P87C591VFA 8xC591 80C51 P83C591 P83C591VFA P83C591VFB P87C554 P87C591 P87C591VFB
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		p8xc591stm cl-80p87c591vfa8xc591+780c51p83c591p83c591vfap83c591vfbp87c554p87c591p87c591vfb PDF

    duraseal

    Abstract: SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide
    Contextual Info: Performance and Reliability Characteristics of 1200 V, 100 A, 200oC Half-Bridge SiC MOSFET-JBS Diode Power Modules James D. Scofield and J. Neil Merrett Air Force Research Laboratory 1950 Fifth St WPAFB, OH 45433 937-255-5949 james.scofield@wpafb.af.mil James Richmond and


    Original     		200ocdurasealsic igbt high power modulessic wafer 100 mm+7wacker silicones28cu72agwacker100cparallel mosfetcree sic mosfetsilicon carbide PDF

    STM CL-80

    Abstract: MHI001 Philips ID27 8xC591 MHI009 sm 0038 ir receiver MHI002 Microcontroller Based Automatic Railways Signaling P87C591SFB 80C51
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		p8xc591stm cl-80mhi001philips id27+78xc591mhi009sm 0038 ir receivermhi002microcontroller based automatic railways signalingp87c591sfb80c51 PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		tungsten slug glass diodeceramic pin grid array wire lead frame28f001bx28f010+428f020a5637a5609performance characteristics of ic packages PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		a56203g call flowsensor cement capacitorcq diode databook+6tsop ir sensorslotted optical switchinductive displacement sensorsside brazed ceramic dual-in-line packagesschematic inductive proximity sensorschematic ac inductive proximity sensor PDF

    Philips SJA1000 standalone CAN

    Abstract: MHI-002 80C51 P80C591 P80C591SFA P80C591SFB P83C591 P83C591SFA P87C554 P87C591
    Contextual Info: INTEGRATED CIRCUITS DATA SHEET P8xC591 Single-chip 8-bit microcontroller with CAN controller Objective Specification File under Integrated Circuits, IC20 1999 Aug 19 Philips Semiconductors Objective Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		p8xc591philips sja1000 standalone canmhi-00280c51+7p80c591p80c591sfap80c591sfbp83c591p83c591sfap87c554p87c591 PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		a5625-01a5620land pattern for tsop 2-86a5609+628f001bx28f01028f020outline of the heat sink for theta jca5644-01intel 24 pin ceramic dual-in-line package PDF

    MHI-002

    Contextual Info: INTEGRATED CIRCUITS DAT P8xC591 Single-chip 8-bit microcontroller with CAN controller Preliminary Specification File under Integrated Circuits, IC28 2000 Jul 26 Philips Semiconductors Preliminary Specification Single-chip 8-bit microcontroller with CAN controller


    Original     		p8xc591mhi-002 PDF