1.4MM PITCH BGA Search Results

SF-BGA228B-B-11

Abstract: BGA228B 1.4mm pitch BGA
Contextual Info: D Package Code: BGA228B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

2032VE

Abstract: 2128VE BGA OUTLINE DRAWING PB1107 Lattice Package Dia
Contextual Info: Product Bulletin December 1998 #PB1107 Lattice Introduces Advanced Chip Array and Fine Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA ball grid array packages for its ISP logic devices. The first

SF-BGA100C-B-62

Contextual Info: 10mm [0.394"] Top View 1.4mm [0.055"] Ordering Information: 1.4mm [0.055"] Solder Ball Alloy Part Number Suffix Sn63Pb37 0.8mm typ. -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 7.2mm square [0.283"] Side View Detail A Detail A 2 2.83mm [0.112"]

BGA-56 DATASHEET

Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Contextual Info: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3

bga 7x7

Abstract: G6006
Contextual Info: DESCR IPTO R LTR. DATE A NEW DRAWING APPROVED 3 /0 0 H U Al B A L L P A D C O R N E R Al BALLPAD CORNER 7 0.80 r^ 6 5 4 3 2 1 o oo o o o \ A E ^ o oo o o o o o o o Ed « o o o o oo oo oo oo o o o o oooo c oo oo oo oo D E F G tk 0.80 •1.10 REF TOP VIEW 1.40±0.10

BGA and QFP Package mounting

Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Contextual Info: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,

BGA reflow guide

Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
Contextual Info: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which

oki naming format

Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Contextual Info: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by

Marvell 8686

Abstract: W2CBW003 W2SW0001 802.11 sensitivity dbm W2CBW003-001 W2CBW003-T SC2443 samsung bluetooth OFDM receiver 802.11 Marvell
Contextual Info: W2CBW003 - Specifications TM W2CBW003 - 802.11 b/g +Bluetooth System-in-Package The W2SW0001 is a complete 802.11 b/g plus Bluetooth v2.0 + EDR radio solution based on the industry standard Marvell 8686 and Cambridge Silicon Radio architectures. Designed for handheld or portable warehousing/logistics, medical,

NC7SZ74

Abstract: 16862 FSTU16211 FSTU162211 FSTU162450 FSTU16345 FSTU16861 FSTU3125 FSTU32160 FSTU32160A
Contextual Info: Fairchild Interface & Logic Notebook Solutions Superior Performance Solutions Low Voltage Logic Switches TinyLogic Optoelectronics Smaller Packaging Solutions MicroPak™ Ball Grid Array BGA Analog Discrete Interface & Logic Applications Docking station bus switch isolation

S30ML01GP

Abstract: S30ML512P S29PL127N S29PL-N S30ML-P S75PL127NBF S75PL-N S30ML01 tray matrix bga
Contextual Info: S75PL-N MirrorBit ORNAND™ MCPs Stacked Multi-Chip Product MCP S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write, Page-mode Flash Memory (NOR Interface) S30ML-P: ORNAND Flash (NAND Interface) 3V pSRAM S75PL-N MirrorBit™ ORNAND™ MCPs Cover Sheet

Contextual Info: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.

Contextual Info: CY7C1380DV25 CY7C1382DV25 PRELIMINARY 18-Mbit 512K x 36/1M x 18 Pipelined SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200, and 167 MHz • Registered inputs and outputs for pipelined operation

Contextual Info: Š HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.

4833

Abstract: 70V3379 A12L A13L A14L IDT70V3379 IDT70V3379S
Contextual Info: Š HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.

4833

Abstract: A14L 70V3379 A12L A13L IDT70V3379 IDT70V3379S
Contextual Info: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.

X0607

Contextual Info: HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.

Contextual Info: Š HIGH-SPEED 3.3V 32K x 18 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 4.2/5/6ns max.

NAND512-M

Abstract: BGA149
Contextual Info: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • ■ Multi-Chip Packages – 1 die of 256 Mbit, 512 Mbit (x8/ x16) NAND Flash + 1 die of 256 Mbit (x16) SDR

BGA bga 10x13

Abstract: NAND FLASH BGA st nand flash application note BGA137 MCP NAND DDR NAND512-M NAND01G-M NAND256-M NAND256R3M0
Contextual Info: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR

TFBGA137

Abstract: BGA137 BGA bga 10x13 MCP NAND DDR NAND FLASH BGA zc 409 NAND512-M NAND01G-M NAND256-M NAND256R3M0
Contextual Info: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP Features • ■ Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR LPSDRAM

Contextual Info: CY7C1386DV25 CY7C1387DV25 PRELIMINARY 18-Mbit 512K x 36/1M x 18 Pipelined DCD Sync SRAM Functional Description[1] Features • Supports bus operation up to 250 MHz • Available speed grades are 250, 200 and 167 MHz • Registered inputs and outputs for pipelined operation

BGA149

Abstract: TFBGA149 BGA107
Contextual Info: NAND256-M NAND512-M, NAND01G-M 256/512Mb/1Gb x8/x16, 1.8/3V, 528 Byte Page NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP PRELIMINARY DATA Feature summary • ■ Multi-Chip Packages – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR