09APR2001 Search Results

09APR2001 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
V23601-A1227-E1 Abstract: T116 Contextual Info: 3 THIS DRAWING IS UNPUBLISHED. C O P Y R I G H T 20 0 0 RELEASED BY TYCO ELECTRONICS FOR C O R P O R A T I O N . AL L 2000 PUBLICATION RIGHTS LOC RESERVED. REV ISIONS D 1ST QW LTR DESCRIPTION A1 17.9 DATE DWN APVD SR10-0146-G1 09APR2001 CM KM SR10-0497-02	OCR Scan	sr10-0146-01 sr10-0497-02 09apr2001 22nov2002 +5v23601-a1227-e1 04apr2001 apr2001 3imar20 t116	PDF
84-1lmis Abstract: mold compound AND S6300H bond 84-1-lmis-r4 Contextual Info: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview	Original	add-05457xxxeak 06-dec-2000 09-apr-2001 84-1lmisr4 +6s6300h r004-0003 84-1lmis mold compound and s6300h bond 84-1-lmis-r4	PDF

Catalog Datasheet

Type

Document Tags

PDF

V23601-A1227-E1

Abstract: T116
Contextual Info: 3 THIS DRAWING IS UNPUBLISHED. C O P Y R I G H T 20 0 0 RELEASED BY TYCO ELECTRONICS FOR C O R P O R A T I O N . AL L 2000 PUBLICATION RIGHTS LOC RESERVED. REV ISIONS D 1ST QW LTR DESCRIPTION A1 17.9 DATE DWN APVD SR10-0146-G1 09APR2001 CM KM SR10-0497-02

OCR Scan

sr10-0146-01 sr10-0497-02 09apr2001 22nov2002 +5

PDF

84-1lmis

Abstract: mold compound AND S6300H bond 84-1-lmis-r4
Contextual Info: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview

Original

add-05457xxxeak 06-dec-2000 09-apr-2001 84-1lmisr4 +6

PDF