BOND Search Results
BOND Datasheets (9)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| BOND PLY 660P 11X12"" | The Bergquist Company | THERM PAD 304.8MMX279.4MM W/ADH | Original | 64.25KB | |||
| BOND PLY 660P 11X12"" | The Bergquist Company | THERM PAD 304.8MMX279.4MM W/ADH | Original | 76.79KB | |||
| BOND PLY 660P 11X12" | Bergquist | Thermal - Pads, Sheets, Fans, Thermal Management, THERMAL TAPE DOUBLE SIDED .008" | Original | 1 | |||
| HEXSET-INCH | Bondhus | HEX WRENCH SET - INCH | Original | 83.78KB | 1 | ||
| HEXSET-INCH-CLR | Bondhus | COLOR CODED INCH HEX WRENCH SET | Original | 92.24KB | 1 | ||
| HEXSET-INCH-FOLD | Bondhus | FOLDABLE HEX WRENCH SET - INCH | Original | 93.27KB | 1 | ||
| HEXSET-METRIC | Bondhus | HEX WRENCH SET - METRIC | Original | 82.51KB | 1 | ||
| HEXSET-METRIC-CLR | Bondhus | COLOR CODED METRIC HEX WRENCHES | Original | 86.07KB | 1 | ||
| HEXSET-METRIC-FOLD | Bondhus | FOLDABLE HEX WRENCH SET - METRIC | Original | 85.65KB | 1 |
BOND Price and Stock
ITT Interconnect Solutions Z01907-BONDConn Circular F 14 POS Solder ST Cable Mount 14 Terminal 1 Port Automotive |
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ITT Interconnect Solutions Z18347-BONDConn Bayonet M 2 POS Solder ST Cable Mount 2 Terminal 1 Port |
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ITT Interconnect Solutions Z04467-BONDConn Bayonet M 54 POS Solder ST Cable Mount 54 Terminal 1 Port |
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ITT Interconnect Solutions Z74969-BONDCircular Connector - Receptacle - Male Pins - 20 Position - Shell Size-Insert 28-16 - Bayonet Lock - Solder Cup - Rear Panel Mount. |
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ITT Interconnect Solutions Z03092-BONDCircular Connector - Receptacle - Male Pins - 7 Position - Shell Size-Insert 24-27 - Bayonet Lock - Solder Cup - Panel (Flange) Mount. |
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BOND Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
zener diode c12
Abstract: ZENER SINGLE COLOR CODE c12 zener zener diode code color zener c12 MARKING band color code zener
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Original |
1n4728g-1n4758gdo-4156voltsmil-std-202+7 | |
161000F00000
Abstract: 4949G heat staking
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Original |
4949g4950g4951g4952g+3 | |
5SMY 12J1721Contextual Info: Data Sheet, Doc. No. 5SYA 1325-01 12 01 5SMY 12J1721 IGBT-Die VCE = 1700 V IC = 75 A Ultra low loss thin IGBT die Highly rugged SPT+ design Large bondable emitter area Passivation: Silicon Nitride plus Polyimide Maximum rated values 1 Parameter Collector-emitter voltage |
Original |
12j1721ch-56005smy 12j1721 | |
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Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-6 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 1040 520 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 4045 408 010 130 C, 85 % RH 0.00 |
Original |
m200308-may-12 | |
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Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR DPAK, TO-252, TO-251 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 40 20 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 1691 169 100 130 C, 85 % RH |
Original |
o-252o-251m200308-may-12 | |
driver photodiode rx
Abstract: driver photodiode tia PHY1095 1.25G ROSA optical pickup unit connections PHY1095-01DS-WR PHY1095-01DS-FR PHY1095-01 pdc1
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Original |
phy1095-0125gbps-32dbmphy1095+8 | |
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Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-89 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 160 80 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 1705 180 500 130 C, 85 % RH 0.00 0.00 |
Original |
sc-89m200308-may-12 | |
connector cross reference
Abstract: UL444 1533* belden 7929A0101000
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Original |
1-800-belden1200mhz100basetx100basevg+10 | |
thermoelectric generator
Abstract: Generator Seebeck Seebeck generator eTEG thermoelectric THERMOELECTRIC POWER GENERATOR Nextreme Thermal Solutions NGA-1004850-0304A-W
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Original |
nga-1004850-0304a-wnga-1004850-0304a-aaps0017thermoelectric generator+6 | |
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Contextual Info: Silicon Switching Diodes 1N4150, 1N4150-1 & 1N3600 Features • Available in JAN, JANTX, and JANTXV per MIL-PRF-19500/231 • Metallurgically Bonded • Hermetically Sealed • Double Plug Construction Maximum Ratings Operating & Storage Temperature: -65°C to +175°C |
Original |
1n41501n4150-11n3600mil-prf-19500/231 | |
RJ45 5e connectorContextual Info: Detailed Specifications & Technical Data ENGLISH MEASUREMENT VERSION E500003 Cord Sets - DataTuff Cat 5e IP67 RJ45 Cord Set For more Information please call 1-800-Belden1 Description: 3 meter 9.8 ft. , unshielded with solid conductors (ref: Belden Bonded-Pair Cable 7923A). Cable Rating |
Original |
e5000031-800-belden1566-e500003010b32010b32+1 | |
E500002
Abstract: belden rj45 connector
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Original |
e5000021-800-belden1566-e500002010b40010b40+1 | |
E85381Contextual Info: RAYCHEM Tubing Products 1 CGAT Heat-shrinkable Tubing Adhesive-Lined, Flexible, Polyolefin Heat-Shrinkable Tubing Product Facts 3:1 Shrink ratio High-strength bonding • Moisture-proof ■ Environmental sealing ■ RoHS compliant ■ ■ Specifications/Approvals |
Original |
e85381 | |
1n5551
Abstract: 1n5552
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Original |
1n55501n5552mil-std-7501n5551+1 | |
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IEC, cyclic moisture resistance test
Abstract: IEC60286-1
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Original |
2002/95/ec18-jul-08iec, cyclic moisture resistance testiec60286-1 | |
APD0810-203
Abstract: APD1510 APD0510-210
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Original |
apd0505-000200075mapd0810-203apd1510+1 | |
LR38595
Abstract: RS-433
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Original |
ul508gnr35dhzgnr35bhzgnr35ahz+8 | |
AWM 2651 VW-1 300V
Abstract: 2651 300V 14 pin AWM 2651
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Original |
ts-0247-bria-2217b-eawm 2651 vw-1 300v2651 300v 14 pin+1 | |
w13002
Abstract: 03352 W1-300
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Original |
nm1-3216twc4-01004inchw13002width10msec+2 | |
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Contextual Info: NM1-AYL1-01 Package outlines 2 RECOMMEND PAD LAYOUT 1 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ITEM MATERIALS Resin Epoxy Bonding Wire Ø 25 µm Au Lens color Water transparent Dice AlGalnP Emitted color Yellow NOTES: 1. All dimensions are in millimeters inches ; |
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nm1-ayl1-01008inchwidth10msec | |
NTE621Contextual Info: NTE621 Silicon Rectifier, General Purpose, High Voltage, Standard Recovery Surface Mount Features: D High Temperature Metallurgically Bonded D Glass Passivated Junction D High Temperature Soldering Guaranteed: +450°C/5 Seconds at Terminals. Complete Device Submersible Temperature of |
Original |
nte621 | |
microwave short protector
Abstract: UM9989SM diode mri power UM9989B UM9989
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Original |
um9989compatibl07um9989bum9989sm+2 | |
1N649-1
Abstract: 1N649 JANTX
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Original |
1n649-1mil-prf-19500/240500mw400ma+4 | |
ms8351Contextual Info: GaAs Schottky Diodes TM Low CT Series Pair MS8351 – P2819 Flip Chip GaAs Schottky: Series Pair – Low Capacitance Design Dimensions Size: 28 x 19 mils Thickness: 5 mils Bond Pad Size: 5 x 5 mils Features ● Capacitance 45 fF Typ. ● Low Series Resistance (7 Typ.) |
Original |
ms8351p2819p0105x10-13 | |