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    84-1lmis

    Abstract: mold compound AND S6300H bond 84-1-lmis-r4
    Contextual Info: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview


    Original     		add-05457xxxeak06-dec-200009-apr-200184-1lmisr4+6s6300hr004-000384-1lmismold compound and s6300hbond84-1-lmis-r4 PDF

    84-1lmis

    Abstract: 84-1LMISR4
    Contextual Info: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-51928XXXEPN Effective : 27-SEP-2000 14:46:03 Package : EPN 40 LEAD PDIP Metal ID : Issue : 0 Status : RELEASED Scale : 20X Printed : 14-MAY-2001 08:56:04 EST PLASTIC_PKG Data as of 14-MAY-2001 08:56:27 by sherpa at farview


    Original     		add-51928xxxepn27-sep-200014-may-200184-1lmisr4+3s6300hr004-004184-1lmis PDF