06DEC2000 Search Results

06DEC2000 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
108-18214 Contextual Info: BY TYCO ELECTRONICS R E L E A S E D FOR P U B L I C A T I O N FREI F U E R VE R O E F F E M T L I CHUNG CORPORATION. ALL RIGHTS RESERVED. Al I F R F C H T F V O R R F H A I T F N I9 - MAT ED W I T H : P A S S E N D ZU: LOC A 37+0.0 5 1 REV S IONS D 1S T AENDERUNGEN	OCR Scan	eg00-2749-00 06dec2000 27mar200 nov200 +1108-18214	PDF
84-1lmis Abstract: mold compound AND S6300H bond 84-1-lmis-r4 Contextual Info: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview	Original	add-05457xxxeak 06-dec-2000 09-apr-2001 84-1lmisr4 +6s6300h r004-0003 84-1lmis mold compound and s6300h bond 84-1-lmis-r4	PDF

Catalog Datasheet

Type

Document Tags

PDF

108-18214

Contextual Info: BY TYCO ELECTRONICS R E L E A S E D FOR P U B L I C A T I O N FREI F U E R VE R O E F F E M T L I CHUNG CORPORATION. ALL RIGHTS RESERVED. Al I F R F C H T F V O R R F H A I T F N I9 - MAT ED W I T H : P A S S E N D ZU: LOC A 37+0.0 5 1 REV S IONS D 1S T AENDERUNGEN

OCR Scan

eg00-2749-00 06dec2000 27mar200 nov200 +1

PDF

84-1lmis

Abstract: mold compound AND S6300H bond 84-1-lmis-r4
Contextual Info: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview

Original

add-05457xxxeak 06-dec-2000 09-apr-2001 84-1lmisr4 +6

PDF