0340 Search Results

n117

Contextual Info: DS3F Device DS3 Framer TXC-03401B DATA SHEET • DS3 payload access, bit-serial or nibble-parallel • C-bit parity or M13 operating mode • C-bit interface 13 C-bits in, 14 out • Detect and generate DS3 AIS, and idle signals • Transmit reference generator for serial operation

Contextual Info: SD-35955-0320 DWG. NO. NOTES MATERIAL o ISIM ILA R ITEM o o If 0-1- - - 35955-0320 NYLON : U L94V -2) 35955-0340 ( PBT : UL94V-0) 35955-0360 (NYLON : UL94V-0) (GLASS FILLED) COLOR : NATURAL MATING HOUSING : .250 RECEPTACLE H0USING-3P 35955-0310(NYLON : U L94V -2)

KAI-0340

Contextual Info: KAI-0340 IMAGE SENSOR 640 H X 480 (V) INTERLINE CCD IMAGE SENSOR JULY 11, 2014 DEVICE PERFORMANCE SPECIFICATION REVISION 1.1 PS-0024 KAI-0340 Image Sensor TABLE OF CONTENTS Summary Specification . 5

Contextual Info: DS3F Device DS3 Framer TXC-03401 DATA SHEE T FEATURES DESCRIPTION • DS3 payload access, bit-serial or nibble-parallel • C -bit parity or M 13 operating m ode • C -bit interface 13 C -bits in, 14 out • Detect and generate D S3 AIS, and idle signals

Contextual Info: Product Number: 0340-0-15-01-34-27-10-0 Description: 0340 - Receptacle With No Tail Accepts .032-.046 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0340-0-15-01-34-27-10-0 200 - 300 µ" Tin/Lead over Nickel

Contextual Info: Product Number: 0340-0-15-01-34-01-10-0 Description: 0340 - Receptacle With No Tail Accepts .032-.046 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0340-0-15-01-34-01-10-0 200 - 300 " Tin/Lead over Nickel

A03403

Abstract: marking alpha omega 03403 A3 MARKING CODE
Contextual Info: Document No. K n rJ ALPHA & OMEGA SEMICONDUCTOR Version G Title A 03403 Marking Description SOT-23 PACKAGE MARKING DESCRIPTION NOTE: P - Package and product type N - Last digital of product number W - Week code A - Assembly location code L&T - Assembly lot code

A03402

Contextual Info: Document No. K n rJ ALPHA & OMEGA SEMICONDUCTOR Version G Title A 03402 Marking Description SOT-23 PACKAGE MARKING DESCRIPTION NOTE: P - Package and product type N - Last digital of product number W - Week code A - Assembly location code L&T - Assembly lot code

Contextual Info: Product Number: 0340-0-15-15-34-01-10-0 Description: 0340 - Receptacle With No Tail Accepts .032-.046 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0340-0-15-15-34-01-10-0 10 " Gold over Nickel 200 - 300 μ" Tin/Lead over Nickel

NFC93425

Abstract: AMPHENOL 24W7P TW98 0 A514 RM84 13W6 53742 24W7 17D429SP
Contextual Info: TW98/06/0340VA21/11/0015:31Page1 TW Specifications UL file: E64911 - CSA file: LR57744 Connectors according to: MIL C24308 - NFC93425 - HE507 Electrical Data Shells Steel - Tin plating or yellow chromate Current rating Signal contacts Insulators High temperature black thermoplastic

Contextual Info: Product Number: 0340-0-15-15-34-27-10-0 Description: 0340 - Receptacle With No Tail Accepts .032-.046 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0340-0-15-15-34-27-10-0 10 " Gold over Nickel 30 μ" Gold over Nickel

Silicon Photodiode Chip

Abstract: PD034
Contextual Info: SILICON PHOTODIODE CHIPS DEVICE NO. : PD-0340 1. Scope : This specification applies to PN silicon photodiode chips, Device NO. PD-0340. 2. Structure : 2-1. Planar type : PN Diode. 2-2. Electrodes : Top side Anode : Aluminum alloy . Back side ( Cathode ) : Gold alloy.

26c64

Abstract: 28C64 EEPROM 28C64 plcc eeprom 28c64 28C64I 28c64 ram 28C64 military 28C648 28c64 28c64 833
Contextual Info: 3890002 MICROCHIP TECHNOLOGY GENL INC GENERAL INSTRUMENT IN S T R / S3 D 28C64 MICROCHIP 83D blG3201 03404 03404 2 PlRELOIMfllMAIRV DM FO M ATO O IM 64K 8K x 8 CMOS Electrically Erasable PROM FEATURES • Fast Read Access Time — 150 ns ■ High Performance CMOS Technology for Low

Contextual Info: 4 THIS DRAWING 7 IS C O P Y R IG H T U N P U B L IS H E D . RELEASED BY 19 2 3 AMP IN COR PO RA TE D. FOR PUBLICATION ALL R IG H T S ,19 LOC R ES ER V ED . D IS T revision 24 EY DESCRIPTION L TR REV; T IN D : EC PLATED 0340-0009-03 BRASS ON PINK STRIPED

DS3RT

Abstract: CERAMIC LEADLESS CHIP CARRIER TXC-02001
Contextual Info: NOV 1 9 1999 DS3F DEVICE DS-3 FRAMER TXC -03401 DATA SHEET SUMMARY TranSwitch 1990 Description Features Patents Pending •■ - The DS3F is a single-device bridge between wideband dafa sources and DS-3 signals compatible with the public network. It does all of the work of synchronizing to a DS-3 signal and

0279560000

Abstract: SAK16 SAK95
Contextual Info: Product catalogue | Terminals | Screwing technology | SAK-series modular terminals | Accessories | Visual separation / side covers | AP end cover plates General ordering data Order No. Part designation Version EAN Qty. 0340960000 AP SAK70/35 Modular terminal, accessories, end plate and

H07V-R70

Abstract: DIN-46228
Contextual Info: Product catalogue | Terminals | Screwing technology | SAK-series modular terminals | TS 32 | Germin KrG | Modular feed-through terminals | 70 mm² General ordering data Order No. Part designation Version EAN Qty. 0340820000 SAK 70/32 KRG Feed-through terminal, 70 mm², Screw

Contextual Info: M39003/09-0340 aka M39003/09-0340 T262C476J020SS CSR21E476JS Capacitor, tantalum, 47 uF, +/-5% Tol, 20V@85C Dimensions mm Specifications ID Dimension Tolerance D L1 L2 F LL 7.34 17.42 20.88 0.64 38.1 +/-0.25 +/-0.79 +0 +/-0.05 +/-6.35 Manufacturer: Value:

828 B34

Abstract: xl 0840 datasheet MG73Q MG74Q MSM13Q MSM98Q MSM99Q 547 B38
Contextual Info: 0.35µm ASICs MSM13Q/14Q CBA Family Masterslices MSM13Q / 14Q Series I/O Pads Raw Gates Usable Gates [*] MSM13Q 3LM Usable Gates [*] MSM14Q (4LM) 0150 0230 0340 0530 0840 1020 144 176 208 256 320 352 157,192 242,400 346,176 536,400 847,048 1,033,000 105,319

computer schematic power supply circuit diagram

Abstract: circuit diagram for computer TXC-02001 layout diagram of microprocessor
Contextual Info: DS3F Evaluation Board Set DS3 Framer TXC-21005 PRODUCT INFORMATION FEATURES DESCRIPTION • Complete two-board test system for evaluating the TranSwitch DS3F device: - DS3F: DS3 Framer Device TXC-03401 A complete ready-to-use two-board test system that demonstrates the functions and features of the TranSwitch

TXC-03401-BIPL

Abstract: TXC-03401-AIPL TXC-03401B-PDR3A txc03401bipl
Contextual Info: TB-511 TECHNICAL BULLETIN DS3F VLSI Device, TXC-03401 Differences Between the “A” and “B” Versions of the DS3F Device PURPOSE OF THIS TECHNICAL BULLETIN TranSwitch is introducing a “B” version of the DS3F VLSI device, with general sample availability scheduled for the first quarter of 1997. This “B” version has some extended features and other functional differences relative to the current “A” version.

Contextual Info: DS3F Device DS3 Framer TXC-03401B FEATURES DESCRIPTION • DS3 payload access, bit-serial or nibble-parallel The DS3F is designed for DS3 framer applications in which broadband payloads are mapped into the 44.736 Mbit/s DS3 frame format. Although the C-bit parity format is recommended, the DS3F can also operate in the

CDBUR0320

Abstract: CDBUR0330 CDBUR0340 200MA 350 VOLTS diode smd diode 64 A
Contextual Info: SMD Schottky Barrier Diode COAtCHII’ S M D D io d e s S p e c ia lis t CDBUR0320/0330/0340 RoHs Device lO = 3 5 0 m A V r = 20 to 40 Volts Features 0 60 3 (1608) Low forward voltage. 0 .0 7 1 (1 .8 0 ) 0 .0 6 3 (1 .6 0 ) D e s i g n e d f o r m o u n t i n g on s m al l s u r f a c e .

Contextual Info: C PROJECT IOh 'PUBLISHED. b C L CDNNECTCR AM PEIN ITE MATES W I T H S ET I E5 . ANY 5 libv 'hi; be 0320 238 0/ RbV z’bR bC 0340-^48-98 RbV 3bR bC RE C E P TA G b E 5 . 08jjin C . 0 0 0 2 0 0 ] M I N T I N OVER 1 . 2 7 j j n M I N COPPER. U_ 9 4 V -0 R A TE D , P 0 E Y E 5 T E R , Bb AC K.