013G Search Results

CRM-011GB

Abstract: A142 CRM-012GB CRM-013GB
Contextual Info: Power Supplies CRM-GB Series AC Input Multi Output, Long Life FEATURES • Two floating type outputs. • Remote ON-OFF. • These low noise power supplies are CISPR standard compliant. PART NUMBERS AND RATINGS Part No. CRM-011GB CRM-012GB CRM-013GB Output current A

M83528

Abstract: WR340 flange dimensions OSD-6411A wr 2300 flange waveguide Waveguide Gaskets 20-03-3731-1212 CMR-137 WR137 gasket dimensions RG-106 wr 2300 waveguide flange
Contextual Info: CONDUCTIVE ELASTOMERS Waveguide Gaskets Waveguide Gaskets CHO-SEAL CHO-SEAL 1212 1239 SPECIFICATIONS Type Ref: MIL-G-83528 Volume Resistivity (ohm-cm, max) as supplied (without pressure-sensitive adhesive) K G 0.005 0.007 Hardness (Shore A ±5) 80 80 Specific Gravity (±0.25)

SC3416

Abstract: tt2202 2SA1371 2SC3790 2SC4732 2SC5291 2SA1829 2SC2857 2SC4075 TD-220F
Contextual Info: SA$iYO Transistors for TV Display Video Output Us P c i t u r c s ^Excellent HP characteristic. * S m ll reverse tn n sfer capacitaac*. *C c«*lei*ntiry WP and NW type*. ♦ Adoption of MBIT, FB€T processes. ^Highly resistant to d ie le c tric breakdown.

ABB time delay device for undervoltage release

Abstract: abb 1MRK 251 RTXP 18 841BA rxedk 004-BEN RAEDK-1 4 change over relays ABB rxtp RHGX
Contextual Info: Time over/undervoltage relay and protection assemblies RXEDK 2H and RAEDK 1MRK 509 004-BEN Page 1 Issued January 2004 Revision: A Data subject to change without notice SE970120 (SE970114) Features • Micro-processor based time-over/undervoltage relay with continuous settings for

XC141540P4

Contextual Info: M U I fJK U i-A SEMICONDUCTOR TECHNICAL DATA Product Preview Rev. 1.0 MONITOR ON SCREEN DISPLAY This is a high performance HCMOS device designed to interface with a micro controller unit to allow colored symbols or characters to foe displayed onto monitor screen. Its on-chip PLL allows both multisyi*

Contextual Info: Surface Mounting Device Bridge Diode IH O U T L IN E D IM E N S IO N S S1ZBD U nit ! mm Weight ! 0-13g ,1.2 600V 0.8A f .2 ^ , Standard soldering pad 7MAX 1.5to.2 1.5-0-21 , 3-8-0-2 -4 T . * I “ et '1 , s, J - | | 0-9to.2 -7Tol5l o.

Amdasm

Abstract: 2901a processor Am2901 AM2909 Am2904 AM-PUB073-4 DARB
Contextual Info: quanium electronics Box 391262 Bramley 2018 Build A Microcomputer Chapter IV The Data Path - Part II Advanced Micro Devices C l Advanced Micro Devices Build A Microcomputer Chapter IV The Data Path - Part II Copyright 1979 by Advanced Micro Devices, Inc.

S125

Abstract: VA2707J VA2707K VA2707S 3L50P QG01 51A 8PIN
Contextual Info: V i T C IN C 9388929 V D T C I N I ^3 0 0 1 5 ^ C 0 D D 1 2 ci t J 5 99D _ 0 1 2 9 6 _ V A 2707 DUAL HIGH-SPEED, FAST-SETTLING, HIGH OUTPUT CURRENT OPERATIONAL AMPLIFIER, A C L S 12 LSP FAMILY DATA SHEETS F E A TU R ES DIAGRAMS Dual In-Line Package 8]V+

Contextual Info: TC74ACT13 8 P/F/F N/FT TOSHIBA TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74ACT138P, TC74ACT138F, TC74ACT138FN, TC74ACT138FT 3 - T O - 8 L IN E Note The JEDEC SOP (FN) is not available in Japan D E C O D E R The TC74ACT138 is an advanced high speed CMOS 3 - to - 8

Contextual Info: TOSHIBA TC74AC174P/F/FN/FT TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74AC174P, TC74AC174F, TC74AC174FN, TC74AC174FT HEX D-TYPE FLIP FLOP WITH CLEAR The TC74AC174 is an advanced high speed CMOS HEX DTYPE FLIP FLOP fabricated with silicon gate and double layer m etal w iring C2MOS technology.

Contextual Info: V T C INC '9 3889 29 D | T3flflci2Ii 0 0 0 1 3 0 4 V T C INC 9 9D 01304 VA2717 T ' " 7 <? - 0 7 . ¿ o DUAL HIGH-SPEED, FAST-SETTLING, HIGH OUTPUT CURRENT OPERATIONAL AMPLIFIER, A q|_S 12 SHEETS FEATURES • Fast Settling Time: ±0.1% In 150ns • High Slew Rate:.105 V/^s

wt 7901

Abstract: 5f 6-pin SOIC C14SC VA707
Contextual Info: V T C INC •- 9 3 8 8 9 2 9 D I T 3 ñ ñ ci2Ií 0 0 0 1 3 0 4 V T C INC 99D 0 1 3 0 4 VA2717 D T ' " 7 <? - 0 7 . ¿ o SHEETS DUAL H IG H -SP E ED , FA ST-SETTLIN G , HIGH O UTPUT CURRENT OPERATIONAL AMPLIFIER, A q |_ S 12 FEATURES • Fast Settling Time: ±0.1% In 150ns

abb razoa

Abstract: razoa BC 114A 614-100 RXTUG21H 614-105E 614-100E 1MDB06006-EN power transformers major faults 1D111
Contextual Info: 1M DB06006-EN Page 1 March 1992 Changed since August 1990 Data subject to change without notice ABB Network Control & Protection 832610 Features A p plica tion •T h ree -p ha se and earth, three-zone sequen­ tial m easurem ent distance relay fo r over­

razoa

Abstract: abb razoa rakzb B03-2210E 614-108E B03-7012E ranza distance relay RXME ABB 614-300E
Contextual Info: ABB A SEA B R O W N B O V E R I ABB Relays Abstract Application Type RAZOA # Three-zone, phase and grOlind distance relay for transmission lines • Three-phase and ground, three-zone se­ quential measurement distance relay for overhead lines and cables • Independent X and R reach settings

0a70

Abstract: T7701 S125 VA2707J VA2707K VA2707S 3L50P 3L50 DS-032
Contextual Info: V i T C IN C 9388929 V D T C I N I ^3 0 0 1 5 ^ C 0 D D 1 2 ci t J 5 99D _ 0 1 2 9 6 _ V A 2707 DUAL HIGH-SPEED, FAST-SETTLING, HIGH OUTPUT CURRENT OPERATIONAL AMPLIFIER, A C L S 12 LSP FAMILY DATA SHEETS F E A TU R ES DIAGRAMS Dual In-Line Package 8]V+

KT201/600

Abstract: AN6153N AN6153NS 6P03 DM 321
Contextual Info: ICs for Telephone Panasonic A N 6153N , A N 6153N S Speech Network Circuits • Overview The AN6153N and AN6153NS are ICs for speech net­ work with excellent branch performance. It incorporates basic speech functions to meet with vari­ ous transmitters/receivers.

Contextual Info: TOSHIBA TC74AC139P/F/FN/FT TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74AC139P, TC74AC139F, TC74AC139FN, TC74AC139FT DUAL 2 - T O -4 LINE DECODER The TC74AC139 is an advanced high speed CMOS 2 - to - 4 LINE DECODER fabricated with silicon gate and double layer metal wiring C2MOS technology.

Contextual Info: TOSHIBA TC74AC175P/F/FN/FT TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74AC175P, TC74AC175F, TC74AC175FN, TC74AC175FT QUAD D-TYPE FLIP FLOP WITH CLEAR The TC74AC175 is an advanced high speed CMOS QUAD DTYPE FLIP FLOP fabricated with silicon gate and double layer metal wiring C^MOS technology.

sma3001

Abstract: SGF25
Contextual Info: SA\YO New Microwave Device Product Line P D C for P H S f o r t e r m ¡ n a ! 1.9 G H z te r m in a / ( 8 0 0 M H z ) P PW e r A m p . w * S P F2 020 A ¡ li t *I fitter SPM2001A * S MA 3Q A nt . S. W 2SC5534 Low > B uffer Amo «SMA30QI Noi«e Amp. Pupi«»«''

IDT5V50013

Contextual Info: DATASHEET IDT5V50013 LOW EMI CLOCK GENERATOR Description Features The IDT5V50013 generates a low EMI output clock from a clock input. The part is designed to dither the LCD interface clock for PDAs, printers, scanners, modems, copiers, and others. Using IDT’s proprietary mix of analog and digital

Contextual Info: smro SANYO Discrete Device Package Out 1ines unit:mm Sm all-S ig n al T r a n s i s t o r s Large-Signal T ra n sisto rs Outlines SMCP, MCP. CP, CP4/5/6, PCP, PCP4/5, XP5/6, TP, TP-FA, MFP6, S0P8 name SPA. NP, MP, NMP, FLP, TO-126, T0-126ML, T0-126LP ZP. SMP, SMP-FD, TO-220, T0-220ML, T0-220FI (LS). TO-220MF,

Germanium itt

Abstract: thyratron pl 21 Mallory Vibrator Data Book National Electronics ignitrons bat CR Li Mn lab test result Helipot POTENTIOMETER Bendix Transistors selenium rectifier westinghouse 5000W AUDIO AMPLIFIER 6cl6
Contextual Info: 1q5 OCZ CHICAGO, 5' Three Regional Conventions SHARE THOS Pleose Route COPY! to www.americanradiohistory.com ,titiSCON 1956 the replacement for tubular ceramic and mica capacitors RMC DISCAPS 520 .260 .860 .890 RMC RMC .570 .355 .400 1.290 .760 .790 RMC 470

Contextual Info: O K I Semiconductor MSM5117160_ 1,048,576-Word x 16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE DESCRIPTION The MSM5117160 is a new generation Dynamic RAM organized as 1,048,576-word x 16bit configuration. The technology used to fabricate the MSM5117160 is OKI's CMOS silicon gate process technology.

SB002-15SPA

Abstract: SB005-09CP SB005-09SPA SB01-15NP SB02-09CP SB02-09NP SB02-15 SB05-09 SB10-09T S0T143
Contextual Info: SAfiYO Small-Signal High-Voltage Schottky Barri er Diodes 2 S i n g l e T y p e S{: Mounted on ceramic board (250mm&#39; X 0.8mm) ☆: Mounted on Cu foil (16mm‘X 0.2mmt) on glass epoxy board 0:Refer to the individual catalogue of each product because the center part of PCP outline is completely