000150B Search Results

Contextual Info: Honeywell Military & Space Products 128K x 8 STATIC RAM—SOI HX6228 FEATURES RADIATION OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.7 |im Process (Lef1= 0.55 ^m) • Read/Write Cycle Times < 16 ns (Typical) <2 5 ns (-55 to 125°C) • Total Dose Hardness through 1x106 rad(Si02)

Contextual Info: Data Sheet 1.0 Amp FAST SWITCHING MEGARECTIFIERS Semiconductor Mechanical Dimensions JE D E C D O -4 1 § * t .080 X .1 0 7 .205 .16 0 . 1.0 0 M i n . 1 T _L 1 T ' Features • HIGH TEMPERATURE METALLURGY CALLY BONDED CONSTRUCTION ■ ■ SINTERED GLASS CAVITY-FREE

8-Pin JEDEC Small Outline "GR"

Contextual Info: ISSI 4,096-BIT SERIAL ELECTRICALLY ERASABLE PROM APRIL 1997 FEATURES OVERVIEW • State-of-the-art architecture — Non-volatile data storage — Low voltage operation: 3.0V Vcc = 2.7V to 6.0V — Full TTL compatible inputs and outputs — Auto increment for efficient data dump

Contextual Info: M 13E D evice DS3/DS1 MUX/DEMUX, Extended Features TXC-03303 DATA SHEET Preliminary .— = • Multiplexes/demultiplexes 28 DS1 signals into a DS3 signal. • M13 or C-bit parity mode operation • FEBE, C, or P-bit parity error insertion capability

KM3703

Abstract: 3702A km3702 KFC7 KM3701 3701A SSI541 tk80541
Contextual Info: 3bE » TOKO AMERICA INC w T ^ D b T b a s "dddisûs r « t a i 31 TOKO SEMICONDUCTORS Semiconductor & IC Applications fflüsu-K CO _l c o O m o E 3 z KM3701AD • KM3702AD KM3702AQ • KM3703D • Package For NC function generators linear, arc, parabolic, index, logarithmic,

XTAL78

Abstract: QDD1443 Z86C95 tda 2022 P2M SCR Z86C9524VSC
Contextual Info: P r e l im in a r y P r o d u c t S p e c if ic a t io n Z86C95 CMOS Z8 S ig n a l DIGITAL p r o c e s s o r _ FEATURES • Complete Microcontroller, 16 I/O Lines, and up to 64 Kbytes of Addressable External Space Each for Program and Data Memory

PS 307 5A

Abstract: 12 VOLT 100 AMP smps
Contextual Info: OM5262SA/RA/DA HERMETIC JEDEC TO-254AA HIGH EFFICIENCY, CENTER-TAP HIGH VOLTAGE RECTIFIER 24 Am p, 1000 Volt, 65 ns trr Soft Recovery FEATURES Soft Recovery Characteristics Hermetic Metal Package, JEDEC TO-254AA Very Low Forward Voltage Very High Reverse Voltage Capability

Contextual Info: im itti mi SEME IRFN044 LAB MECHANICAL DATA Dimensions in mm inches N-CHANNEL POWER MOSFET 11.5 60V 34A DSS 0.25 I D(cont) 3.0 0.040Q ^DS(on) FEATURES • HERMETICALLY SEALED SURFACE MOUNT PACKAGE • SMALL FOOTPRINT - EFFICIENT USE OF PCB SPACE. • SIMPLE DRIVE REQUIREMENTS

Contextual Info: OM5262SA/RA/DA HERMETIC JEDEC TO-254AA HIGH EFFICIENCY, CENTER-TAP HIGH VOLTAGE RECTIFIER 24 Amp, 1000 Volt, 65 ns trr Soft Recovery FEATURES Soft Recovery Characteristics Hermetic Metal Package, JE D E C TO-254AA Very Low Forward Voltage Very High Reverse Voltage Capability

Contextual Info: ç M/HITE /MICROELECTRONICS a 1Mx32 3.3V FLASH MODULE WF1M32B-XXX3 PRELIMINARY* FEATURES • A cce ss Times of 1 0 0 ,1 2 0 ,150ns ■ Packaging ■ • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180 inch)

Cordless Phone system block diagram

Abstract: W9310 BR10 W9310F W9320 WHT9360 BR0-BR15
Contextual Info: W9320 Winbond Electronics Corp. ADPCM CODEC Table of Contents- 1. G EN ERA L DESCRIPTIO N . 2

LH5028

Abstract: LJ sharp EL display LH1511 lh1512 lh5027 fcs lcd
Contextual Info: SHARP CORP b-GE D • 01007^ OGGTSQS ÔST « S R P J T LH1511/LH1512 ■ Description 2 - I 3 - I { 100-0utput Common Driver/ 80-0utput Segment Driver Pin Connections The LH1511 is a 100-output LCD common driver, and its bidirectional data I/O pins provide four kinds of data

TDA1553Q

Abstract: tda 15530 loudspeaker
Contextual Info: TDA1553Q J V _ 2 X 22 W BTL STEREO CAR RADIO POWER AMPLIFIER WITH LOUDSPEAKER PROTECTION G E N E R A L D E S C R IP T IO N T h e T D A 1 5 5 3 Q is an in teg rated class-B o u tp u t a m p lifie r in a 13-lead s in g le -in -lin e SI L> p la s tic p o w e r

suzuki DT4

Abstract: fd 20049 pc 525 R300F TXC-03303-MB DS200F3 llb10 dt28 mod 4 counter SU-210
Contextual Info: M 13E D e vice DS3/DS1 MUX/DEMUX, Extended Features TXC-03303 DATA SHEET Preliminary • Multiplexes/demultiplexes 28 DS1 signals into a DS3 signal. • M13 or C-bit parity mode operation • FEBE, C, or P-bit parity error insertion capability • DS3 idle signal generators

WB6S

Abstract: Cordless Phone system block diagram AXOV
Contextual Info: W9320 Winbond Electronics Corp. ADPCM CODEC Table o f Contents1. GENERAL DESCRIPTION. 2 2.

j13000

Abstract: dram 4mx4 DD01B J1-30004-A LM 327 CN til 702 datasheet 4lc4m4e0 4c4m4 29SF
Contextual Info: H igh P erform an ce 4M x4 CMOS DRAM « II Features • Organization: 4,194,304 words x 4 bits • High speed A S4C 4M 4E0 A S4LC4M 4E0 4M X 4 CMOS EDO DRAM Advance information JEDEC standard package - 400 mil, 24/26-pin SOJ 5V power supply 4C4M4E0 3V power supply (4LC4M4E0)

Contextual Info: Z2 M/HITE /MICROELECTRONICS WC32P040-XXM 68040 FEATURES • Selection of Processor Speeds: 25, 33MHz ■ 32-Bit, IMonmultiplexed External Address and Data Buses with Synchronous Interface ■ Temperature Range: - 55°C to +110°C ■ M ilitary Screened ■

DD81S

Abstract: STC104 T9000 m5966
Contextual Info: SGS-THOMSON STC104 o oiM m © TÄ !ra §s ASYNCHRONOUS PACKET SWITCH ENGINEERING DATA FEATURES • 32 w ay Asynchronous Packet Switch (APS ■ 32 x 100 Mbits/s serial bi-directional links ■ 300 Mbytes/s bandwidth ■ High rate of packet processing - up to 200 M packets/s