"LEADFRAME MATERIAL" DIP 20 Search Results
"LEADFRAME MATERIAL" DIP 20 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| UE62B46230S021 |
|
1x4 OSFP cage with stainless steel material | |||
| UE62B46200S021 |
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1x4 OSFP cage with stainless steel material | |||
| 20021311-00130T4LF |
|
DIP TYPE RECEPTACLE | |||
| 20021311-00124T4LF |
|
DIP TYPE RECEPTACLE | |||
| GSB11111ALFHR |
|
USB2.0, A, Vertical, DIP, BLACK |
"LEADFRAME MATERIAL" DIP 20 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Thermal Data DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options: |
Original |
063W/cm | |
leadframe
Abstract: dip 28 thermal dip-28 DSA008820
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Original |
063W/cm leadframe dip 28 thermal dip-28 DSA008820 | |
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Contextual Info: Thermal Data POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm | |
|
Contextual Info: Thermal Data POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm | |
EPOXY RESINContextual Info: Thermal Data POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C |
Original |
063W/cm 152x160 120x130 EPOXY RESIN | |
"leadframe material" DIP
Abstract: "leadframe material" DIP 20
|
Original |
063W/cm "leadframe material" DIP "leadframe material" DIP 20 | |
heat sinkContextual Info: Thermal Data POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 152x160 120x130 heat sink | |
dip 28 thermalContextual Info: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed : |
Original |
063W/cm dip 28 thermal | |
|
Contextual Info: Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed : |
Original |
063W/cm | |
|
Contextual Info: Thermal Data DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed : |
Original |
063W/cm | |
|
Contextual Info: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding : |
Original |
063W/cm | |
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Contextual Info: Thermal Data DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed : |
Original |
063W/cm 30ilver | |
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Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 152x160 120x130 | |
"leadframe material" DIP
Abstract: dip 28 thermal
|
Original |
063W/cm "leadframe material" DIP dip 28 thermal | |
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Contextual Info: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm | |
12THERMALContextual Info: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 12THERMAL | |
"leadframe material" DIP 20Contextual Info: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm "leadframe material" DIP 20 | |
"leadframe material" DIP 20Contextual Info: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm "leadframe material" DIP 20 | |
a3020Contextual Info: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 152x160 120x130 a3020 | |
|
Contextual Info: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm | |
|
Contextual Info: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 112x130 100x100 | |
|
Contextual Info: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 112x130 100x100 | |
|
Contextual Info: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 112x130 100x100 | |
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Contextual Info: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C |
Original |
063W/cm 165x220 120x130 | |