Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0042633.pdf

    • Philips Semiconductors
    • CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA0042633.pdf preview Download Datasheet

    User Tagged Keywords

    724-10 tray BGA304 HLQFP100 HSSOP20 HTQFP-48 IC CHIP 348 ic packages jedec QFP80 JEDEC TRAY DIMENSIONS JEDEC TRAY QFP64 LQFP100 tray LQFP64 reel size MLC339 msc048 MSC052 MSD502 MSD504 PLCC84 PLCC84 package QFP120 qfp64 jedec tray sms ic SO16 package trays SOT110 sot354 sot397 SOT516 SOT557 SQFP208 SSOP14 pcb TFBGA-80 TQFP-44 tray TRAY TSSOP20 14 X 35 TSSOP16 msl TSSOP24
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel