WS512K32V Search Results

WS512K32V-XXX

Contextual Info: WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging ■ Fully Static Operation: ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.075 inch square, Hermetic

WS512K32V-XXX

Abstract: WS512K32V-XG2UX
Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

Contextual Info: White Electronic Designs WS512K32V-XXX PRELIMINARY* 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Low Power CMOS Access Times of 15, 17, 20ns TTL Compatible Inputs and Outputs Low Voltage Operation Fully Static Operation: Packaging • No clock or refresh required.

WS512K32V-XXX

Contextual Info: White Electronic Designs WS512K32V-XXX ADVANCED* 512Kx32 SRAM 3.3V MODULE FEATURES „ Access Times of 70, 85, 100, 120ns „ TTL Compatible Inputs and Outputs „ Packaging „ Low Voltage Operation: • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401

Contextual Info: WS512K32V-XXX White Electronic Designs 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES n n Access Times of 15, 17, 20ns PRELIMINARY* Low Voltage Operation: • 3.3V ± 10% Power Supply n Low Voltage Operation n Low Power CMOS n Packaging n TTL Compatible Inputs and Outputs

Contextual Info: VZÄ WS512K32V-XXX WHITE /MICROELECTRONICS 512Kx32 SRAM 3.3V MODULE PRELIMINARY * FEATURES • A ccess Tim es of 15+, 17, 20ns ■ Low Pow er CMOS ■ M IL-STD -883 C om pliant Devices A v a ila b le ■ TTL C om p atible Inputs and O utputs ■ Low V oltag e O peration

WS512K32V-XXX

Abstract: WS512K32V-XG2UX
Contextual Info: WS512K32V-XXX White Electronic Designs 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES n n Access Times of 15, 17, 20ns PRELIMINARY* Low Voltage Operation: • 3.3V ± 10% Power Supply n Low Voltage Operation n Low Power CMOS n Packaging n TTL Compatible Inputs and Outputs

WS512K32V-XXX

Abstract: ah55
Contextual Info: WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Times of 70, 85, 100, 120ns ■ Low Voltage • 3.3V ±10% Power Supply ■ Packaging ■ Low Power CMOS • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401

Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Access Times of 15, 17, 20ns Low Power CMOS Low Voltage Operation TTL Compatible Inputs and Outputs Packaging Fully Static Operation: • 66-pin, PGA Type, 1.075 inch square, Hermetic

WS512K32V-XXX

Abstract: 4X512K
Contextual Info: White Electronic Designs WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES „ Access Times of 15, 17, 20ns „ Low Power CMOS „ Low Voltage Operation „ TTL Compatible Inputs and Outputs Packaging „ „ • 66-pin, PGA Type, 1.075 inch square, Hermetic

Contextual Info: a WS512K32V-XXX WHITE /MICROELECTRONICS 512Kx32 SRAM 3.3V MODULE ADVAN CED* FEATURES • A c c ess T im e s of 15, 17, 20ns ■ ■ M IL-STD-883 C o m p lia n t D evices A v a ila b le ■ T T L C o m p a tib le In p uts and O u tp uts ■ Lo w V o lta g e O p era tio n

Contextual Info: a WS512K32V-XXX WHITE /MICROELECTRONICS 512Kx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A ccess Tim es of 70, 8 5 , 1 0 0 , 120ns ■ Packaging ■ Low V oltag e • 3.3V +10% Pow er S upply • 66 -pin, PGA Type, 1.185 inch square, H erm etic ■ C eram ic HIP Package 401

Contextual Info: a WS512K32V-XXX WHITE /MICROELECTRONICS 512Kx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A c c e s s T i m e s o f 1 5f , 1 7, 2 0 n s ■ Low Power CMOS ■ M IL - S T D - 8 8 3 C o m p l i a n t D e v ic e s A v a i l a b l e ■ TTL C o m p a t ib le In p u ts a nd O u tp u t s

Contextual Info: WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Times of 15, 17, 20ns ■ MIL-STD-883 Compliant Devices Available ■ Low Voltage Operation ■ Low Power CMOS ■ TTL Compatible Inputs and Outputs ■ Fully Static Operation:

WS512K32V-XXX

Contextual Info: WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging ■ Fully Static Operation: ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.075 inch square, Hermetic

WS512K32V

Contextual Info: WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES  Access Times of 15, 17, 20ns  TTL Compatible Inputs and Outputs  Low Voltage Operation  Fully Static Operation: • No clock or refresh required.  Packaging  Three State Output.

Contextual Info: White Electronic Designs WS512K32V-XXX ADVANCED* 512Kx32 SRAM 3.3V MODULE FEATURES Access Times of 70, 85, 100, 120ns TTL Compatible Inputs and Outputs Packaging Low Voltage Operation: • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401

Contextual Info: White Electronic Designs WS512K32V-XXX PRELIMINARY* 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES Low Power CMOS Access Times of 15, 17, 20ns TTL Compatible Inputs and Outputs Low Voltage Operation Fully Static Operation: Packaging • No clock or refresh required.

Contextual Info: WS512K32V-XXX M/HITE /M ICROELECTRONICS 512Kx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A c c e s s T i m e s o f 70, 8 5 , 1 0 0 , 1 2 0 n s ■ P a c k a g in g ■ L o w V o lt a g e ■ Low Power CMOS ■ B u i l t- i n D e c o u p li n g C a ps a nd M u l t i p l e G ro u n d P ins f o r L o w

Contextual Info: WS512K32V-XXX 512Kx32 SRAM 3.3V MULTICHIP PACKAGE FEATURES  Access Times of 15, 17, 20ns  TTL Compatible Inputs and Outputs  Low Voltage Operation  Fully Static Operation: • No clock or refresh required.  Packaging  Three State Output.

Contextual Info: WS512K32V-XXX ADVANCED* 512Kx32 SRAM 3.3V MODULE FEATURES  Low Voltage Operation:  Access Times of 70, 85, 100, 120ns • 3.3V ± 10% Power Supply  Packaging  Low Power CMOS • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic

29f040b

Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
Contextual Info: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3