WEIGHT OF SOP PACKAGE Search Results

185 optocoupler 4-Pin

Abstract: smd 4-pin DUAL DIODE smd diode code kc smd 4-pin package DUAL DIODE Diode smd code cm OPIA817ATRE OPIA814A OPIA817 OPIA1210 OPIA815
Contextual Info: OPIA814, OPIA815, OPIA817 OPIA1210, OPIA4010 SMD, SOP and SSOP Packages Features: • • • • 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:

opia404b

Abstract: OPIA405-409 opia404 OPIA401 smd optocoupler 4pin OPIA401-404 photo darlington sensor OPIA402B OPIA403B OPIA409
Contextual Info: OPIA401 through OPIA409, OPIA414 SMD, SOP and SSOP Packages Features: • • • • 2,500 or 3,750 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:

smd diode a6

Abstract: ic smd 6pin for power supply ic 6 pin smd for power supply smd diode code a6 smd code a6 OPIA405C photo darlington sensor DIODE SMD A6 OPIA5010A smd diode code a.6 1
Contextual Info: OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 SMD and SOP Packages 5 Pin Features: • • • • 3,750 or 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package

sop package tray

Abstract: 29754* intel weight of SOP package SOP JEDEC tray
Contextual Info: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

TSOP-48 pcb LAYOUT

Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

NEC stacked MCP 1999

Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
Contextual Info: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a

B43876

Abstract: B43875 B43991 B41684 B43405 B82727-C1-A1 B43471 B43465 b41876 B43406
Contextual Info: SAW Components Data Sheet B7725, Pb-free SAW Components B7725 Low-Loss Filter 1575,42 MHz Data Sheet Chip Sized SAW Package QCS5H Features 0,1 Low loss RF filter for GPS receivers Unbalanced to balanced operation Low amplitude ripple Impedance transformation from 50 Ω

Contextual Info: Sony. CXA1493AM/AN FM /IF Am plifier for Cordless Telephone Advance Information Description The CXA1493AM/AN is an FM IF amplifier designed for cordless telephones. In addition to onchip AF 3-pole LPF, squelch filter amplifier and meter circuit, the adoption of a 20P VSOP package allows

PSOP-28

Abstract: SOP28 package FPT-28P-M17 P-SOP28-8
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC FPT-28P-M17 28-pin plastic SOP Lead pitch 1.27 mm Package width x package length 8.6 × 17.75 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.80 mm MAX Weight

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP FPT-8P-M01 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width x package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

f 4558

Abstract: 4558 diagram application 4558 PIN 4558 pin configuration cd 4558 TDA1311 4558 audio dac block diagram of dual 12v power supply 4558 h
Contextual Info: MOSA MS6310 Low Cost 16-Bit Stereo Audio DAC Low Cost 16-Bit Stereo Audio DAC FEATURES ‧Cost effective ‧Low distortion ‧No zero crossing distortion ‧Output voltage swing is proportional to supply voltage VOPP=VDD/2 ‧Space saving package SOP8 ‧Fast setting time permits 2*, 4*, and 8* oversampling (serial input) or double speed operation at 4* oversampling

uhf varicap

Abstract: 100MHZ 12MHZ 16PIN 1T362 1T363 CXA1665AM CXA1665AM-S CTV TUNER uhf varicap diode
Contextual Info: CXA1665AM/AM-S All Band TV Tuner IC VHF-CATV-UHF Description The CXA1665AM/AM-S is a single chip TV tuner IC which performs as an oscillator, mixer for VHF/CATV and UHF bands. An IF amplifier is also provided. This IC adopts a 16-pin SOP package in response

OPIA2210

Abstract: OPIA2110 OPI6010 OPIA5010 OPIA6010 OPID804 OPIA405C
Contextual Info: OPIA4N35, OPIA5010, OPIA4N33 OPIA2110, OPIA2210, OPI6010 DIP Package Features: • • • • 3,750 or 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photodarlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:

5 pin relay data sheet

Abstract: G3VM-202J1
Contextual Info: MOS FET Relays G3VM-202J1 Slim, 2.1-mm High MOS FET Relay with Miniature, Flat, 8-pin SOP Package • New models with 2 channels and an 8-pin SOP package now available in the 200-V load voltage series. • Continuous load current of 200 mA. • Dielectric strength of 1,500 Vrms between I/O

fet data book

Abstract: mini voltage data logger 5 pin relay data sheet G3VM-201G 4pin relay
Contextual Info: MOS FET Relays G3VM-201G Slim, 2.1-mm High MOS FET Relay with Miniature, Flat, 4-pin SOP Package • New models with 4-pin SOP package now available in the 200-V load voltage series. • Leakage current of 0.01 mA max. when output relay is open. • Dielectric strength of 1,500 Vrms between I/O.

Contextual Info: MEMORY MODULE FLASH Nand 1Gx8-SOP Flash Memory MODULE 3DFN4G08VS1636 8Gbit Flash Nand organized as 1Gx8, based on 512Mx8 Pin Assignment Top View SOP 50 (Pitch : 0.50 mm) – Package D1 Features - Organization -Memory Cell Array (512M+16.384KM)bitx8. - Automatic Program and Erase

fet data book

Abstract: "Infrared LED" IR LED infrared led G3VM-352J
Contextual Info: MOS FET Relays G3VM-352J Slim, 2.1-mm High Relay Incorporating a MOS FET Optically Coupled with an Infrared LED in a Miniature, Flat SOP Package • New models with 2 channels and an 8-pin SOP package included in 350-V load voltage series. • Continuous load current of 110 mA.

512Mx8

Contextual Info: MEMORY MODULE FLASH Nand 512Mx8-SOP Flash Memory MODULE 3DFN4G08VS1636 4Gbit Flash Nand organized as 512Mx8, based on 512Mx8 Pin Assignment Top View SOP 50 (Pitch : 0.50 mm) – Package D1 Features - Organization -Memory Cell Array (512M+16.384KM)bitx8.

5 pin relay NO NC

Abstract: G3VM-355J
Contextual Info: MOS FET Relays G3VM-355J New MOS FET Relay with Both SPST-NO and SPST-NC Contacts Incorporated in a Single SOP Package • SPST-NO/SPST-NC models with an 8-pin SOP package now available in the 350-V load voltage series. • Continuous load current of 120 mA.

6-pin SOp

Abstract: E67349 TLP192G
Contextual Info: TLP192G TOSHIBA Photocoupler Photorelay TLP192G PC Card Modems PBX STB Set Top Boxes Measurement Equipment Unit: mm The Toshiba TLP192G consists of a gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in a 6-pin SOP package. This photorelay has a characteristic of high-withstanding voltage

G3VM-201H1

Abstract: A.4 6PIN 201H1
Contextual Info: MOS FET Relays G3VM-201H1 Slim, 2.1-mm High, MOS FET Relay with Miniature, Flat, 6-pin SOP Package • New models with 6-pin SOP package now available in the 200-V load voltage series. • Continuous load current of 200 mA. • Dielectric strength of 1,500 Vrms between I/O.

Contextual Info: TLP202G TOSHIBA Photocoupler Photorelay TLP202G PC Card Modems PBX STB Set Top Boxes Measurement Equipment Unit: mm The Toshiba TLP202G consists of a gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in an 8-pin SOP package. This photorelay has a characteristic of high-withstanding voltage