W82M32V Search Results

p 602

Abstract: W82M32V-XBX
Contextual Info: White Electronic Designs W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Low Power CMOS Access Times of 12, 15, 17, 20ns TTL Compatible Inputs and Outputs Packaging • 255 PBGA, 25mm x 25mm, 625mm Fully Static Operation: 2 Organized as 2Mx32 • No clock or refresh required.

Contextual Info: 2M x 32 SRAM Multi-Chip Package Optimum Density and Performance in One Package W82M32V-XBX* Performance Features • Access Times of 12ns, 15ns, 17ns and 20ns. • W82M32V-XBX – +3.3V ±5% Power Supply • Low Power CMOS • Commercial, industrial and military temperature

W82M32V-XBX

Abstract: w82m32v
Contextual Info: White Electronic Designs W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES „ Access Times of 12, 15, 17, 20ns „ Packaging • 2 255 PBGA, 25mm x 25mm, 625mm „ Organized as 2Mx32 „ Commercial, Industrial and Military Temperature Ranges „ Low Voltage Operation:

Contextual Info: W82M32V-XBX White Electronic Designs 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Packaging n Fully Static Operation: • 255 PBGA, 25mm x 25mm, 625mm 2 • No clock or refresh required.

Contextual Info: W82M32V-XBX White Electronic Designs 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Packaging n Fully Static Operation: • 255 PBGA, 25mm x 25mm, 525mm 2 • No clock or refresh required.

Contextual Info: W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES „ Low Power CMOS „ Access Times of 12, 15, 17, 20ns „ TTL Compatible Inputs and Outputs „ Packaging „ Fully Static Operation: • 255 PBGA, 25mm x 25mm, 625mm • No clock or refresh required.

Contextual Info: W82M32V-XBX White Electronic Designs PRELIMINARY* 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES  Low Power CMOS  Access Times of 12, 15, 17, 20ns  TTL Compatible Inputs and Outputs  Packaging  Fully Static Operation: • 255 PBGA, 25mm x 25mm, 625mm

Contextual Info: W82M32V-XBX White Electronic Designs 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Packaging n Fully Static Operation: • 255 PBGA, 27mm x 27mm, 729mm 2 • No clock or refresh required.

Contextual Info: W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES  Low Power CMOS  Access Times of 12, 15, 17, 20ns  TTL Compatible Inputs and Outputs  Packaging  Fully Static Operation: 2 • 255 PBGA, 25mm x 25mm, 625mm  Organized as 2Mx32

p 602

Abstract: W82M32V-XBX
Contextual Info: W82M32V-XBX 2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES ! Low Power CMOS ! Access Times of 12, 15, 17, 20ns ! TTL Compatible Inputs and Outputs ! Packaging ! Fully Static Operation: • 255 PBGA, 25mm x 25mm, 625mm 2 • No clock or refresh required.

Contextual Info: 8M x 32 32MB Flash Optimum Density and Performance in One Package W78M32V-XBX* Features The W78M32V-XBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).

LE79Q2281

Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
Contextual Info: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security

29f040b

Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
Contextual Info: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3