VOG20
Abstract: VO20 VOG-20 PK068
Contextual Info: R TSSOP VO20/VOG20 Package PK068 (v1.3) December 12, 2008 X-Ref Target - Figure 1 2006–2008 Xilinx, Inc. All Rights Reserved. XILINX, the Xilinx logo, the Brand Window and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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ug112ug072ug075xapp427+10qfn 3x3 tray dimensionxcdaisybfg95xc5vlx330t-1ff1738ipcb footprint fs48, and fsg48ws609jedec so8 wire bond gapxc3s400an-4fg400iffg676xc4vlx25 cmos 668 fcbga
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XCF04S
Abstract: xcf16pfs XCF32P-VOG48 XCF02S RELIABILITY REPORT 48-pin TSOP Package VO48 Xilinx Spartan-II 2.5V FPGA Family FSG48 XCF02S pcb
Contextual Info: 47 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.13.1 April 3, 2008 Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process
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ds123xcf04sxcf16pfsxcf32p-vog48+5xcf02s reliability report48-pin tsop package vo48xilinx spartan-ii 2.5v fpga familyfsg48xcf02s pcb
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XC3S250E design guide
Abstract: csb 485 E2
Contextual Info: <BL Blue> R DS123 v2.11 February 1, 2007 Platform Flash In-System Programmable Configuration PROMs Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs ♦ • 3.3V supply voltage Low-Power Advanced CMOS NOR FLASH Process
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XCF32PVO48
Abstract: 48-pin TSOP Package VO48 XCF08PVO48C XCF32PVOG48C XCF32PVO48C ieee 1532 XCF04SVO20C pcb footprint for XCF08PFSG48C Platform XCF01SVOG20C XCF08PFS48C
Contextual Info: 35 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.17 October 26, 2009 Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process
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ds123vog20xcf32pvo4848-pin tsop package vo48+8xcf08pvo48cxcf32pvog48cxcf32pvo48cieee 1532xcf04svo20cpcb footprint for xcf08pfsg48c platformxcf01svog20cxcf08pfs48c
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48-pin TSOP Package VO48
Abstract: XCF16PFSG48C XCF08PFS48C XCF02SVO20C XCF16PFS48C XCF32PFSG48C XCF02SVOG20C pcb footprint FS48, and FSG48 XCF16PVOG48C XCF02SVO20C RELIABILITY REPORT
Contextual Info: 35 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.18 May 19, 2010 Product Specification Features • XCF01S/XCF02S/XCF04S • In-System Programmable PROMs for Configuration of Xilinx FPGAs • 3.3V Supply Voltage • Low-Power Advanced CMOS NOR Flash Process
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ds123xcf01s/xcf02s/xcf04svog2048-pin tsop package vo48+9xcf16pfsg48cxcf08pfs48cxcf02svo20cxcf16pfs48cxcf32pfsg48cxcf02svog20cpcb footprint fs48, and fsg48xcf16pvog48cxcf02svo20c reliability report
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Virtex-6 reflow
Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
Contextual Info: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the
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ug116611gufgg676ffg1152+9virtex-6 reflowws609xc3s3400axcv400e-bxcs20xl pqg208ug-116xc1702lxce4vsx25xc3s500e fg320
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XCF02S
Abstract: pcb footprint FS48, and FSG48 XCF32P DS123 FS48 VO20 VO48 XCF01S XCF32PVO48C XCF08PFS48C
Contextual Info: R DS123 v2.6 March 14, 2005 4 2 Platform Flash In-System Programmable Configuration PROMS Preliminary Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • Low-Power Advanced CMOS NOR FLASH Process • Endurance of 20,000 Program/Erase Cycles
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ds123xcf08p/xcf16p/xcf32pvog48fsg48+10xcf01s/xcf02s/xcf04sxcf02spcb footprint fs48, and fsg48xcf32pfs48vo20vo48xcf01sxcf32pvo48cxcf08pfs48c
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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ug112ug072ug075xapp427+10xilinx topside markingxilinx part markingpcb footprint fs48, and fsg48smd code v36cf1752reballingrecommended layout csg324bga reflow guidexc2vp7 reflow profilesmd marking code c1g
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xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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ug112ug072ug075xapp427+9xilinx part markingxilinx topside markingqfn 3x3 tray dimensionfgg484hqg160reballingtop marking 957 so8ff1148fcbga package thermal resistance
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CSG484
Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
Contextual Info: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of
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xapp427csg484lead free reflow soldering profile bgaffg676+6bga reflow guidepqg240cpg196ipc 610dpcb warpage in ipc standardipc-a-610d
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XCF08PFSG48C
Abstract: XCF01S Xilinx XCF04S pcb footprint FS48, and FSG48 XC3S500E XCF01SVO20 XCF32P DS123 FS48 VO20
Contextual Info: 47 Platform Flash In-System Programmable Configuration PROMS R DS123 v2.8 December 29, 2005 Product Specification Features • • • • • • • • • • In-System Programmable PROMs for Configuration of Xilinx FPGAs Low-Power Advanced CMOS NOR FLASH Process
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csb 485 E2
Abstract: Xilinx XCF08P XCF01SVO20 XCF32P XCF128X fs48 xc3s400 pinout XCF32PVO48 DS123 VO48
Contextual Info: 48 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.16 November 14, 2008 Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process
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XCF32P
Abstract: XCF32PFS48C XCF08 xcf02s-vo20 pcb footprint FS48, and FSG48 XCF01S xcf32p-vog48 DS123 FS48 VO20
Contextual Info: <BL Blue> Platform Flash In-System Programmable Configuration PROMS R DS123 v2.9 May 09, 2006 Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs ♦ • 3.3V supply voltage Low-Power Advanced CMOS NOR FLASH Process
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CHN 936
Abstract: CHN G4 019 xcf16pfs XCF02S RELIABILITY REPORT XCF04S XILINX SPARTAN XC2S50 XCF32PVO48 FG48 XC2V80 SPARTAN 3a dsp board schematics
Contextual Info: 47 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.12 January 28, 2008 Product Specification Features • • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR FLASH Process
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XCF04S pcb
Abstract: XC2V80
Contextual Info: R DS123 v2.4 July 20, 2004 3 9 Platform Flash In-System Programmable Configuration PROMS Preliminary Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • Low-Power Advanced CMOS FLASH Process • Endurance of 20,000 Program/Erase Cycles
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XCF02S
Abstract: AEC-Q100 TS16949 XAF01S XAF04S XA2S200E
Contextual Info: R DS316-1 v1.0 October 18, 2004 2 3 Platform Flash In-System Programmable Configuration XA PROMS Advance Product Specification Features • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and I-grade. •
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camera-link to hd-SDI converter
Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
Contextual Info: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6
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camera-link to hd-sdi convertervirtex-4qvds-kit-fx12mm1-gaes-s6dev-lx150t-g+6vhdl code for adc and dac spi with fpga spartan 3adq0007xc6slaes-xlx-v4fx-pcie100-gspartan-3 xc3s400 based mxs3fkads-xlx-sp3-evl400
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UG161
Abstract: XCF128X COOLRUNNER-II example led xc6slx75t XC3SD3400A xc5vlx220t XCF02S RELIABILITY REPORT virtex 6 XC6VSX475T xc6slx75 XC6VLX365T
Contextual Info: Platform Flash PROM User Guide UG161 v1.5 October 26, 2009 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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ug161xapp694xapp544xcf02s/xcf04s+15xapp389ug002ug071ug191ug332ug360xcf128xcoolrunner-ii example ledxc6slx75txc3sd3400axc5vlx220txcf02s reliability reportvirtex 6 xc6vsx475txc6slx75xc6vlx365t
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Lead Free reflow soldering profile BGA
Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
Contextual Info: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of
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XCF32P
Abstract: pcb footprint FS48, and FSG48 TANTALUM SMD CAPACITOR CROSS-REFERENCES XCP32P fpga JTAG Programmer Schematics XAPP986 VOG20 DS123 V020 XCF02S
Contextual Info: Platform Flash PROM User Guide UG161 v1.4 October 17, 2008 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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XC3S250E TQ144 STARTER KIT BOARD
Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
Contextual Info: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6
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xc3s250e tq144 starter kit boardaes-s6dev-lx150t-gconnector fmc lpc samtecds-kit-fx12mm1-g+6ads-xlx-sp3-evl1500xcf128xspartan-3 xc3s400spartan-3 xc3s400 pq208 architecturespartan-3 xc3s400 based mxs3fkxq4vsx55
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F5044
Abstract: XCF02SVOG20C Xilinx XCF08P xcf04svOg20c XCF16PFS48C XCF04S fit XCF01S-VO20C F50450 marking aab 8 tsop XCF04SVO20C0936
Contextual Info: R DS123 v2.4 July 20, 2004 3 9 Platform Flash In-System Programmable Configuration PROMS Preliminary Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • Low-Power Advanced CMOS FLASH Process • Endurance of 20,000 Program/Erase Cycles
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spartan 3a
Abstract: 48-pin TSOP Package VO48 XCF02S RELIABILITY REPORT xcf128x XCF32PFS48C Virtex 4 XC4VFX60 XC3S400 XCF02S pcb XCF32P Device Reliability report XILINX
Contextual Info: 48 Platform Flash In-System Programmable Configuration PROMs R DS123 v2.15 July 07, 2008 Product Specification Features • In-System Programmable PROMs for Configuration of Xilinx FPGAs • ♦ 3.3V Supply Voltage Low-Power Advanced CMOS NOR Flash Process
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