UP175A
Contextual Info: 175 Pin Molded Plastic Pin Grid Array NS Package Number UP175A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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SmD TRANSISTOR a42
Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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smd transistor a42transistor bc 136transistor bc 157transistor bc 945+6transistor bc 187sna10atransistor bc 413mo-220-wggd-2pdf on bc 187 transistormo-220-wkkd-2
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NS32532
Abstract: U175A NS32032 lfsr fibonacci C1995 NS32381 NS32GX32-20 NS32GX32-25 NS32GX32-30
Contextual Info: May 1991 NS32GX32-20 NS32GX32-25 NS32GX32-30 High-Performance 32-Bit Embedded System Processor General Description Features The NS32GX32 is a high-performance 32-bit embedded system processor in the Series 32000 family It is software compatible with the previous microprocessors in the family
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ns32gx32-20ns32gx32-25ns32gx32-3032-bit+7ns32gx32ns32532u175ans32032lfsr fibonaccic1995ns32381
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vjp44a
Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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ms011798vjp44amo-16b-abta11b+7tf11bcu50ad 153 transistortransistor bd 905transistor bc 185mkt 344ms-026-bcd
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a
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NS32GX32
Contextual Info: & PRELIMINARY May 1991 NS32GX32-20/NS32GX32-25/NS32GX32-30 High-Performance 32-Bit Embedded System Processor General Description Features The NS32GX32 is a high-performance 32-bit embedded system processor in the Series 32000* family. It is software compatible with the previous microprocessors in the family
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ns32gx32-20/ns32gx32-25/ns32gx32-3032-bitns32gx320-1b0-530+1b5d112fl
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray
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ic laf 0001
Abstract: laf 0001 power p40x laf 0001 NS32032 berh NS32532 OBG 88 s3 trio NS32381
Contextual Info: JUN ‘o PRELIMINARY April 1991 NS32GX32-20/NS32GX32-25/NS32GX32-30 High-Performance 32-Bit Embedded System Processor General Description Features The NS32GX32 is a high-performance 32-bit embedded system processor in the Series 32000 family. It is software
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ns32gx32-20/ns32gx32-25/ns32gx32-3032-bitns32gx32ic laf 0001+9laf 0001 powerp40xlaf 0001ns32032berhns32532obg 88s3 trions32381
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T03A
Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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t03ato-202 transistormkt 344cu50+6transistor bc 136mtl 728ms-026-bcdm03abd 669v84a
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UP124A
Abstract: UP159A UP175A
Contextual Info: Plastic Pin Grid Array PPGA 124 Pin Molded Plastic Pin Grid Array NS Package Number UP124A 159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A 2000 National Semiconductor Corporation MS101166 www.national.com Plastic Pin Grid Array (PPGA) May 1999
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