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    V84A Search Results

    V84A Datasheets (1)

    National Semiconductor
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    V84A
    National Semiconductor 84 Lead Molded Plastic Leaded Chip Carrier Original PDF 57.45KB 1
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    V84A Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    V84A

    Contextual Info: 84 Lead Molded Plastic Leaded Chip Carrier NS Package Number V84A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


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    v84a PDF

    Contextual Info: NS32CG821 NATL SEMICOND UP/UC 31E 1) W bSOllBö DQ701BG 2 0 National Semiconductor PRELIMINARY T -> S 2-33-2\ NS32CG821 microCMOS Programmable 1M Dynamic RAM Controller/Driver General Description Features The NS32CG821 dynamic RAM controller provides a low


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    ns32cg821dq701bgns32cg1671-ff+1t-90-20 PDF

    SmD TRANSISTOR a42

    Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
    Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


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    smd transistor a42transistor bc 136transistor bc 157transistor bc 945+6transistor bc 187sna10atransistor bc 413mo-220-wggd-2pdf on bc 187 transistormo-220-wkkd-2 PDF

    NS32181

    Abstract: adele bitblt raster cmps a13 C1995 NS32CG160-15 NS32CG160-20 NS32CG160-25 NS32CG821 nsc32cg16
    Contextual Info: January 1992 NS32CG160-15 NS32CG160-20 NSC32CG160-25 32-Bit Integrated System Processor General Description Features The NS32CG160 is a highly-integrated member of the Series 32000 EPTM family of National’s Embedded System ProcessorsTM specifically optimized for office imaging peripherals


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    ns32cg160-15ns32cg160-20nsc32cg160-2532-bit+11ns32cg16016-bit16-functionns32181adelebitblt rastercmps a13c1995ns32cg160-25ns32cg821nsc32cg16 PDF

    IR receiver TK 19 527

    Abstract: TLD 721 5FW-4 Fm 6721 transformer
    Contextual Info: DP8344B National ÆLm Semiconductor DP8344B Biphase Communications Processor— BCP G eneral Description although a TTL-level serial input is also provided for applica­ tions where an external comparator is preferred. The DP8344B BCP is a communications processor de­


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    dp8344bir receiver tk 19 527tld 7215fw-4+1fm 6721 transformer PDF

    vjp44a

    Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
    Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


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    ms011798vjp44amo-16b-abta11b+7tf11bcu50ad 153 transistortransistor bd 905transistor bc 185mkt 344ms-026-bcd PDF

    TX178A

    Abstract: DP83902V "Attachment Unit Interface" lsi 140 ud da14 FB50 MAR7 Valor Electronics FL1012 valor fl1012 wack 10BASE2
    Contextual Info: i l m i National Semiconductor PRELIMINARY A ugust 1991 DP83902 Serial Network Interface Controller for Twisted Pair ST-NIC General Description Features The DP83902 Serial N etw ork Interface C on tro lle r fo r T w ist­ ed Pair (ST-NIC) is a m icroC M O S VLSI device designed for


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    dp8390210base510base210base-t+9tx178adp83902vattachment unit interface" lsi140 ud da14fb50mar7valor electronics fl1012valor fl1012wack PDF

    ch 453d

    Abstract: lo3b DP8430V lo3a oasi DP8431V DP8432V
    Contextual Info: PRELIMINARY National M ay 1991 Semiconductor DP8430V/31V/32V-33 microCMOS Programmable 256k/1M /4M Dynamic RAM Controller/Drivers General Description Features Th e D P 8 4 3 0 V /3 1 V /3 2 V dynam ic RAM contro lle rs provide a low cost, single chip interface betw een dynam ic RAM and


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    dp8430v/31v/32v-33256k/1m/4mdp8430v/31v/32v32-bit+7ch 453dlo3bdp8430vlo3aoasidp8431vdp8432v PDF

    STR 3118

    Abstract: National Semiconductor bufer DP83955AV ed 77A DIODE str 3105 DP83956AVLY TX04P
    Contextual Info: DP83955A/DP83956A bSQllEH DOflbBMM ObD « N S C E National ÆM Semiconductor DP83955A/DP83956A LERIC LitE Repeater Interface Controller General Description The DP83955/56 LitE Repeater Interface Controller LERIC may be used to Implement an IEEE 802.3 multiport


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    dp83955a/dp83956adp83955/56cep-01451str 3118+6national semiconductor buferdp83955aved 77a diodestr 3105dp83956avlytx04p PDF

    DP8420AV-20

    Abstract: DP820 DP8422AV-25 DP8421A C1995 DP8420A DP8420AV-25 DP8422A V68A 8420a
    Contextual Info: DP8420A 21A 22A microCMOS Programmable 256k 1M 4M Dynamic RAM Controller Drivers General Description Features The DP8420A 21A 22A dynamic RAM controllers provide a low cost single chip interface between dynamic RAM and all 8- 16- and 32-bit systems The DP8420A 21A 22A generate all the required access control signal timing for


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    dp8420a32-bitdp8420av-20dp820+7dp8422av-25dp8421ac1995dp8420av-25dp8422av68a8420a PDF

    cwi 1011

    Abstract: CNC5 C3210 CTSR "BIP 109" BIP-109 CBD3 LSC 132 C1995 DP83231
    Contextual Info: DP83251 55 PLAYER TM Device FDDI Physical Layer Controller General Description Features The DP83251 DP83255 PLAYER device implements one Physical Layer (PHY) entity as defined by the Fiber Distributed Data Interface (FDDI) ANSI X3T9 5 Standard The PLAYER device contains NRZ NRZI and 4B 5B encoders and


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    dp83251dp83255dp83mcwi 1011+9cnc5c3210ctsrbip 109bip-109cbd3lsc 132c1995dp83231 PDF

    national semiconductor pb-free suffix

    Abstract: SB70A SQA40b TS5B-24 LM431ACM3X IEC 384 14 250 volts LM2734XMK UFBGA 176 datasheet M08A M14A
    Contextual Info: Surface Mount - Tape & Reel • General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of surface mount devices so that pick-and-place machines have to


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    eia-481national semiconductor pb-free suffixsb70asqa40b+7ts5b-24lm431acm3xiec 384 14 250 voltslm2734xmkufbga 176 datasheetm08am14a PDF

    DP83902AV

    Abstract: DP83902AVJG DP83902A ST-NIC A1076 MAR6
    Contextual Info: DP83902A DP83902A ST-NIC TM Serial Network Interface Controller for Twisted Pair Literature Number: SNLS082A November 1995 DP83902A ST-NIC TM Serial Network Interface Controller for Twisted Pair General Description Features The DP83902A Serial Network Interface Controller for


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    dp83902asnls082a10base510base2+610base-tdp83902avdp83902avjgdp83902a st-nica1076mar6 PDF

    DP8422V-33

    Contextual Info: DP8420V-33,DP8421V-33,DP8422V-33, DP84T22-25 DP8420V-33 DP8421V-33 DP8422V-33 DP84T22-25 microCMOS Programmable 256k/1M/4M Dynamic RAM Controller/Drivers Literature Number: SNOS603A DP8420V 21V 22V-33 DP84T22-25 microCMOS Programmable 256k 1M 4M Dynamic RAM


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    dp8420v-33dp8421v-33dp8422v-33dp84t22-25+2256k/1m/4msnos603a PDF

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


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    ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a PDF

    Contextual Info: a l Semiconductor July 1993 DP8430V/31V/32V-33 microCMOS Programmable 256k/1M /4M Dynamic RAM Controller/Drivers General Description Features The DP8430V/31V/32V dynamic RAM controllers provide a low cost, single chip interface between dynamic RAM and all 8-, 16- and 32-bit systems. The DP8430V/31V/32V gen­


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    dp8430v/31v/32v-33256k/1mdp8430v/31v/32v32-bit+120-3a PDF

    Contextual Info: m 7 va November 1991 DP8344B Biphase C om m unications Processor— BCP General Description The DP8344B BCP is a communications processor de­ signed to efficiently process IBM* 3270, 3299 and 5250 communications protocols. A general purpose 8-bit protocol


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    dp8344b41-j-2477459 PDF

    cwi 1011

    Contextual Info: : 'ü , . - * ï i •- February 1991 DP83251/55 P L A Y E R tm Device FDDI Physical Layer Controller General Description Features The DP83251 /D P83255 PLAYER device implements one Physical Layer (PHY) entity as defined by the Fiber Distribut­ ed Data Interface (FDDI) ANSI X3T9.5 Standard The PLAYER device contains NRZ/NRZI and 4B /5B encoders and


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    dp83251/55dp83251p83255212-5u66+3267-50uq7745ficwi 1011 PDF

    LMV240

    Abstract: national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A
    Contextual Info: Surface Mount - Tape & Reel General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of


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    eia-481-1-aeia-481-2-acsp-9-111s2lmv240+9national semiconductor pb-free suffixds90c2501slblm431acm3xdsp-92ts5b-24lm3351mmlm3351mmxm08am14a PDF

    P8420

    Abstract: DP84T22-25 RAY 33A AN77-3 TD422
    Contextual Info: i 9 1991 gH National ÆÆ Semiconductor PRELIMINARY May 1991 D P 8 4 2 0 V /2 1 V /2 2 V -3 3 , D P84T22-25 m icroCM O S Program m able 2 5 6 k /1 M /4 M Dynam ic RAM C o n tro lle r/D riv e rs General Description Features The DP8420V/21V/22V-33, DP84T22-25 dynamic RAM


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    dp8420v/21v/22v-33dp84t22-25256k/1m/4mp84t22-25+632-bitdp8420vp8420ray 33aan77-3td422 PDF

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


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    ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray PDF

    DP83955AV

    Abstract: tx-2b TX6B rx6a TX2b TX1B DP83956AVLJ Rx6b TX7A C1995
    Contextual Info: DP83955A DP83956A LERIC TM LitE Repeater Interface Controller General Description The DP83955 56 LitE Repeater Interface Controller LERIC may be used to implement an IEEE 802 3 multiport repeater unit It fully satisfies the IEEE 802 3 repeater specification including the functions defined by the repeater segment partition and jabber lockup protection state machines


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    dp83955adp83956adp83955dp83955av+9tx-2btx6brx6atx2btx1bdp83956avljrx6btx7ac1995 PDF

    DSP-92

    Abstract: LQA36A LM317AEMP LM431ACM3X SPA48A LM431ACM3 LMV240 V84A LM3351 M14A
    Contextual Info: ՗௬ཌྷጎഗॲ‫ڦ‬Ԉጎlj‫ࢅټ‬ਝ ᅃӯຫ௽ ޮ߃‫ڦټ‬Ԋ૗ഽ‫܈‬ ‫ټ‬ਝ๟ሏ๼՗௬ཌྷጎഗॲ‫ڦ‬ዷᄲ‫݆ݛ‬ኮᅃă޿ဣཥ०ࣅକ āā‫ړ‬Ԋ૗໏‫ྺ܈‬௅‫ݴ‬ዓ300ࡹ௝้Ljॽޮ߃‫ٗټ‬ጎଙ‫ټ‬


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    eia-481-1-a81-2-aiec286-3ms200164+15mua08amub10alm3351lm3351mmxlm71cisdlm71cisdxdsp-92lqa36alm317aemplm431acm3xspa48alm431acm3lmv240v84am14a PDF

    Contextual Info: DP8344B Biphase Communications Processor Features Transceiver Y Software configurable for 3270 3299 5250 and general 8-bit protocols Y Fully registered status and control Y On-chip analog line receiver Processor Y 20 MHz clock 50 ns T-states Y Max instruction cycle 200 ns


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    dp8344b PDF