TSOP SERIES Search Results

TSOP 48 socket

Contextual Info: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series

Contextual Info: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

Contextual Info: Gold Termination TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP G 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES

Contextual Info: TSOP Series Ultra Precision Molded Resistor Networks Tin Lead Termination HOW TO ORDER TSOP S 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1%

TSOP-6 material

Abstract: tssop8 thermal performance TSOP-6 175
Contextual Info: TSOP-6—The Next Step for LITTLE FOOTR Cellular telephones, notebook computers, and other portable electronic systems are becoming smaller with each new generation of products. The new TSOP-6 LITTLE FOOT family anticipates this evolution. Its small size allows the

block diagram laptop ac adapter

Abstract: SLUFM16GU2U-A nand flash pcb layout design serial flash memory 16gb format JESD22-B110 nand flash 16gb hirose 6 pin serial 9 pin
Contextual Info: 1GB to 16GB USB Flash Module www.stec-inc.com SLUFMxGU2U I -y USB Solid-State Flash Disk Capacity: 1GB - 16GB USB 2.0 Compliant Form Factors: • Horizontal Mount • Standard Connector or 9-Pin DConnector  1-High TSOP Flash Placement or Stacked TSOP Flash Placement

IC120

Abstract: IC189 IC191 NP291 YAMAICHI IC51 Series
Contextual Info: SOCKETS/SOCKET TOOLS YAMAICHI ELECTRONICS USA Test and Burn-in Sockets • ■ ■ ■ ■ ■ High-temperature thermoplastic insulators Au over Ni, BeCu contacts 10K cycles durability Open top sockets for TSOP I/PLCC/ PSOP/µBGA* packages TSOP I/PLCC/PSOP/SSOP

Contextual Info: 'HYUNDAI HYM572A124A R-Series Unbuffered 1M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM572A124A is a 1M x 72-bit EDO mode CMOS DRAM module consisting of two HY514404B in 20/26 pin SOJ or TSOP-II, four HY5118164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048bit EEPROM on a 168 pin

tsop 66

Abstract: W3E32M72S-XBX
Contextual Info: White Electronic Designs W3E32M72S-XBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266, 333Mbs 40% SPACE SAVINGS vs. TSOP Package: Reduced part count • 219 Plastic Ball Grid Array PBGA , 32 x 25mm 34% I/O reduction vs TSOP 2.5V ±0.2V core power supply

Contextual Info: White Electronic Designs W3E64M72S-XSBX 64Mx72 DDR SDRAM BENEFITS FEATURES „ Data rate = 200, 250, 266 and 333Mbs* „ 66% Space Savings vs. TSOP „ Package: „ Reduced part count • 219 Plastic Ball Grid Array PBGA , 25 x 32mm „ 55% I/O reduction vs TSOP

CS18HS02565

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. History Issue Date 1.3 Add green code in part no. Jul. 22, 2005 1.4 Add in 28L TSOP 1-8x13.4mm Mar. 10,2006 1.5 Remove 28L TSOP 1-8x13.4mm Jun. 12,2006 1.6 Revise speed option and DC/AC Characteristics.

W3E64M72S-XBX

Contextual Info: White Electronic Designs W3E64M72S-XBX ADVANCED* 64Mx72 DDR SDRAM BENEFITS FEATURES Data rate = 200, 250, 266 and 333Mbs 66% Space Savings vs. TSOP Package: Reduced part count • 219 Plastic Ball Grid Array PBGA , 25 x 32mm 55% I/O reduction vs TSOP 2.5V ±0.2V core power supply

Contextual Info: “H Y U N D A I HYM5V72A224A R-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE _ with EXTENDED DATA OUT DESCRIPTION The HYM5V72A224A is a 2M x 72-bit EDO mode CMOS DRAM module consisting of two HY51V4404B in 20/26 pin SOJ or TSOP-II, four HY51V18164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048 bit EEPROM on a 168

Contextual Info: W3E32M72SR-XBX 32Mx72 REGISTERED DDR SDRAM FEATURES BENEFITS  Registered for enhanced performance of bus speeds of 200, 250, 266Mb/s  74% SPACE SAVINGS vs. TSOP  Package:  51% I/O reduction vs TSOP  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 25mm

TSOP 48 thermal resistance

Abstract: TSOP-6
Contextual Info: Tem ic S e m i c o n d u c t o r s TSOP-6—The Next Step for LITTLE FOOT Cellular telephones, notebook com puters, and other portable electronic systems are becom ing smaller with each new generation of products. T he new TSOP-6 LITTLE FOOT family anticipates this evolution. Its small size allows the

IC197

Contextual Info: TSOP Type I Metal Cover SMT IC197 SERIES ORDERING INFORMATION IC197- * *- 200 * Socket Series No. of Contacts Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Design Number

IC 2272

Abstract: IC 2272 ac TSOP 54 socket IC363-0502-001 IC363-0662-003 TSOP 56 socket IC363-0542-002 2272 ic 234-0005
Contextual Info: IC363 Series Open Top Thin Small Outline Package (TSOP - t y p e II) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Contact Force: Operating Force:

IC369

Abstract: socket Yamaichi IC 2267
Contextual Info: IC369 Series Open Top Thin Small Outline Package (TSOP - Type II) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Contact Force: 1,000M Ω min. at 500V DC

IC197

Abstract: IC197-4807 IC-197 IC197-4807-2 IC197-5606 IC197-3202-2
Contextual Info: IC197 Series - Style 200/210 TSOP – Identical Footprint SMT Part Number (Details) Specifications Insulation Resistance: Contact Resistance: Withstanding Voltage: Operating Temperature Range: Mating Cycles: 500MΩ min. at 500V DC 35mΩ max. at 10mA / 20mV

Yamaichi Electronics ic197

Abstract: Yamaichi IC197 Yamaichi IC197-32 ic 4001 IC197 IC197-4807
Contextual Info: IC197 Series - Style 200/210 TSOP – Identical Footprint SMT Part Number (Details) Specifications Insulation Resistance: Contact Resistance: Withstanding Voltage: Operating Temperature Range: Mating Cycles: 500MΩ min. at 500 V DC 35mΩ max. at 10mA / 20mV

Yamaichi Electronics ic197

Abstract: IC197
Contextual Info: SOCKETS/SOCKET TOOLS YAMAICHI ELECTRONICS USA IC197 TSOP I Series Prototyping Sockets • ■ ■ ■ ■ ■ ■ ■ ■ Low cost Reduces development time/ simplifies pre-production testing Ultra-low profile 2.45 mm /surface mount High-temperature thermoplastic/

IC191-0562-003

Abstract: IC191-0482-004 ic191-0482-004 pin details IC191 TSOP 56 socket IC191-0402-002 TSOP 56 Package TSOP 48 socket
Contextual Info: IC191 Series Open Top Thin Small Outline Package (TSOP - Type I) Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:

DPSD32MX16WY5

Abstract: 32 megabit 16 bit
Contextual Info: 512 Megabit Synchronous DRAM DPSD32MX16WY5 DESCRIPTION: The LP-Stack series is a family of interchangeable memory modules. The 256 Megabit SDRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are