TSOP 44-40 PACKAGE Search Results

BGA and QFP Package mounting

Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Contextual Info: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,

Contextual Info: MEMORY ICS FUNCTION GUIDE 2. PRODUCT GUIDE Density 4M bit Org. Power Supply 512KX 3 5V±10% Part Number KM29N040T Speed Features Package = 32B Page Mode 4KB Block size 44 40 TSOP II 256B Page Mode 4KB Block size 44(40) TSOP II tR 15US tR C = 1 2 0 n s 3.3V±10%

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

tsop II 44

Abstract: TSOP 44-40 Package 44P3W-R
Contextual Info: 44P3W-R Plastic 44pin 400mil TSOP EIAJ Package Code TSOP II 44/40-P-400-0.80 JEDEC Code – Weight(g) 0.47 Lead Material Alloy 42 e b2 l2 F 32 23 ME 35 Recommended Mount Pad E Symbol 1 10 13 A 22 c L D L1 HE 44 e y b A2 Detail F A A1 A2 b c D E e HE L

Contextual Info: ISSI PACKAGING INFORMATION Plastic TSOP Package Code: T Type II N N/2+1 H E 1 N/2 D SEATING PLANE A e Plastic TSOP (T - Type II) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 40/44 A 1.00 1.20 0.039 0.047 A1 0.05 0.20 0.002 0.008 B 0.30 0.40 0.012 0.016

Contextual Info: EliteMT M11B416256A DRAM 256 K x 16 DRAM EDO PAGE MODE FEATURES ORDERING INFORMATION - PACKAGE X16 organization EDO Extended Data-Output access mode 2 CAS Byte/Word Read/Write operation 40-pin 400mil SOJ 44 / 40-pin 400mil TSOP (TypeII) Single 5V ( ± 10%) power supply

Contextual Info: TSOP 2 44/40-P-400-0.80-K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.49 TYP. 3/Dec.10,1996

M11B416256A-25JP

Abstract: M11B416256A-35TG
Contextual Info: EliteMT M11B416256A DRAM 256 K x 16 DRAM EDO PAGE MODE FEATURES ORDERING INFORMATION - PACKAGE X16 organization EDO Extended Data-Output access mode 2 CAS Byte/Word Read/Write operation 40-pin 400mil SOJ 44 / 40-pin 400mil TSOP (TypeII) Single 5V ( ± 10%) power supply

M11B416256A-35J

Abstract: ELITE* M11B416256A M11B416256A M11B416256A-25J 10K17 M11B416256 ELITEMT m11b416256a datasheet M11B416256A-25T M11B416256A-28J
Contextual Info: EliteMT M11B416256A DRAM 256 K x 16 DRAM EDO PAGE MODE FEATURES ORDERING INFORMATION - PACKAGE X16 organization EDO Extended Data-Output access mode 2 CAS Byte/Word Read/Write operation 40-pin 400mil SOJ 44 / 40-pin 400mil TSOP (TypeII) Single 5V ( ± 10%) power supply

Contextual Info: PRELIMINARY LH532000B-S FEATURES • Low-power supply: 2.6 to 5.5 V CMOS 2M 256K x 8/128K x 16 3 V-Prive Mask-Program m able ROM • Packages: 40-pin, 600-mil DIP 40-pin, 525-mil SOP 44-pin, 1 0 x 1 0 mm2 QFP 44-pin, 14 x 14 mm2 QFP 48-pin, 1 2 x 1 8 mm2 TSOP (Type I)

Contextual Info: TSOP 2 44/40-P-400-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.49 TYP. 3/Dec. 10, 1996

Contextual Info: Features • Fast Read Access Time - 55 ns • Low Power CMOS Operation - 100 nA Maximum Standby - 40 mA Maximum Active at 5 MHz • JEDEC Standard Packages - 40-Lead 600 mil PDIP - 44-Lead PLCC - 40-Lead TSOP 10 mm x 14 mm • Direct Upgrade from 512K bit, 1M bit, and 2M bit

M11B416256A-35J

Abstract: M11B416256A ELITE* M11B416256A
Contextual Info: OLWH07 M11B416256A DRAM 256 K x 16 DRAM EDO PAGE MODE FEATURES y y y y y y y y y ORDERING INFORMATION - PACKAGE X16 organization EDO (Extended Data-Output access mode 2 CAS Byte/Word Read/Write operation 40-pin 400mil SOJ 44 / 40-pin 400mil TSOP (TypeII)

AT27C4096

Abstract: AT27C4096-55JC 27C4096 AT27C1024 AT27C2048 AT27C516 AT27C4096-12JC AT27C409612VC 40P6
Contextual Info: AT27C4096 Features • Fast Read Access Time - 55 ns • Low Power CMOS Operation • • • • • • • • – 100 µA Maximum Standby – 40 mA Maximum Active at 5 MHz JEDEC Standard Packages – 40-Lead 600 mil PDIP – 44-Lead PLCC – 40-Lead TSOP 10 mm x 14 mm

eb240

Contextual Info: 50P3G-F Plastic 50pin 400mil TSOP (LOC) EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 40 36 26 Recommended Mount Pad E Symbol 1 15 11 25 A D e L c L1 HE ME 50 I2 F y b A2 Detail F A A1 A2 b c D E e HE L

EM614163TS-30

Abstract: EM614163TS-35 EM614163TS-40 EM614163TS-45
Contextual Info: EtronTech Em614163A-30/35/40/45 256K x 16 High Speed EDO DRAM Preliminary Features Pin Assignment Top View • Fast Access Time: 30/35/40/45ns 40-Pin SOJ 40/44-Pin TSOP-II • Fast EDO Page Cycle Time: 13.3/15/16/18ns • EDO Page Mode Operation • Single +5V ¡Ó 10% Power Supply

44-P-400-0

Abstract: 44P4000
Contextual Info: 50P3W-L Plastic 50pin 400mil TSOP EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 50 36 26 E Recommended Mount Pad Symbol 1 11 15 25 A D e L c L1 HE ME 40 l2 F y b A2 Detail F A1 A A1 A2 b c D E e HE L L1

TSOP 44-40 Package

Contextual Info: 44P3W-S Plastic 44pin 400mil TSOP EIAJ Package Code TSOP II44/40-P-400-0.80 JEDEC Code – Weight(g) 0.47 Lead Material Alloy 42 e b2 l2 F 13 22 ME 10 Recommended Mount Pad E Symbol 44 35 32 A 23 c L D L1 HE 1 e y b A2 Detail F A1 A A1 A2 b c D E e HE

Contextual Info: 50P3W-M Plastic 50pin 400mil TSOP EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 25 E Recommended Mount Pad Symbol 50 40 36 26 A c L D L1 HE ME 15 l2 11 1 e y b A2 Detail F A A1 A2 b c D E e HE L L1 y

Contextual Info: AT27C4096 Features • • • • • • • • • • Fast Read Access Time - 85 ns Low Power CMOS Operation 100 nA Maximum Standby 40 mA Maximum Active at 5 MHz JEDEC Standard Packages 40-Lead 600 mil PDIP 44-Lead PLCC 40-Lead TSOP 10 mm X 14 mm Direct Upgrade from 512K bit, 1M bit, and 2M bit

AT27C4096-10JC

Abstract: AT27C4096-10PC AT27C4096-12VC 27C4096 AT27C1024 AT27C2048 AT27C4096 AT27C516 AT27C4096-10JI FROM512K
Contextual Info: AT27C4096 Features • • • • • • • • • • Fast Read Access Time - 85 ns Low Power CMOS Operation 100 µA Maximum Standby 40 mA Maximum Active at 5 MHz JEDEC Standard Packages 40-Lead 600 mil PDIP 44-Lead PLCC 40-Lead TSOP 10 mm X 14 mm Direct Upgrade from 512K bit, 1M bit, and 2M bit

AT27C1024-15DM

Abstract: T27C1024
Contextual Info: AT27C1024 Features • • Fast Read Access Tim e - 45 ns Low Power CMOS Operation 100 |xA max. Standby 30 mA max. Active at 5 MHz W ide Selection of JEDEC Standard Packages 40-Lead 600-m il PDIP and Cerdip 44-Pad PLCC and LCC 40-Lead TSOP 5 V ± 10% Power Supply

Contextual Info: AT27C4096 Features • • • • • • • • • • Fast Read Access Time - 85 ns Low Power CMOS Operation 100 |xA Maximum Standby 40 mA Maximum Active at 5 MHz JEDEC Standard Packages 40-Lead 600 mil PDIP 44-Lead PLCC 40-Lead TSOP 10 mm X 14 mm Direct Upgrade from 512K bit, 1M bit, and 2M bit

AT27C1024-15LC

Contextual Info: AT27C1024 Features • • • • • • • • • • Fast Read Access Tim e - 45 ns Low Power CMOS Operation 100 max. Standby 30 mA max. Active at 5 MHz W ide Selection of JEDEC Standard Packages 40-Lead 600-mil PDIP and Cerdip 44-Pad PLCC and LCC 40-Lead TSOP