TRANSISTOR WW1 Search Results

webcam circuit diagram

Abstract: 47803 NXP 125 kHz RFID tag EM4001 webcam Schematic Diagram schematic satellite finder finder delay relay
Contextual Info: NI myRIO Project Essentials Guide Ed Doering NI myRIO Project Essentials Guide Ed Doering Electrical and Computer Engineering Department Rose-Hulman Institute of Technology iv Printed April 23, 2014. Download the latest version at http://www.ni.com/myrio/project-guide.

EM4102

Abstract: WT11-E biphase encoder psk modulator demodulator circuit D73 transistor d92 02 H4102 16 PSK modulation Manchester code WT11E
Contextual Info: EM MICROELECTRONIC - MARIN SA EM4102 Read Only Contactless Identification Device Description Features The EM4102 previously named H4102 is a CMOS integrated circuit for use in electronic Read Only RF Transponders. The circuit is powered by an external coil

flashpro3 schematic

Abstract: TTL XOR2 LVCMOS15 kt 501
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP

Contextual Info: Revision 5 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •

Core8051

Abstract: U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip
Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)

ACTEL FUSION AFS1500

Abstract: 50 pin flat ribbon cable DC SERVO MOTOR CONTROL VHDL GF 036 V6 Logic Cross-Reference A54 ZENER AFS600-FG256 AQ3 Series flashpro3 schematic leon3
Contextual Info: Actel Fusion Handbook Low-Power Flash Device Handbooks Introduction Device Handbooks contain all the information available to help designers understand and use Actel's devices. Handbook chapters are grouped into sections on the website to simplify navigation. Each chapter of the handbook can be viewed as an individual PDF file.

A2F500M3

Abstract: A2F500 A2F500 FG484 A2F200-FG484 A2F500 pin details A2F060 A2F060M A2F200M3 A2F200M3F-FG256 A2F200M3F
Contextual Info: Revision 9 SmartFusion Customizable System-on-Chip cSoC Microcontroller Subsystem (MSS) • • • • • • • • • • • • Hard 100 MHz 32-Bit ARM Cortex -M3 – 1.25 DMIPS/MHz Throughput from Zero Wait State Memory – Memory Protection Unit (MPU)

TRANSISTOR ww1

Contextual Info: 19-1945; Rev 3; 12/06 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package The MAX4691–MAX4694 are low-voltage CMOS analog ICs configured as an 8-channel multiplexer MAX4691 , two 4-channel multiplexers (MAX4692), three singlepole/double-throw (SPDT) switches (MAX4693), and

ww1 87 transistor

Abstract: TRANSISTOR ww1
Contextual Info: 19-1945; Rev 4; 8/08 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package Applications Features ♦ 16 Bump, 0.5mm-Pitch UCSP 2mm x 2mm ♦ 1.8V Logic Compatibility ♦ Guaranteed On-Resistance 70Ω (max) with +2.7V Supply 35Ω (max) with +5V Supply

TRANSISTOR ww1

Contextual Info: 19-1945; Rev 2; 2/03 Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/ Quad SPDT in UCSP Package Applications Features ♦ 16 bump, 0.5mm-Pitch UCSP 2mm x 2mm ♦ 1.8V Logic Compatibility ♦ Guaranteed On-Resistance 70Ω (max) with +2.7V Supply 35Ω (max) with +5V Supply

PAC10

Abstract: Thin Quad flat package A3PN015
Contextual Info: 2 – ProASIC3 nano DC and Switching Characteristics General Specifications The Z feature grade does not support the enhanced nano features of Schmitt trigger input, coldsparing, and hot-swap I/O capability. Refer to the ordering information in the ProASIC3 nano

TDP 245 Y

Abstract: PAC10
Contextual Info: 2 – IGLOO PLUS DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing

PAC10

Abstract: JESD8-12A AGLN010
Contextual Info: 2 – IGLOO nano DC and Switching Characteristics General Specifications The Z feature grade does not support the enhanced nano features of Schmitt trigger input, Flash*Freeze bus hold, cold-sparing, and hot-swap I/O capability. Refer to the ordering information

CAT16-LV4F12

Abstract: PAC10 a3pe3000 JESD8-8 TBD 234 V12
Contextual Info: 2 – ProASIC3E DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA

PAC10

Contextual Info: 2 – IGLOOe DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Contextual Info: Revision 10 ProASIC3 nano Flash FPGAs Features and Benefits Advanced I/Os • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V

Contextual Info: Revision 11 ProASIC3 nano Flash FPGAs Features and Benefits Advanced I/Os • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V

AGL015

Abstract: AGL400 PAC10
Contextual Info: 2 – IGLOO DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grade are subject to change after establishing FPGA

A3PE600L

Abstract: PAC10 A3P1000 A3PE3000L PQ208
Contextual Info: 2 – Military ProASIC3/EL DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

RT3PE3000L

Abstract: LG484 RT3PE600L fpga radiation AES-128 CQ256 PAC10
Contextual Info: Advance v0.2 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging

REBB

Abstract: AES-128 FG256 FG484 SSTL-3
Contextual Info: v1.4 IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power

Contextual Info: Revision 12 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support Features and Benefits Pro Professional I/O • • • • High Capacity • 600 k to 3 Million System Gates • 108 to 504 kbits of True Dual-Port SRAM • Up to 620 User I/Os Reprogrammable Flash Technology

Contextual Info: Revision 12 IGLOOe Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology

A3PE600L

Abstract: A3PE3000L A3P1000 AES-128 FG144 FG484 PQ208 Bourns W 104
Contextual Info: v1.0 Military ProASIC3/EL Low-Power Flash FPGAs with Flash*Freeze Technology Advanced and Pro Professional I/Os†† Features and Benefits Military Temperature Tested and Qualified • Each Device Tested from –55°C to 125°C Firm-Error Immune •