TQFP 7X7 TRAY Search Results

MLX81207

Abstract: 008MIN JESD22-B102 tray drawing tqfp 5x5 tray drawing tqfp 7x7
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

QFN47

Abstract: MLX81207 melexis hall current sensor MLX16-FX QFN48 5x5 package JEDEC TRAY DIMENSIONS QFN 5x5 sensorless bldc driver
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

tqfp 7x7

Abstract: MLX16-FX
Contextual Info: MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces:

tqfp 7x7 tray

Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
Contextual Info: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1

S1L50552

Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
Contextual Info: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells

tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type

tray qfn 6x6

Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Contextual Info: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA

AD5820

Abstract: ad6548
Contextual Info: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

tqfp 7x7 tray

Abstract: Handsfree receiver sat tqfp 7x7 SUMI
Contextual Info: ACE9040 Audio Processor Advance Information FEATURES • Low Power and Low Voltage 3•6 to 5·0 V Operation ■ ■ ■ ■ ■ ■ ■ ■ ■ Power Down Modes Direct Connections to Microphone and Earpiece Compander with wide operating range: Compressor 74 db typ., Expander 36 dB typ.

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

Full Bridge N-Channel FET driver IC

Contextual Info: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o

MLX81150

Abstract: transistor smd code marking KEY marking code E2 p SMD Transistor ISO-7637-2 pulse 5 high voltage adc QFN32 pad SMD TRANSISTOR MARKING 3B 12v 4-pin DC MOTOR SPEED CONtrol ic 7637-2 pulse 1 jedec MS-026 ABA
Contextual Info: MLX81150 LIN-Slave for relay and DC motor control Features Microcontroller: MLX16x8 RISC CPU o o o 16 bit RISC-CPU Co-processor for fast multiplication and division In-circuit debug and emulation Memories o o o 32 kByte Flash with ECC 2 kByte RAM 384 Byte EEPROM with ECC for customer purpose

PD720114GA-9EU-A

Abstract: PD720114 PD720114GA-YEU-A uPD720114GA-9EU-A S17463E 1002 SQUELCH
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT PD720114 ECOUSBTM Series USB 2.0 HUB CONTROLLER The μPD720114 is a USB 2.0 hub device that complies with the Universal Serial Bus USB Specification Revision 2.0 and works up to 480 Mbps. USB 2.0 compliant transceivers are integrated for upstream and all downstream ports.

S17463E

Abstract: uPD720114 uPD720114GA-9EU-A PD720114 tqfp 7x7 tray electrical power cables data sheet tqfp 7x7 1.4 tray tray drawing tqfp 7x7 uPD720114GA uPD720114GA USB
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT PD720114 ECOUSBTM Series USB 2.0 HUB CONTROLLER The μPD720114 is a USB 2.0 hub device that complies with the Universal Serial Bus USB Specification Revision 2.0 and works up to 480 Mbps. USB 2.0 compliant transceivers are integrated for upstream and all downstream ports.

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

S17463E

Abstract: uPD720114 PD720114 PD720114k9 uPD720114GA-9EU-A PD720114GA-YEU-A uPD720114K9-4E4-A PD72011 S17462EJ6V0DS00 VBUSM
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: ASM2I99456 November 2006 rev 0.3 3.3V/2.5V LVCMOS Clock Fanout Buffer Features • Configurable output to input frequency ratios. The ASM2I99456 is 10 outputs LVCMOS Clock distribution buffer • specified for the extended temperature range of –40 to 85°C.

Contextual Info: PCS5I9653A November 2006 rev 0.3 3.3V 1:8 LVCMOS PLL Clock Generator Features running at either 4x or 8x of the reference clock frequency. • 1:8 PLL based low-voltage clock generator The PCS5I9653A is guaranteed to lock in a low power PLL • Supports zero-delay operation

Contextual Info: PCS5I9658 November 2006 rev 0.3 3.3V 1:10 LVCMOS PLL Clock Generator Features and the reference clock frequency determines the VCO • 1:10 PLL based low-voltage clock generator frequency. Both must be selected to match the VCO • Supports zero-delay operation

fp1320

Contextual Info: Guidelines for Handling J-Lead & QFP Devices Ju n e 1996, ver. 2 Introduction Application Note 71 S u rfa c e -m o u n t J-lead a n d q u a d flat p ac k Q FP d ev ic e s a re c u rre n tly in h ig h d e m a n d . A ll d ev ic e p a c k a g e s re q u ire p ro te c tio n d u rin g

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

HT 1200-4

Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher