TQFP 64 7X7 Search Results

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

TRAY DIMENSIONS TQFP 64

Contextual Info: TRAY CONTAINER 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' Applied Package 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick)

diode zd 33

Abstract: ze 003 tqfp 7x7 008ZD P64GA-40-HAB A333
Contextual Info: 64-PIN PLASTIC TQFP FINE PITCH (7x7) HD D detail of lead end 48 A3 33 49 c 32 θ L Lp E L1 HE (UNIT:mm) 64 17 1 16 ZE e ZD b x M A S A2 S y S NOTE Each lead centerline is located within 0.07mm of its true position at maximum material condition. A1 ITEM D

P64GA-40-9EV

Abstract: tqfp 64 7x7
Contextual Info: 64-PIN PLASTIC TQFP FINE PITCH (7x7) HD D detail of lead end 33 32 48 49 A3 c θ E L HE Lp L1 64 17 16 1 (UNIT:mm) ZE e ZD b x M S A A2 ITEM D DIMENSIONS 7.00±0.20 E 7.00±0.20 HD 9.00±0.20 HE 9.00±0.20 A 1.20 MAX. A1 0.10±0.05 A2 1.00±0.05 A3 b S c

USB3250-ABZJ

Abstract: 875u abzj
Contextual Info: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit

ic 812

Abstract: USB3250-ABZJ 56-PIN CRC-16 GT3200 GT3200-JD GT3200-JN USB3250
Contextual Info: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit

USB3250-ABZJ

Abstract: USB3250 GT3200-JV MO-220 8x8 68 56-PIN CRC-16 GT3200 GT3200-JD GT3200-JN debounce IC
Contextual Info: GT3200 64-PIN TQFP PACKAGES USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT FEATURES „ „ „ „ „ „ „ „ Datasheet USB-IF "Hi-Speed" certified to USB2.0 electrical specification Interface compliant with the UTMI specification (60MHz 8-bit unidirectional interface or 30MHz 16-bit

TQ32

Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Contextual Info: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*

gal16v8d programming algorithm

Abstract: gal programming algorithm vantis jtag schematic 1 of 8 selector 96 L 2 GAL16V8D LATTICE 3000 SERIES cpld PALCE610H-XX ISPGDX160A GAL22V10D
Contextual Info: Lattice and Vantis Product Selector Guide February 2000 Universe of Programmable Solutions Introduction Lattice and Vantis 3.3V and 2.5V ISP CPLD Families Lattice and Vantis. The companies that gave the world ISP and took you Beyond Performance now bring you their combined

IC51-0484-806

Abstract: IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-2564-1668-10 ic51-0804-795 ic51-0444-825 IC51-1604-1350
Contextual Info: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute

IC51-1844-1148

Abstract: IC51-128 IC51-1964-1952 IC51-1284-1433 IC201 ic51-0804-795 IC51-1014 IC51-1284-1788 IC51-0804-711 IC51-1764-1505-5
Contextual Info: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute

GAL 6001 programming Guide

Abstract: GAL programming Guide LQ128 16v8z gal16lv8c GAL16V8D GAL20V8B GAL22V10D sample 84 pin plcc lattice dimension pAL programming Guide
Contextual Info: Product Selector Guide September 2000 Lattice ISP Solutions Introduction ispMACH and ispLSI Lattice Semiconductor has developed three product lines, and associated design software, that allow you to design industryleading, reconfigurable systems today! Programmable logic designers continue to make demands that

GAL20V8B-15LD

Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
Contextual Info: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.

GAL22V1OD-15Q

Abstract: 5962-9476201mxc 2128VE-180L GAL22V10G 2064VE-100L
Contextual Info: Product Selector The following tables provide a brief description of the devices from Lattice Semiconductor. For additional information on these products, refer to the appropriate section of this book. For detailed device specifications go to the Lattice website at www.latticesemi.com or call 1-888-ISPPLDS and request an ISP Encylopedia on CD-ROM.

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Contextual Info: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink

IC51-1604-845-4

Abstract: IC51-1284-1788
Contextual Info: IC51- 064 4- 038 • 1 III! I ‘ Socket Series Insulation Resistance: Characteristics" 1,000MQminimum at 500 VDC Withstanding Voltage: 700 VAC for 1 minute Contact Resistance: 30mQ max. at 10mA/20mV (Initial) PES/PEI -55"C - +170*C Operating Temperature:

nec 44 pin LQFP

Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Contextual Info: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)

IC51-0484-806

Abstract: IC51-1764-1505-5 IC51-0644-807 IC51-0444-467 IC51-0324-1498 IC51-1004-814-7 IC51-2084-1509 IC51-1004-958-2 QFP11T044-001 IC51-1444-1354
Contextual Info: IC51 Series Clamshell QFP, PQFP , TQFP and MQUAD Specifications Part Number (Details) As specifications for this product differ by pitch and material-mix, please contact our Sales Department for detailed information. IC51 1,000M Ω min. at100V DC, 500V DC

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

Contextual Info: SPECIFICATION NO. REV. 2300-0011 A DOCUMENT TITLE: THERMAL CHARACTERISTICS OF MICREL IC ASSEMBLY OWNER: PACKAGE ENGINEER REQUIRED APPROVALS: PACKAGE ENGINEER DIRECTOR OF PACKAGING AND SUBCONTRACT ENGINEERING RELIABILITY MANAGER QUALITY VP AFFECTED PARTY NOTIFICATION: DO NOT INCLUDE REGULAR DISTRIBUTION

PAL 008 pioneer

Abstract: B0017 5962-9476101MXC GAL22V10 GAL22V10D lattice 2032 GAL16V8C-7LD
Contextual Info: Product Selector Guide High Performance In-System Programmable Logic Introduction 3.3V ispLSI 2000V Family Complete ISPTM Products Lattice’s revolutionary ISP products give customers the ability to program and reprogram logic devices right on the printed

ST72C314J4B6

Abstract: ST7FLITE39F2B6 ST72F324K2B6 ST72C334N4B6 ST72F324BK6T6 ST7MDT20M-EPB ST7MDT10-EPB ST7FLIT15BF1B6 tester SCR ST72C334J4B6
Contextual Info: Programming Tools Report: ST7 family 1 02 2006 ST7 ST72T101G1B6 ST7MDT1-EPB2 ST72T101G2B6 ST7MDT1-EPB2 ST72T212G2B3 ST7MDT1-EPB2 ST72T212G2B6 ST7MDT1-EPB2 ST72T213G1B6 ST7MDT1-EPB2 ST72T251G1B6 ST7MDT1-EPB2 ST72T251G2B6 ST7MDT1-EPB2 PP100 PSxxx Salestype Data IO

ATA5722

Abstract: ATAVRDRAGON AT97SC3204 tsop Ir sensor interface with atmega 16 atr0834t ATA5721 cd photo detector AT42QT4120 AT42QT5320 pc to pc communication using zigbee using AT89S52
Contextual Info: ATMEL PRODUCT GUIDE Winter 2008 Atmel Corporation ● 2325 Orchard Parkway ● San Jose, CA 95131 TEL: 408 441-0311 ● FAX: (408) 487-2600 Web Site: http://www.atmel.com ATMEL PRODUCT GUIDE Winter 2008 ATMEL’S PRODUCTS Atmel Corporation is a global leader in the design and manufacture of microcontrollers, and complementary products such as