TIM15 Search Results

Contextual Info: TOSHIBA Preliminary TIM1515-7L-191 1. RF PERFORMANCE SPECIFICATIONS Ta= 25C CHARACTERISTICS SYMBOL CONDITION Output Power at 1dB PldB Compression Point VDS=9V Power Gain at 1dB GldB f = 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

Contextual Info: TO S H IB A Preliminary TIM1515-4L-191 1. RF PERFORMANCE SPECIFICATIONS Ta= 25C SYMBOL CONDITION CHARACTERISTICS Output Power at 1dB PldB Compression Point VDS=9V Power Gain at 1dB GldB f= 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

Contextual Info: TOSHIBA Preliminary TIM1515-4L-191 1. RF PERFORMANCE SPECIFICATIONS I Ta= 25C SYMBOL CONDITION CHARACTERISTICS Output Power at 1dB PldB Compression Point VDS=9V Power Gain at 1dB GldB f= 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

TIM1515-7L-191

Contextual Info: TOSHIBA Preliminary TIM1515-7L-191 1. RF PERFORMANCE SPECIFICATIONS Ta= 25C CHARACTERISTICS SYMBOL CONDITION Output Power at 1dB PldB Compression Point VDS=9V Power Gain at 1dB GldB f= 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

TIM1515-7L-191

Contextual Info: TOSHIBA Preliminary TIM1515-7L-191 1. RF PERFORMANCE SPECIFICATIONS Ta= 25C \ SYMBOL CHARACTERISTICS CONDITION Output Power at 1dB PldB Compression Point VDS=9V Power Gain at 1dB GldB f = 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

Contextual Info: Preliminary TOSHIBA TIM1515-15L-191 1. RF PERFORMANCE SPECIFICATIONS Ta= 25C SYMBOL CONDITION CHARACTERISTICS Output Power at 1dB PldB Compression Point VDS=9V Power Gain at 1dB GldB f= 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

Contextual Info: TOSHIBA Preliminary TIM1515-2-191 1. RF PERFORMANCE SPECIFICATIONS Ta= 25C CHARACTERISTICS Output Power at 1dB Compression Point Power Gain at 1dB Compression Point Drain Current Power Added Efficiency SYMBOL PldB GldB CONDITION MIN. TYP. MAX. UNIT 32.5 33.5

Contextual Info: TOSHIBA Preliminary TIM1515-4L-191 1. RF PERFORMANCE SPECIFICATIONS I Ta= 25C SYMBOL CONDITION CHARACTERISTICS PldB Output Power at 1dB Compression Point VDS=9V Power Gain at 1dB GldB f= 15.45-15.65 Compression Point GHz Drain Current Ids Power Added Efficiency

STM32F051

Abstract: STM32F051R8 RM0091 STM32F0 STM32 IWDG STM32F051x STM32F051K STM32F051R stm32f05 STM32F051C8
Contextual Info: STM32F051x4 STM32F051x6 STM32F051x8 Low- and medium-density advanced ARM -based 32-bit MCU with 16 to 64 Kbytes Flash, timers, ADC, DAC and comm. interfaces Datasheet − production data Features • Core: ARM 32-bit Cortex™-M0 CPU, frequency up to 48 MHz

68HC05

Abstract: MC68HC705KJ1 MC68HC705KJ1C MC68HC705KJ1CDW MC68HC705KJ1CS MC68HLC705KJ1 MC68HRC705KJ1 HC05CPU Nippon capacitors
Contextual Info: MC68HC705KJ1/D Rev. 1.0 HC 5 MC68HC705KJ1 MC68HLC705KJ1 MC68HRC705KJ1 HCMOS Microcontroller Unit TECHNICAL DATA List of Sections Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

MC68HC705J1A

Abstract: 68HC05 M68HC05 MC68HC705J1AP MC68HRC705J1A MC68HSC705J1A MC68HSR705J1A Nippon capacitors
Contextual Info: MC68HC705J1A/D Rev. 2.0 HC 5 MC68HC705J1A MC68HRC705J1A MC68HSC705J1A MC68HSR705J1A HCMOS Microcontroller Units TECHNICAL DATA List of Sections Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . 5 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Contextual Info: STM32F318C8 STM32F318K8 ARM -based Cortex®-M4 32-bit MCU+FPU, 64 KB Flash, 16 KB SRAM, ADC, DAC, 3 COMP, Op-Amp, 1.8 V Datasheet - production data Features • Core: ARM 32-bit Cortex-M4 CPU with FPU 72 MHz max. , single-cycle multiplication and HW division, DSP instruction

Contextual Info: STM32F328x8 ARM -Cortex®-M4 32b MCU+FPU, 64KB Flash, 16KB SRAM, 2 ADCs, 3 DAC channels, 3 COMPs, Op-Amp, 1.8 V Datasheet −production data Features • Core: ARM®-32-bit-Cortex®-M4 CPU with FPU 72 MHz max , single-cycle multiplication and HW division, and DSP instruction

STM32F100xC

Abstract: STM32F1 STM32F100 STM32F100RC intel 8080 RM0059 stm32F100vc STM32F100RE STM32F100xD LQFP100 footprint
Contextual Info: STM32F100xC STM32F100xD STM32F100xE High-density value line, advanced ARM-based 32-bit MCU with 256 to 512 KB Flash, 16 timers, ADC, DAC & 11 comm interfaces Features • Core: ARM 32-bit Cortex -M3 CPU – 24 MHz maximum frequency, 1.25 DMIPS /MHz Dhrystone 2.1 performance

stm32f407xx

Abstract: STM32f4xx reference manual
Contextual Info: STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm)

Contextual Info: STM32F071xB ARM-based 32-bit MCU, 128 KB Flash, 12 timers, ADC, DAC & communication interfaces, 2.0 - 3.6 V Datasheet - preliminary data Features • Core: ARM 32-bit Cortex -M0 CPU, frequency up to 48 MHz LQFP100 14x14 mm UFQFPN48 LQFP64 10x10 mm 7x7 mm

PM0081 Programming manual

Abstract: PM0081
Contextual Info: STM32F415xx STM32F417xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ ■ ■ ● ■ ■ ■ ■ ■ FBGA Core: ARM 32-bit Cortex -M4 CPU with FPU,

MC68HC705J1A

Contextual Info: MC68HC705J1 A/D Rev. 2.0 MC68HC705J1A MC68HRC705J1A MC68HSC705J1A MC68HSR705J1A HCMOS Microcontroller Units TECHNICAL DATA Ä b3b?E4ö 0 1S ÔDL7 3^5 • M O TO R O LA ( S ) IN T E N T IO N A L L Y b3b?24fl DISfiObfi 221 B L A N K List of Sections List of Sections. 3

Contextual Info: STM32F334x4 STM32F334x6 STM32F334x8 ARM Cortex®-M4 32b MCU+FPU,up to 64KB Flash,16KB SRAM, 2 ADCs,3 DACs,3 comp.,op-amp,10-ch. high-resolution timer Datasheet −production data Features • Core: ARM®-32-bit-Cortex®-M4 CPU with FPU 72 MHz max , single-cycle multiplication

Contextual Info: STM32F078xx ARM -based 32-bit MCU, 128 KB Flash, crystal-less USB FS 2.0, 12 timers, ADC, DAC & comm. interfaces, 1.8 V Datasheet - production data Features • Core: ARM 32-bit Cortex-M0 CPU, frequency up to 48 MHz LQFP100 14x14 mm UFQFPN48 LQFP64 10x10 mm

Contextual Info: Type TIM Solid Tantalum Capacitors Molded, Radial Lead, Solid Tantalum Capacitors The Type TIM radial molded solid tantalum capacitor is great for saving board space with its higher profile and smaller board space requirement. It is ideal for high density packaging coupled with low DCL and

STM32F100

Abstract: Quadrature Encoder STM32F100C4 STM32F100C8 AN2606 stm32 timer STM32F100Cx LQFP64 STM32F100xx Flash programming manual TFBGA64 LQFP100
Contextual Info: STM32F100x4 STM32F100x6 STM32F100x8 STM32F100xB Low & medium-density value line, advanced ARM-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces Preliminary data Features • Core: ARM 32-bit Cortex -M3 CPU – 24 MHz maximum frequency,

STM32F100RBT6B

Abstract: stm32-discovery UM0919 fcm1608-0603 STM32 Discovery MB913 FCM1608 ESA8.00000F20D25F STM32F10* I2C stm32 value line discovery pin configuration
Contextual Info: UM0919 User Manual STM32VLDISCOVERY STM32 Value line Discovery Introduction The STM32 Value line Discovery evaluation board helps you discover the STM32 Value line features and to develop and share your applications. It is based on an STM32F100RBT6B and includes ST-Link embedded debug tool interface, LEDs and push buttons.

STM32F41x

Abstract: STM32F417 measurement of voltage using adc stm32f4 STM32f4xx reference manual PM0081 NAND sample code for stm32f2xx stm32F4 cortex-m4 stm32f417vg UFBGA176 STM32F415
Contextual Info: STM32F415xx STM32F417xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ ■ ■ ● ■ ■ ■ ■ ■ FBGA Core: ARM 32-bit Cortex -M4 CPU with FPU,