TI PACKAGE DESIGNATOR Search Results

Pin connection of bk 1085

Abstract: RICHTEK dk BK 1085 ti package designator SOT35 WBG SOT-23
Contextual Info: Analog and Logic Packaging The comprehensive guide to package solutions www.ti.com/analogpackaging 2011 Analog & Logic Packaging Solutions Data Analog & Logic Packaging Solutions Data Pin count Package type TI package designator Body length mm Min Max Body width (mm)

LT1460BCS3-10

Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

SZZA003

Abstract: thermal resistance of low power semiconductor
Contextual Info: Package Thermal Characterization Methodologies Application Report 1999 Printed in U.S.A 0399 SZZA003 Package Thermal Characterization Methodologies SZZA003 March 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products

56QN50T18080

Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

117450

Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP

MS 34100

Abstract: bq24004 bq24005 bq24006
Contextual Info: bq24004/5/6 DualĆCell LiĆIon Charger With Integrated FET in TSSOPĆ20 Package EVM User’s Guide June 2002 Advanced Analog Products SLUU110A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,

Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON 3361 1/4 ˝ Square SMD Trimming Potentiometer Features • Compatible with surface mount Sealed ■ Miniature package ■ Rotor designed for automatic machine adjust interface ■ Withstands harsh environments and

Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • ■ ■ 33 62 3 ■ Single-Turn / Cermet / Industrial / Sealed Miniature package Rotor designed for automatic machine adjust interface Withstands harsh environments and immersion cleaning processes ■

3362P

Abstract: 3362H 3362M 3362R 3362S 3362X H-90
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • ■ ■ ■ 33 62 3 Single-Turn / Cermet / Industrial / Sealed Miniature package Rotor designed for automatic machine adjust interface Withstands harsh environments and immersion cleaning processes ■

SPRU811

Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
Contextual Info: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

OPA341

Abstract: 04022F104Z7B20D 0402YD333KAT2A CDC7005 DB-25P-PCB J27-15
Contextual Info: CDC7005 BGA Package Evaluation Module Manual High Performance Analog/CDC User’s Guide 2005 Clock Drivers SCAU005D IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

Contextual Info: User's Guide SLUUA44A – December 2012 – Revised August 2013 bq51013xEVM-764 Evaluation Module WCSP Package The bq51013xEVM (HPA764-001 and HPA764-003) wireless power receiver evaluation kit from TI is a high-performance, easy-to-use development kit for the design of wireless power solutions. It helps

Contextual Info: CDCM7005 BGA Package Evaluation Module Manual HPA/High Speed Communications User’s Guide 2005 Clock Drivers SCAU013A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

Contextual Info: CDCM7005 QFN Package Evaluation Module Manual HPA/High Speed Communications User’s Guide 2005 Clock Drivers SCAU015A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

Contextual Info: CDC7005 BGA Package Evaluation Module Manual High Performance Analog/CDC User’s Guide 2006 Clock Drivers SCAU005E IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

SLMA002

Abstract: land pattern for tSOP56 double sided pcb, thermal via "x-ray machine" TQFP64 land package cut template DRAWING tsop20 TQFP100 TQFP64 TSOP24
Contextual Info: PowerPAD Thermally Enhanced Package TECHNICAL BRIEF: SLMA002 Mixed Signal Products Semiconductor Group 21 November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

bq27000

Abstract: bq27010 bq27200 bq27210 bq27500 bq27510
Contextual Info: HARDWARE COMMUNICATION FIRMWARE GAUGING ALGORITHM Application package designator package size device pin BAT pin Voltage Divider Register backup Thermistor GPIO count internal LDO interface bq27000 SON-DRK 4x3mm 10 No through RBI pin internal 1 None required

ADS5500

Abstract: OPA695 OPA847 THS3201 THS3202 THS4503 THS9001 TQFP-64 ADS5500 HTQFP-64
Contextual Info: ADS5500 SBAS303C − DECEMBER 2003 − REVISED MARCH 2004 14ĆBit, 125MSPS AnalogĆtoĆDigital Converter ADS5500 www.ti.com SBAS303C − DECEMBER 2003 − REVISED MARCH 2004 PACKAGE/ORDERING INFORMATION 1 PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR SPECIFIED

Contextual Info: ACTS541MS Semiconductor Radiation Hardened Octal Three-State Buffer/Line Driver January 1996 Features Pinouts • Devices QM L Qualified in Accordance with MIL-PRF-38535 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW

Contextual Info: R EG 103 REG REG103 103 REG 103 SBVS010D – JANUARY 2000 – REVISED SEPTEMBER 2005 DMOS 500mA Low-Dropout Regulator FEATURES DESCRIPTION ● NEW DMOS TOPOLOGY: Ultra Low Dropout Voltage: 115mV Typ at 500mA and 3.3V Output Output Capacitor NOT Required for Stability

TPS658629I

Contextual Info: TPS658629-Q1 SLVSAT6 – JUNE 2011 www.ti.com Advanced Power Management Unit Check for Samples: TPS658629-Q1 1 INTRODUCTION 1.1 MAIN FEATURES 1 • Qualified for Automotive Applications • INTEGRATED POWER SUPPLIES – 3 Programmable Step-Down Converters

TSC20141

Abstract: TSC2014I touch screen bus I2C
Contextual Info: TSC2014 www.ti.com SBAS522 – SEPTEMBER 2010 1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire TOUCH SCREEN CONTROLLER with I2C Interface Check for Samples: TSC2014 FEATURES APPLICATIONS • • • • • • • • • • • 1 23 • • • • • • 4-Wire Touch Screen Interface