TI PACKAGE DESIGNATOR Search Results
TI PACKAGE DESIGNATOR Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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DE6B3KJ101KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KB4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ102MN4A | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ472MA4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
TI PACKAGE DESIGNATOR Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Pin connection of bk 1085
Abstract: RICHTEK dk BK 1085 ti package designator SOT35 WBG SOT-23
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PFM/TO--263/DDPAK OT/SC-70 OT/SOT-23 OT/SOT-89 O-220 OT/SOT-223 OT-143 PFM/TO-263/DDPAK Pin connection of bk 1085 RICHTEK dk BK 1085 ti package designator SOT35 WBG SOT-23 | |
LT1460BCS3-10
Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
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20-Lead 20-Lead 28-Lead LT1613CS5 LT1615CS5 LT1615CS5-1 LT1617CS5 LT1617CS5-1 LT1761ES5-1 LT1761ES5-2 LT1460BCS3-10 marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS | |
SZZA003
Abstract: thermal resistance of low power semiconductor
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SZZA003 MIL-STD-883 SCAA022A SZZA003 thermal resistance of low power semiconductor | |
56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
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SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb | |
jesd 51-7
Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
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SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000 | |
117450
Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
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20-Lead 20-Lead O-220 117450 TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83 | |
MS 34100
Abstract: bq24004 bq24005 bq24006
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bq24004/5/6 TSSOP20 SLUU110A SLUP051 MS 34100 bq24004 bq24005 bq24006 | |
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON 3361 1/4 ˝ Square SMD Trimming Potentiometer Features • Compatible with surface mount Sealed ■ Miniature package ■ Rotor designed for automatic machine adjust interface ■ Withstands harsh environments and |
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greater30 | |
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • ■ ■ 33 62 3 ■ Single-Turn / Cermet / Industrial / Sealed Miniature package Rotor designed for automatic machine adjust interface Withstands harsh environments and immersion cleaning processes ■ |
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3362U-1 3362P-1 1000/REEL/BOX 750/REEL 1000/BOX | |
3362P
Abstract: 3362H 3362M 3362R 3362S 3362X H-90
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3362P-1 750/REEL 1000/BOX 3362P 3362H 3362M 3362R 3362S 3362X H-90 | |
SPRU811
Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
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SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate | |
OPA341
Abstract: 04022F104Z7B20D 0402YD333KAT2A CDC7005 DB-25P-PCB J27-15
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CDC7005 SCAU005D OPA341 04022F104Z7B20D 0402YD333KAT2A CDC7005 DB-25P-PCB J27-15 | |
Contextual Info: User's Guide SLUUA44A – December 2012 – Revised August 2013 bq51013xEVM-764 Evaluation Module WCSP Package The bq51013xEVM (HPA764-001 and HPA764-003) wireless power receiver evaluation kit from TI is a high-performance, easy-to-use development kit for the design of wireless power solutions. It helps |
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SLUUA44A bq51013xEVM-764 bq51013xEVM HPA764-001 HPA764-003) bq51013A bq51013B | |
Contextual Info: CDCM7005 BGA Package Evaluation Module Manual HPA/High Speed Communications User’s Guide 2005 Clock Drivers SCAU013A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue |
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CDCM7005 SCAU013A 10KR69 SN74LV125 C72100n CDCM7005EVM CDCM7005 | |
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Contextual Info: CDCM7005 QFN Package Evaluation Module Manual HPA/High Speed Communications User’s Guide 2005 Clock Drivers SCAU015A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue |
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CDCM7005 SCAU015A 10KR69 SN74LV125U3 C72100n CDCM7005EVM CDCM7005 | |
Contextual Info: CDC7005 BGA Package Evaluation Module Manual High Performance Analog/CDC User’s Guide 2006 Clock Drivers SCAU005E IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue |
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CDC7005 SCAU005E | |
SLMA002
Abstract: land pattern for tSOP56 double sided pcb, thermal via "x-ray machine" TQFP64 land package cut template DRAWING tsop20 TQFP100 TQFP64 TSOP24
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SLMA002 SLMA002 land pattern for tSOP56 double sided pcb, thermal via "x-ray machine" TQFP64 land package cut template DRAWING tsop20 TQFP100 TQFP64 TSOP24 | |
Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
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SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100 | |
bq27000
Abstract: bq27010 bq27200 bq27210 bq27500 bq27510
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bq27000 bq27200 bq27010 bq27210 bq27500 bq27510 | |
ADS5500
Abstract: OPA695 OPA847 THS3201 THS3202 THS4503 THS9001 TQFP-64 ADS5500 HTQFP-64
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ADS5500 SBAS303C 14Bit, 125MSPS 14-Bit 125MSPS 100MHz 82dBc 578mW ADS5500 OPA695 OPA847 THS3201 THS3202 THS4503 THS9001 TQFP-64 ADS5500 HTQFP-64 | |
Contextual Info: ACTS541MS Semiconductor Radiation Hardened Octal Three-State Buffer/Line Driver January 1996 Features Pinouts • Devices QM L Qualified in Accordance with MIL-PRF-38535 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW |
OCR Scan |
ACTS541MS MIL-STD-1835 CDIP2-T20, MIL-PRF-38535 600mm ACTS541 | |
Contextual Info: R EG 103 REG REG103 103 REG 103 SBVS010D – JANUARY 2000 – REVISED SEPTEMBER 2005 DMOS 500mA Low-Dropout Regulator FEATURES DESCRIPTION ● NEW DMOS TOPOLOGY: Ultra Low Dropout Voltage: 115mV Typ at 500mA and 3.3V Output Output Capacitor NOT Required for Stability |
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REG103 SBVS010D 500mA 115mV OT223-5, REG103 | |
TPS658629IContextual Info: TPS658629-Q1 SLVSAT6 – JUNE 2011 www.ti.com Advanced Power Management Unit Check for Samples: TPS658629-Q1 1 INTRODUCTION 1.1 MAIN FEATURES 1 • Qualified for Automotive Applications • INTEGRATED POWER SUPPLIES – 3 Programmable Step-Down Converters |
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TPS658629-Q1 TPS658629I | |
TSC20141
Abstract: TSC2014I touch screen bus I2C
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TSC2014 SBAS522 12-Bit, 10-Bit 12-Bit 430mW 50SSPS 320mW TSC20141 TSC2014I touch screen bus I2C |