TI F 540 Search Results

Contextual Info: F u ti DuplM C Quad 10Base-T Ethernet Media Interface Adapter Technology Incorporated PRELIMINARY _J u ly 1995 SEEQ Full Duplex Designation Symbol identifies product as Full Duplex device. Features • Single Chip Interface Between Ethernet Controller

Contextual Info: AN2150S *^ m \c AN2150S Video Camera Signal Processing Circuit M i s t m Unit: mm A N 2 1 5 0 S I± , C C D t ' T ' t t i / y 'f S f f l M W i f i i - C - t . CDS|nIifS*'i><7 fn-‘'/ * i f t e 'L , A G C - ^ > - ^ * ir .f t, frfv , ti 7 —ffi'-'J- £• H'i is L i t .

taiyo 88-R

Abstract: LHL13 k1 060.05 Taiyo 93 T LHLZ06 LAV35VBR47M
Contextual Info: RADIAL LEADED INDUCTORS LHL08~LHL16&#39;>U - X ö ^ r - X iL H F D D D B B lä A - T .J ^ - f T \ Â ÎS iT W g Æ S iÈ tÎU ff tâ •'M lilfflC : ti LAV35/LH L06 i f t i fB ■ IZ l ì LHLC06/LHLZ06/LHL08/LHL10/LHL13/LHL16/LHFDDDBB tfW fo • L H F D D D B B iii^ li i f t í f ÄS'W

kcd3

Abstract: UPD6121f PD17012GF KT77 7012GF 51I7 KVF1 FC-7 3P ks-49 KTVA
Contextual Info: T — $ • S '— h S M O S * a iilS & M O S In te g ra te d C ircuit j t t P D 1 i f * (M W FM, MW , L W f i - t P L U a * lB ^ 7 <fc * > ' : ] > 1 2 G F - 5 3 m h P - 7 AiP D 1 7 0 1 2 G F -0 5 3 ti^ # ^ f& < 7 P L L JiiÈ S '> > -tri# -< 1 f^ F M > MW, L W* . ! —

1N4097

Abstract: 1N5107 1N508 MZ-11 MZ240 MZ210 1N5117 MZ80 1N5064 1N5065
Contextual Info: 1N5063 - 1N5117 MZ806 - MZ890, MZ 210 - MZ 240 Micro/semi Corp. The diode expprts SANTA A N A , CA F o r m o r e i n f o r m a ti o n call: 714 979-8220 3-WATT GLASS ZENER DIODES FEATURES • • • • • • • Microminiature package. Voidless hermetically sealed glass package.

HARRIS IRFD110

Abstract: IRF510
Contextual Info: H AR RIS SEIUCOND SECTOR bflE D • 430EB71 O D S lD ib ■ HAS PCF110W HARRIS a 41b SEMICONDUCTOR P January1993 ^ j F 1 1 O D N-Channel MOS Chip Features Die • Passivated • Contact Metallization - Gate and Source - Aluminum - Drain - Tri-Metal AI-Ti-NI

DIAGRAM TV

Contextual Info: Cl A d v a n c e I n f o rm a ti o n Advanced Micro Devices Am27C51 131,072-Bit 16384 x 8 High-Performance CMOS PROM DISTINCTIVE CHARACTERISTICS • High-speed (45 ns)/Low-Power (90 mA) CMOS EPROM Technology ■ Direct plug-in replacement tor Bipolar PROMs

Contextual Info: ADVANCE M IC R O N 9 I 16, 32 MEG X 32 SDRAM DIMMs TECHNOLOGY, INC. MT8LSDT1632U, MT8LSDT3232U SYNCHRONOUS DRAM MODULE F or the latest full-length data sheet, please refer to the Micron Web site: www. m icron, co m /m ti/m s p /h tm i/ datasheet.html FEATURES

rtl 8112

Abstract: D70216 nec v40 kaf 401 VP15-367-3 32tfv PD70208HGK-16-9EU BS211 PD71054 16-3B9
Contextual Info: 7 s— $ ‘ y — h NEC M O S * » i]& MOS Integrated Circuit P D 7 0 2 0 8 H ,7 0 2 1 6 H V40HL , V50HL™ 16/ 8, 16k '-y K • V - f Ï U - f n - k y - ÿ fi P D 70208H S IJ ^ ^ V 4 0 H L itt L-/c ^ P D 7 0 2 0 8 It, 1 6 ti v (S U £ fô V 4 0 ™ )

Contextual Info: T O S H IB A "TT {D IS C R E T E /O P T O } 9097250 TOSHIBA DISCRETE/OPTO » F I^ O T T S S O 99D 17084 QD17DÖ4 D-p-Hl'c?) TLPGI63,TLPGI64 GaP GREEN LIGHT EMISSION 3. I mm DIAMETER(TI) I FEATURES! . PURE COLOR . All Plastic Mold Type TLPG163 : Light Green Transparent Lens

Contextual Info: F-206 iam ti M T S W -1 1 8 -0 8 -G -D -2 0 0 -R A M T S W -1 2 5 -2 4 -L -T -2 2 5 JSy M O D IFIED i nr ougn ^ Mates with: SSW, SSQ, ESW, ESQ, BCS, BSW, IDSS, IDSD, CES, SLW, HLE Modified .025" strips permit custom post heights Samtec offers the greatest

Contextual Info: F-206 iam ti T S T -1 1 5 -0 3 -G -D Z S S -1 10 - 0 3 -S -D - 7 1 5 i n ro u g n ^ JSV SHROUDED HEADER zI t ’sI rieI 8’ Mates with: SSW, SSQ, SSM, ESW, ESQ, BCS, IDSD TYPE STRIP APPLICATIONS SSW or BCS TSS Slim body to prevent misalignment w PLATING OPTION

MIL-STD-1835D

Contextual Info: R REV .540 [ 005 [ . 1 2 3 . MAX 7 2 C 266 + . - . 5.76 004 006 +0 . 1 0 DATE 10/13/1997 TL/KH 12013 06/15/1998 MS/CD ADD LAND PATTERN; REV IS E TI T L E PER STDS; U P D A T E N O T E 3; C H A N G E D W G F O R M A T T O B S I Z E 2366 07/26/2007 TL/JL REVISE

mikroelektronik ddr

Abstract: Halbleiterbauelemente DDR VEB mikroelektronik Datenblattsammlung tda 8841 s1 mikroelektronik datenblattsammlung ub8830d ub 8820 einchipmikrorechner ub 8840
Contextual Info: D ^ lklñ^ oloi-Cfew + » J l I e le k tr o n ik - b a u e » a m e n ti : -'i ÈÊêîêèêêSSIê I ê ê S i l S lä lg ÊM ÊÈÊÈM as“"s^^ NurfiirdenDienstûêlriBé rii: lèmm ^ ! f DATENBLATTSAMMUUNn elektronische baueiemente — ^SSii! • a ¡S

Contextual Info: IN D µ UCT H A ±1 NC 0% E Q MI NI MU M TE ST FR EQ UE NC SR Y F (M MI Hz NI ) MU M DC (M Hz MA RES ) XI IST MU A M NC (O E CU HM RR MA E S) N X. T (m RA A) TI NG 4302R 4302 NU MB ER * Series DA SH Temperature Stable Surface Mount Inductors SERIES 4302 POWDERED IRON CORE

472K

Contextual Info: IN D µ UCT H A ±1 NC 0% E Q MI NI MU M TE ST FR EQ UE NC SR Y F (M MI Hz NI ) MU M DC (M Hz MA RES ) XI IST MU A M NC (O E CU HM RR MA E S) N X. T (m RA A) TI NG 4302R 4302 NU MB ER * Series DA SH Temperature Stable Surface Mount Inductors SERIES 4302 POWDERED IRON CORE

Contextual Info: IN DU CT AN CE n Q H MI ±5 NI MU % M TE ST FR EQ CU UE R NC MA RE Y (M X. NT Hz (A RA m TI ) p SR s) NG F MI NI MU M (M Hz ) TU RN S DA SH Air Core Inductors (R ef .) 5526R 5526 NU MB ER * Series SERIES 5526 RF INDUCTORS -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11

SRF 1140

Abstract: HP16193A HP4291A
Contextual Info: IN DU CT AN CE n Q H MI ±5 NI MU % M TE ST FR EQ CU UE R NC MA RE Y (M X. NT Hz (A RA m TI ) p SR s) NG F MI NI MU M (M Hz ) TU RN S DA SH Air Core Inductors (R ef .) 5526R 5526 NU MB ER * Series SERIES 5526 RF INDUCTORS -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11

HP16193A

Abstract: SRF 1140 5526 Intermediate frequency Semiconductor RF HP4291A 5526-2
Contextual Info: R ef . IN DU CT AN CE (n Q H) MI ±5 NI MU % M TE ST FR EQ CU UE R NC MA RE Y (M X. NT Hz (A RA m TI ) p SR s) NG F MI NI MU M (G Hz ) PA RT Air Core Inductors TU RN S NU MB ER Series 5526 SERIES 5526 9 10 11 12 13 14 15 16 17 18 19 20 90 111 130 169 206

f0035

Abstract: cat c15 ecm esm 310 bp frs3 relay TRANSISTOR SMD MARKING CODE 352 XS42 infineon marking RFs rsn 311 RSN 310 R 36 f0058
Contextual Info: Da ta Sh ee t, D S 1, J ul y 20 00 F A LC - L H E 1/ T1 /J 1 Fr a m er a nd L i n e In te r fa c e C om p on e nt f or L on g an d S h or t H au l A p p li c a ti o ns P EB 22 5 5 V er s i o n 1 .3 Da ta c o m N e v e r s t o p t h i n k i n g . Edition 2000-07

Contextual Info: O > -I m > S m DWG.NO. Ü3 o o o O o s ti » £ 5> m c 3 o o CD O Ö' H 04-004-07 S1 O o o o T«5 Q. This m ate ria l and the in fo rm a tio n h erein is the p ro p e rty of Fuji Electric Co.Ltd. They shall be neither reproduced, copied, le nt, or d isclosed in any way whatsoever fo r the use o f any

IG8T

Contextual Info: 1 l»ny the e*press woy w h n ts o o v e r ol It ll«e p ro per lv ol w iih o u l USO ol a n y Co . l i d p u rp oses lor ih$ Fuji Electric lor ihr» rn a n u la c lu rin g w i l l le n c o n s e n t third p a rly .n o f used herein sl>«» be nei|l»er 'rip ro d u ca ti, c o p ie d

Contextual Info: S PLB22A SP 540 Dots Data Bank AUG. 28, 2001 Version 1.4 SUNPLUS TECHNOLOGY CO. reserves the right to change this documentation without prior notice. Information provided by SUNPLUS TECHNOLOGY CO. is believed to be accurate and reliable. However, SUNPLUS TECHNOLOGY CO. makes no warranty for any errors which may appear in this document.

Contextual Info: Customer Information Sheet DRAWING No.: SHEET M80-540XXXX 2 OF 2 I IF IN DOUBT - ASK | c | NOT TO SCALE | THIRD ANGLE PROJECTION SECTION X-X (3.0) ALL DIMENSIONS SPECIFICATIONS: MATERIAL: MOULDING = G L A S S - F I L L E D PPS, U L9 4V -0 , BLACK CONTACT = PHOSPHOR BRONZE