Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    THERMAL CONDUCTIVITY OF SUMITOMO G770 Search Results

    THERMAL CONDUCTIVITY OF SUMITOMO G770 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER
    		Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical PDF
    TCTH022AE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Datasheet
    TCTH011AE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Datasheet
    TCTH011BE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type Datasheet
    TCTH012AE
    		Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Datasheet

    THERMAL CONDUCTIVITY OF SUMITOMO G770 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PCN0516

    Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
    Contextual Info: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA


    Original     		PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo PDF

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC PDF