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    THERMAGON FOLDED FIN Search Results

    THERMAGON FOLDED FIN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U90G6T1100A
    Amphenol Communications Solutions ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 1X6 CAGE PIN-FIN HS. PDF
    UE36-C26200-05A3A
    Amphenol Communications Solutions 1x2 QSFP-DD cage assembly with 6.5mm height fin pin style heat sink PDF
    UE36-C16221-06A4A
    Amphenol Communications Solutions 1x1 QSFP-DD cage assembly with 13.5mm height fin pin style heat sink, dual light pipe PDF
    UE36-C16200-05C3A
    Amphenol Communications Solutions 1x1 QSFP-DD cage assembly with 6.5mm height fin pin style side to side heat sink PDF
    UE36C1660005A4A
    Amphenol Communications Solutions 1x1 QSFP-DD cage assembly, one rear pin, with 13.5mm height fin pin style heat sink PDF

    THERMAGON FOLDED FIN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Sumitomo G750

    Abstract: G750 thermal conductivity Thermagon motor speed control mc-60 shicoh Thermagon t pad XTS454 T-PLI 200 thermagon Texas Instruments epoxy Sumitomo PBGA-B495
    Contextual Info: Intel Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000 Order Number: 273285-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    fcbga package weight

    Abstract: Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749
    Contextual Info: Thermal Design Guideline for Intel Processors in the BGA2 and Micro FC-BGA Packages for Embedded Applications April 2002 Order Number: 273716-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    EID-LPT-ALX-003 EID-LPT-ALX-004 EID-LPP3-ALX-001 fcbga package weight Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749 PDF

    intel packaging handbook 240800

    Abstract: OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36
    Contextual Info: Pentium II Processor – Low Power Thermal Design Guide Application Note September 1999 Order Number: 273254-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    NP970482 NP971803 NP971804 intel packaging handbook 240800 OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36 PDF

    AMD thermal design guide

    Abstract: T-pcm905C Thermagon PCM905C AMD athlon design guide T725 temperature controlled fan project AMD Processor Power and Thermal Thermocouple Type T material testing
    Contextual Info: AMD Thermal, Mechanical, and Chassis Cooling Design Guide Publication # 23794 Rev: B Issue Date: October 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or


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    23794B--October AMD thermal design guide T-pcm905C Thermagon PCM905C AMD athlon design guide T725 temperature controlled fan project AMD Processor Power and Thermal Thermocouple Type T material testing PDF

    Thermagon PCM905C

    Abstract: HF225UT PCS-TC-11T-13 socket 462 motherboard diagram 462 motherboard electrical diagram Thermocouple Type K material testing Athlon 64 motherboard design guide PCM45 AMD Athlon 64 pin diagram DURON
    Contextual Info: AMD Thermal, Mechanical, and Chassis Cooling Design Guide Publication # 23794 Rev: H Issue Date: November 2002 2000–2002 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or


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    23794H--November Thermagon PCM905C HF225UT PCS-TC-11T-13 socket 462 motherboard diagram 462 motherboard electrical diagram Thermocouple Type K material testing Athlon 64 motherboard design guide PCM45 AMD Athlon 64 pin diagram DURON PDF

    schematic intel chipset 945 motherboard

    Abstract: atx power supply design 945 MOTHERBOARD CIRCUIT diagram Intel BGA 82803AA flotherm centrifugal blowers intel 945 circuit diagram motherboard PCB diagram 82801AA
    Contextual Info: R Intel 840 Chipset Thermal Design Considerations Application Note July 2000 Order Number: 298027-002 ® Intel 840 Chipset Thermal Design Considerations R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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