MMF-06D24DS
Abstract: ebm w2s107-aa01-16 CT3D55F 4124X "japan servo" ebm w2s107-ab05-40 NMB 3110nl-05w-b50 ebm w2s107-aa01-40 CT3B60D3 4124-GX
Contextual Info: Comair Rotron Cross Reference Part Number Competitor Comair Rotron 012P535P-24V 012P540 Control 012P545 Control 024P540 Control 024P545 Control 0410N-12 0410N-12H 0410N-12L 0410N-5 Shicoh 109-033UL 109-040UL 109-041UL 109-043UL 109-044UL 109-047UL 109-105UL
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012p535p-24v012p540012p545024p540+16024p5450410n-120410n-12h0410n-12l0410n-5109-033ulmmf-06d24dsebm w2s107-aa01-16ct3d55f4124xjapan servoebm w2s107-ab05-40nmb 3110nl-05w-b50ebm w2s107-aa01-40ct3b60d34124-gx
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FUJIKURA fan
Abstract: shicoh intel packaging handbook 240800 gus manual AD1021 PGA370 XTS454 273421 sunon fan NISSEI GUIDE
Contextual Info: Intel Celeron Processor Thermal Design Guide Application Note December 2000 Order Number: 273421-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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i3-8637fujikura fanshicohintel packaging handbook 240800+7gus manualad1021pga370xts454273421sunon fannissei guide
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Sumitomo G750
Abstract: G750 thermal conductivity Thermagon motor speed control mc-60 shicoh Thermagon t pad XTS454 T-PLI 200 thermagon Texas Instruments epoxy Sumitomo PBGA-B495
Contextual Info: Intel Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000 Order Number: 273285-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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sumitomo g750g750 thermal conductivitythermagonmotor speed control mc-60+6shicohthermagon t padxts454t-pli 200 thermagontexas instruments epoxy sumitomopbga-b495
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intel DOC
Abstract: Intel Environmental Standards handbook BRD22 shicoh intel HANDBOOK c0180-018-0250
Contextual Info: 80960 RM/RN 42.5 mm H-PBGA SHOCK TEST REPORT FOR HEATSINK THERMAL SOLUTIONS Test Performed by Kimberly Harth and Eric Gelvin, Intel Corporation CEG Packaging Engineering March 1999 Purpose The purpose of the board-level mechanical testing for the 80960 RM/RN is to determine that there is no
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intel docintel environmental standards handbookbrd22shicoh+2intel handbookc0180-018-0250
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POWER TRANSFORMER E154515
Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Contextual Info: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD
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power transformer e154515scheme e131175sampo e159656foxconn e253117+6e131175xepex e140166sony bando power transformerpower transformer e190246tamradio transformere199273
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intel packaging handbook 240800
Abstract: OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36
Contextual Info: Pentium II Processor – Low Power Thermal Design Guide Application Note September 1999 Order Number: 273254-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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np970482np971803np971804intel packaging handbook 240800+9ob-101shicohthermagonpbga-b615bga heatsink compressive forcepcm9105tc-ttk-36-36compactpci specification5tc-tt-k-36-36
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rifa PME271Y
Abstract: evox-rifa pmr rifa capacitor rifa capacitor PME260 Rifa pmr evox pmr series phe830 PME289 rifa pme PME285 RIFA Y2
Contextual Info: CAPACITORS FOR RFI SUPPRESSION OF THE AC LINE: BASIC FACTS Fourth Edition Copyright 1996 Evox-Rifa, Inc. 300 Tri-State International, Su. 375 Lincolnshire, IL 60069 847 948 9511 Table of Contents The Need For RFI Suppression . 1
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500vac660vac250vacrifa pme271y+9evox-rifa pmrrifa capacitorrifa capacitor pme260rifa pmrevox pmr seriesphe830pme289rifa pmepme285 rifa y2
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