TGON 800 Search Results

ASTM D5470

Abstract: Tgon 800 D5470 Tgon tgon 805 D412 E595 D2240 D257 ASTM D2240
Contextual Info: TgonTM 800 Series Electrically and Thermally Conductive Interface Pad Innovative Technology for a Connected World High-PERFORMANCE, cost effective thermal interface material Used where electrical isolation is not required, Tgon 800 is ideal for where electrical

diamond antenna

Abstract: T-Flex 200 CP177 Tgon T-gon 22 CP230 K177 K228 K200 FSF52
Contextual Info: THERMAL_SHORTFORM3 14/12/05 4:52 pm Page 1 global solutions : local support Laird Technologies is the world’s leading designer and manufacturer of electromagnetic interference [EMI] shielding materials, thermal interface products, and wireless antenna

Contextual Info: 19-0810; Rev 0; 4/07 Overvoltage Protectors with External pFET Features The MAX4923–MAX4926 overvoltage protection OVP controllers protect low-voltage systems against high-voltage faults of up to +28V with an appropriate external pFET. When the input voltage exceeds the overvoltage lockout (OVLO) threshold, or falls below the

446V

Abstract: MAX4923 L611 to control
Contextual Info: 19-0810; Rev 0; 4/07 Overvoltage Protectors with External pFET Features The MAX4923–MAX4926 overvoltage protection OVP controllers protect low-voltage systems against high-voltage faults of up to +28V with an appropriate external pFET. When the input voltage exceeds the overvoltage lockout (OVLO) threshold, or falls below the

AN3263

Abstract: metric bolts tightening torque graphite foil m2 m2.5 m3 bolt tensile bts 2140 1b data sheet "RF Power Transistors"pallet metric bolts torque metric bolts torque m 32 omp amplifier A104
Contextual Info: Freescale Semiconductor Application Note AN3263 Rev. 0, 6/2006 Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over - Molded Plastic Packages By: Mahesh Shah, Richard Wetz, Lindsey Tiller, Leonard Pelletier, Eddie Mares and Jin - wook Jang

Tgon 800

Abstract: heat sink heat sink to220
Contextual Info: E Series Heatsinks For TO-220 devices 0.138" 3.50mm +.20/-.10 ø0.098" (2.50mm) 1.00" (25.40mm) 0.437" (11.10mm ±.30) 0.055" (1.40mm) 0.689" (17.50mm ±.15) 0.370" (9.40mm ±.20) ø0.142" (3.60mm +.10/-0) 0.630" (16.00mm ±.20) 1.378" (35.00mm ±.20) 0.50"

Contextual Info: E Series Heatsinks For TO-220 devices 0.138" 3.50mm +.20/-.10 ø0.098" (2.50mm) 1.00" (25.40mm) 0.437" (11.10mm ±.30) 0.055" (1.40mm) 0.689" (17.50mm ±.15) 0.370" (9.40mm ±.20) ø0.142" (3.60mm +.10/-0) 0.630" (16.00mm ±.20) 1.378" (35.00mm ±.20) 0.50"

heat sink

Abstract: heat sink to220
Contextual Info: E Series Heatsinks For TO-220 devices 0.138" 3.50mm +.20/-.10 ø0.098" (2.50mm) 1.00" (25.40mm) 0.437" (11.10mm ±.30) 0.055" (1.40mm) 0.689" (17.50mm ±.15) 0.370" (9.40mm ±.20) ø0.142" (3.60mm +.10/-0) 0.630" (16.00mm ±.20) 1.378" (35.00mm ±.20) 0.50"

Contextual Info: E Series Heatsinks For TO-220 devices F e a t u r es • Vertical through-hole PCB mounting • 0.142 in. diameter mounting holes 3 S E RI E S S P E CI F ICATI O N S For Ohmite Surface Heatsink Package Resistor Area Part Number Type Series (in2) Weight EV-T220-38E

EA-T220-38E

Abstract: heat sink for TO220 heat sink to220 Tgon 800 EV-T220-51E SIL-PAD 600 equivalent to220 heat sink E38 C
Contextual Info: E Series Heatsinks For TO-220 devices 0.138" 3.50mm +.20/-.10 ø0.098" (2.50mm) 1.00" (25.40mm) 0.437" (11.10mm ±.30) 0.055" (1.40mm) 0.689" (17.50mm ±.15) 0.370" (9.40mm ±.20) ø0.142" (3.60mm +.10/-0) 0.630" (16.00mm ±.20) 1.378" (35.00mm ±.20) 0.50"

Contextual Info: heatsink B60/C60 Series Ohmite introduces the power C series heat sink with improved Cam N Lock spring clip Pat. Pending . This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-220, TO-247, and TO-264 devices. The built in lip is provided for mounting ease. The optional B

SIL-PAD to-247

Abstract: ASTM-A228 SIL-PAD 1000 TO 247 SIL-PAD density Tgon 800 A228 A366 MV102
Contextual Info: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type

Heatsinks

Contextual Info: VM Series Variable Mount Heatsink Series Ohmite introduces this new versatile heatsink design. This new design can accommodate several different industry packages. This design also lets the customer choose a mounting style using screws or clips for secure mounting to the heatsink. These one

Contextual Info: E Series Heatsinks For TO-220 devices 0.138" 3.50mm +.20/-.10 ø0.098" (2.50mm) 1.00" (25.40mm) 0.437" (11.10mm ±.30) 0.055" (1.40mm) 0.689" (17.50mm ±.15) ø0.142" (3.60mm +.10/-0) NOTICE: Dimensional change. Dimensions shown are for products produced

Heatsinks to-220

Abstract: A366 A228 thermal resistance case heat sink heat sink Tgon 800 SIL-PAD to-247 SIL-PAD density
Contextual Info: C Series Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-247 packages (TO-220 and TO-264 available). This powerful heat sink provides tool and

Contextual Info: P B t i GEC plessey PRELIMINARY INFORMATION DS3748-2.2 June 1993 JMA31750 HIGH PERFORMANCE MIL-STD-1750 MICROPROCESSOR The G EC P le s s e y M A 31 750 is a s in g le -c h ip microprocessor that implements the full MIL-STD-1750A instruction set architecture, or Option 2 of Draft MIL-STD1750B. The processor executes all mandatory instructions and

Contextual Info: HEATSINK For TO-220, TO-247, and TO-264 F E AT U R E S Ohmite’s R2 Series patent pending heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the

Contextual Info: heatsink C40 Heat Sink System The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole

Contextual Info: HEATSINK For TO-220, TO-247, and TO-264 F E AT U R E S Ohmite’s R2 Series patent pending heatsink provides a large surface area along with our C Series clipping mechanism to attach to a TO-220, TO-247, or TO-264 package. The self-aligning features of the

MA31750 processor architecture

Abstract: MA31750 a006 MA31751 MAS281 N4211 1750A processor architecture
Contextual Info: MA31750 MA31750 High Performance MIL-STD-1750 Microprocessor Replaces January 2000 version, DS3748-8.0 DS3748-8.1 July 2002 The Dynex Semiconductor MA31750 is a single-chip microprocessor that implements the full MIL-STD-1750A instruction set architecture, or Option 2 of Draft MIL-STD1750B. The processor executes all mandatory instructions and

Contextual Info: C40 Heat Sink System For TO-247, TO-264 and SOT-227 Packages The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development)

Contextual Info: B60/C60 Series Heat Sink System Ohmite introduces the power C series heat sink with improved Cam N Lock spring clip Pat. Pending . This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-220, TO-247, and

M Series Heatsink

Abstract: Heatsinks
Contextual Info: M Series Heatsinks Heatsink with clips for TO-264 and TO-247 F e at u r e s Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest

MA31750 processor architecture

Abstract: nte 4006 MA31750 CMOS 4002 l7 723 M/A MIL-STD-1750B mil-std-1750a ttl nim a006 GNDA15
Contextual Info: MA31750 MA31750 High Performance MIL-STD-1750 Microprocessor Replaces July 1999 version, DS3748-7.0 DS3748-8.0 January 2000 The Dynex Semiconductor MA31750 is a single-chip microprocessor that implements the full MIL-STD-1750A instruction set architecture, or Option 2 of Draft MIL-STD1750B. The processor executes all mandatory instructions and